Title: Bez nadpisu
1Sliding Mechanism in Copper Grain
Boudaries Effect of vacancy
Peter Ballo
Department of Physics Faculty of Electrical
Engineering and Information Technology Slovak
University of Technology, Ilkovicova 3,812 19
Bratislava Slovak Republic e-mail
ballo_at_elf.stuba.sk
2GB
3Relaxed geometry of the 160-atom supercell
for the S5 tilt grain boundary in copper
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7Evolution of the atomic structure of the pure
grain boundary during the sliding
process using SA simulation.
8The variation of the relative grain boundary
energy during sliding as a function of the
sliding distance
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10Vacancy formation energy as a function of the
layer number from the interface.
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13Relaxed geometry of the 160-atom supercell
for the S5 tilt grain boundary in copper
14Charge density distribution for GB in aluminum
(a) and copper (b) computed by LDA approximation
right panel The left panel shows the grain
boundary atomic structure.
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16Thats all folks