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IC Transistors and Resistors

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Figure 1 A p type region in an n type tub forms the resistor. ... Power dissipation eventually allows parasitic bipolar to turn on, killing device ... – PowerPoint PPT presentation

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Title: IC Transistors and Resistors


1
IC Transistors and Resistors
  1. Resistors
  2. Bipolar Transistors
  3. MOS
  4. DMOS

Chris Kendrick Jan. 29, 2003 BiCMOS Design
2
Resistor Voltage Coefficient
Figure 1 A p type region in an n type tub forms
the resistor.
http//adev.onsemi.com/knowledge_net/index.html
3
Resistor Voltage Coefficient
4
Resistor Temperature Coefficient
5
Resistor Voltage limits
  • The maximum resistor voltage is NOT defined by
    the tub its sitting in!

Diffusion Breakdown (V)
Buried Layer Isolation 95
PWell Epi 95
PHV Epi 60
NHV - PWell 43
PSD - Epi 30
NSD - PWell 17.5
NSD PHV 12
NSD PSD (in PWell) 5.8
  • The voltage rating of the tub determines the
    spacing of PHV to Epi

6
Lateral PNP Saturation
http//adev.onsemi.com/knowledge_net/index.html
7
Low current NPN/PNP biasing
  • Whats the lowest current bipolars can be biased
    at?

Lateral PNP
ICmin 5uA
8
Low current NPN/PNP biasing
  • Whats the lowest current bipolars can be biased
    at?

Vertical PNP
ICmin 20nA
9
Low current NPN/PNP biasing
  • Whats the lowest current bipolars can be biased
    at?

NPN
ICmin 20nA
10
MOS Safe Operating Area
  • Hot carrier injection limits NMOS operating
    voltage

11
LV NMOS Hot Carrier Injection
  • Maximum Vds determined from HCI measurements 10
    degradation in 10 yrs
  • Transient Vds rating based on 10 duty cycle

12
LV LVT PMOS drain-source leakage
  • Drain-source leakage determines maximum Vds at
    high temperature
  • Minimum channel length targeted based on process
    variation and independent SEM measurement

150C
27C
13
DMOS Specific Rdson
Rsp Rdson x transistor active area
transistor active area cells x cell area
Device Rdson (W) Area (cm2) Rsp. (mW.cm2)
LV NLDMOS 0.66 5.19E-4 0.34
MV1 NLDMOS 1.93 7.32E-4 1.41
LV PLDMOS 2.58 5.19E-4 1.34
MV PLDMOS 4.92 7.32E-4 3.6
VDMOS_HEC 1.53 1.77E-3 2.7
14
DMOS Specific Rdson
  • More components to Rdson than just channel
    resistance
  • RCH REpi RBL RMetal
  • Series resistance causes bend in ID vs. VG
    curve

15
A useful way to extract DMOS series resistance
   
(1)
(2)
Substituting (2) into (3) gives,
(3)
16
DMOS Clamped Inductive Switching
  • Clamping the flyback voltage below the DMOS
    breakdown increases energy capability.
  • Power dissipation eventually allows parasitic
    bipolar to turn on, killing device

17
Energy capability can determine device size
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