Universidade Federal do Rio Grande do Sul

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• Universidade Federal do Rio Grande do Sul
• Engenharia Elétrica
• Circuitos Eletrônicos Integrados ENG04061

Testes de Circuitos Eletrônicos Integrados
Stevan Silveira Leandro Prytula Argus Luconi
Rosenhaim
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Amkor Technology, Inc.

• Site www.amkor.com
• Criação 1968
• Mercado Worldwide
• Empregados 400 em Chandler, gt22k worldwide
• Localização
• Matriz Chandler AZ USA Headquarters
• Filiais China, Japão, Coréia, Filipinas,
  Singapura e Taiwan.
• Expansão Vê a necessidade de aumentar a
  capacidade de produção para atender os clientes.

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Distribuição no mundo
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Amkor Technology, Inc.

• Dados de Vendas

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Amkor Technology, Inc.
Principais clientes

• Advanced Micro Devices, Inc.
• Marvell Technology Group, Ltd.
• Altera Corporation
• Mediatek, Inc.
• Analog Devices, Inc.
• NEC Corporation
• Atheros Communication, Inc.
• NXP Semiconductors
• Atmel Corporation
• RF Micro Devices, Inc.
• Avago Technologies, Pte
• Samsung Electronics Corporation, Ltd.
• Broadcom Corporation

• Sony Semiconductor Corporation
• Conexant Systems, Inc.
• ST Microelectronics, N.V.
• Freescale Semiconductor, Inc.
• Texas Instruments, Inc.
• IBM
• Toshiba Corporation
• Infineon Technologies
• AG Qualcomm Incorporated
• Intel Corporation
• Xilinx, Inc.
• LSI Corporation

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Amkor Technology, Inc.

• Serviços
• 1. Testes de desenvolvimento Abrange o
  desenvolvimento de programas de teste,
  administração de projetos, caracterização,
  prototipação.
• 2. Wafer Probe Abrange a inspeção visual e teste
  elétrico do wafer contra defeitos antes do
  encapsulamento.
• 3.Testes Finais Processo de ensaio de cada
  aparelho/circuito depois de ter sido encapsulado.
  Esse teste analisa os atributos de cada
  dispositivo e determina se ele atende aos
  critérios estabelecidos pelo cliente
• Os testes incluem circuitos digitais, lineares,
  sinais mistos, memórias, rádio frequência
  (especialidade da empresa) e integrações dessas
  tecnologias.

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Amkor Technology, Inc.

• Testes de desenvolvimento

• Project management process(s)
• Rapid first article development
• Advanced wafer probe
• Low cost RF probe
• Hardware (contactor, load board, probe card,
  handler kits)
• Robust contacting solutions aligned with Amkor's
  bump and package roadmap
• Novel test solution for low cost, bottom PoP
  (Package-on-Package)
• SiP module test strategies (including in-line
  test)
• Automation of system level test solutions
• Program conversion
• Multi-site test
• Strip test for punch and saw devices (low mix /
  high volume)

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Amkor Technology, Inc.

• Wafer Probe

• High volume production test for 300mm, 200mm and
  150mm wafers
• Full temperature range (-55oC to 150oC)
• Thin wafer handling capabilities (lt150um)
• RF probe capabalities
• DPS (Die processing services)
• Clean room environment
• Multi-site probe
• Probe card repair capabilities
• Bake retention
• Bumped wafer probe

• Electronic Assembly Support
• Die attach wafer mapping (ALPS)
• Edge dies exclusion 
• Wafer map template generation
• Inkless probe
• Probe wafer mapping

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Amkor Technology, Inc.

• Testes finais

• High volume production final test
• Full temperature testing capabilities
• Yield and capacity analysis
• Highly skilled factory test engineering support
• Wide range of test and handling equipment
• Custom test processing - Commercial / Military
  flows and mark after tests
• High volume strip test

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Amkor Technology, Inc.

• Equipamentos de teste

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Amkor Technology, Inc.

• Testes completos

• Comunicação
• GPS, DVB-H, T-DMB, ISDBT receivers, demods, base
  bands, SiP, SCSP
• Dual sided PoP ( package on package ) contactors,
  2G / 3G baseband
• Advanced media processor SoC(s)
• Quadsite celluar Tx front end SiP modules
• GPS receiver and baseband
• BlueTooth SoC radio RF probe WLCSP die sales
• Multiple die / system in package solutions for
  OEM(s)
• Cellular power amplifier transceiver modules,
  SiP, HEDGE
• LNA , Video Amplifiers Drivers
• Noise cancellation

• Consumidores
• Biometric sensors, MEMS, Quad site fingerprint
  sensor
• x16 Power FET Op Amp solutions
• MOSFET strip test
• x32 Memory Card solutions
• LVDS timing controller  LCD/PDP display
• Image stabilizer processors, digital still
  camera (DSC)
• USB2.0  / MP3 processor
• Hard disc controller
• Microcontrollers
• Compass IC

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Wafer Inspection Services, Inc.

• Site www.waferinspectionservices.com
• Local Orleans MA - USA
• Criação 1986
• Mercado Worldwide
• Empregados lt 50

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Wafer Inspection Services, Inc.

• Serviços

• Audits
• Installations
• Deinstallations
• Operator Training
• Applications Training
• Technical Support
• Preventive Maintenance
• Maintenance Training
• Per Call Service
• Full time On Site Service

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Wafer Inspection Services, Inc.

• Serviços

• NIST Calibration Wafers (PSLs)
• NIST Thin Films Calibration Wafers
• JDSU New Lasers
• SP2 remanufactured lasers
• Replacement Lamps
• Robotics service / repair
• PRI/Equipe, Ludl, Kensington

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Maxtek Components Corp.

• Site www.maxtek.com
• Local Beaverton, OR USA
• Criação 1970, juntamente com a Tektronix

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Maxtek Components Corp.

• Serviços

• Package Design Ensuring Your Product's Success
• Test Services Verifying Your Component
  Performance
• Manufacturing US-based Assembly of Your
  Components
• Reliability Failure Analysis Identifying and
  Eliminating Potential Failures
• Project Management From Design to Finished
  Component

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BridgePoint Technical Manufacturing

• Site www.bridgept.com - em contrução
• Local Austin, TX - USA

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BridgePoint Technical Manufacturing

• Serviços

• Test Development
• Product Engineering
• Probe/Final Manufacturing Test
• Burn-in
• Custom device programming, Inventory
• Electronic Assembly
• Product Analysis