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Fermilab Capabilities: RF Engineering

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1 Research Devices Flip-Chip Bonder. 1 K&S Deep-Access Bonding Machine ... Dark Energy Survey CCD Camera assembly. JDEM CCD Camera assembly. Silicon Module ... – PowerPoint PPT presentation

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Title: Fermilab Capabilities: RF Engineering


1
Fermilab Capabilities RF Engineering
  • Notes from discussion with Dave McGinnis of
    Fermilab Accelerator Division
  • Team 2-3 scientists / 2-3 engineers / 2-3
    technicians
  • Microwave Experience
  • Octave Bandwidth systems up to 10 GHz
  • Hybrid microwave circuits
  • Test equipment up to 40 GHz (up to 26 GHz
    mostly)
  • Circuit design and simulation
  • Design tools
  • Ansoft-HFSS microwave EM simulations
  • ADS-Agilent microwave circuit design
  • Example topics
  • Matching networks power or noise matching over
    wide bandwidth
  • Polarization cross-talk
  • Integral system analysis of noise temperature
  • How to test at 90 GHz?
  • Expected Workload
  • Project X Accelerator Upgrade
  • High-Intensity Neutrino Source

2
  • Tools
  • 3 KS 8090 Wedge Bonding Machines
  • 1 Research Devices Flip-Chip Bonder
  • 1 KS Deep-Access Bonding Machine
  • Disco DAD320 Wafer Dicing Saw
  • Several (Warm) Probe Stations (old vintage)
  • and Optical Inspection stations
  • Several Coordinate Measuring Machines
  • gt10,000 sqft clean room space exceeding
  • class 10,000
  • 3000 sqft clean room space exceeding

Fermilab Capabilities Microdetector Assembly
CMS Forward Silicon Pixel Detector
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