TRD Status Report

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TRD Status Report
AMS TIM CERN, 24-Apr-2006
Octagon Integration T. Siedenburg 20min DAQ
Electronics F. Hauler 10min Gas System
Electronics B. Borgia 20min
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Aachen TRD Status Report

• Th. Siedenburg
• AMS TIM
• CERN, 24-Apr-2006

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TRD Octagon Integration (Th.Kirn)
21-APR-2006
I. Özen
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TRD Octagon Integration
21-APR-2006
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TRD Octagon Integration

• All DALLAS temperature sensors tested
• All 82 flight frontend boards installed (UFE)
• HV ground connections installed
• UFE function tests in progress
• Gas-tower interconnection tubes installedTower
  to tower finished next week
• Gas-group cosmic tests in preparation

• TRD upper plate Installation of inserts
• STA M-Structure machined within specs.Test
  mounting in preparation
• TRD Rosengitter in preparationGastubing / Dallas
  UFE cabeling

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TRD Longterm Test
2 Years
Gastightnessunchanged Gasgainstable
J. Hattenbach
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Final Report on TRD Front End ElectronicsUFE
(Flight Modules)Ch.H. Chung
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358 VA Chips Tests Select 202 Chips
101 Production of 4 Types PCB
Series of Space Qualification Tests
Functional Tests
TVT ? 3D Vibration ? Coating ? TVT
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2nd TVT Same as 1st TVT condition
Conformal Coating
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(No Transcript)
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Pedestal RMS
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50 oC
-20 oC
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(No Transcript)
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ALL 101 produced UFEs within specificationsSelect
better UFEs as flight modules
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TRD-UFE (FM) Pedestal Distribution 10 of
full range
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TRD-UFE (FM) Noise RMS Spread 4
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TRD-UFE (FM) Gain RMS Spread 3
25oC
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UFE(FM) Production Finished (Jul. 2005)
Total 101 UFEs (FM 82, FS 19)
Functional Tests Finished (20.07.05)
UFE Space Qualification Tests (Mar.05 Mar. 06)
1st Thermal Vacuum Test 101 (Done w/o
failure) Random Vibration Test 101
(Done w/o failure) Conformal Coating
101 (Done w/o failure) 2nd Thermal Vacuum
Test 101 (Done w/o failure) ? Best 82 FM
selected (Mar. 2006)
UFE Integration Finished (Apr. 2006)
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TRD Gas Manifolds

• Distribute TRD gasflow into 41 segments
• Measure gastightness of individual segments
• Allow isolation of a segment when leaky
• Introduce no additional risk of gas leakage

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Manifolds mounted on Octagon
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OctagonTemperature Swing
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R,P,Y hottest
OHB TRD Thermal Report 240 days (4 b
periods) eMLI 0.03 Average TRD
Temperaturebetween 35oC and -20oC Depending on
ISS R, P, Y
0
R,P,Y coldest
-20
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Manifold / Flipper Valve Schematics
FVb
FVa
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Improve Manifold Leaktightness
FVb
FVa
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New Manifold Prototype
? Dry mounting of all components? Full function
test? Potting when ok
Alu. Body
Viton Seal
Alu. Cover
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New Manifold Design
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New Manifold Design
Fits inside existing magnetic shielding
Gas connectionswith double-o-ringfront access
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Cold Case Flipper-Valve Operation
Leakage to outside if switched below -8oC
No switching below -15oC
Buerkert 6124
Flipper-Valve Temperature
TVT Tank Vacuum
Viton Bag
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Manifold operation heated switching
Switching in TVT at -25oC ok if valve heated
to 0oC Heating of fully potted 2FV manifold 2 x
2W x 30 min. Gastightness through valves and to
outside ok Heater powerline control (8H8C 40W
each) TBD
SMD 100W
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TRD Integration Schedule
Octagon Integration finished in May
06Rosengitter tubing cabeling Jun - Sep
06Manifold design production Apr - Oct
06Box-S/C EM -gt QM upgrade Apr - Jul
06UG QM Electronics Prod. Test Apr - Oct
06Box-S/C FM Prod. Test Apr - Dec
06TRD Cosmics EM UGcrate _at_ RWTH Nov - Dec
06TRD Cosmics QM UGcrate TBD Jan - Mar
07UG FM Electronics Prod. Test Oct 06 - May
07
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TRD Integration Schedule I
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TRD Integration Schedule II
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TRD Integration Schedule III