MPW stepbystep

1
MPW Design Introduction CoursePart 7

• MPW step-by-step

2
Vestfold University College (VUC)the MultiMEMS
MPW Co-ordinator
The steps
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MultiMEMS MPW Service NDA

• A signed Institutional Non-Disclosure Agreement
  is required to receive the MPW Design Handbook.
• NDAs to sign are received from VUC (paper or pdf
  file downloadable from www.multimems.no)
• After VUC has received a signed copy of the NDA
  the Handbook is sent to you.

4
Processing Schedule

• Approximately one run will be scheduled each
  second month
• MultiMEMS reserves the right to cancel a run at
  any time
• Check www.multimems.com for the latest update

5
Booking/Site purchase

• The disk enclosed with the Design Handbook
  contains a pdf file with the booking form.
• To reserve a site on a MPW run the booking form
  has to be filled out and sent to VUC.
• The customer will be invoiced by VUC.
• For price information, please contact VUC at
  multimems_at_hive.no
• Prices for next MPW run
• Normal users 7500 Euros
• Universities 1000 Euros

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Design check/DRC Redesign/Corrections
2) Submit GDS II file
3) DRC (emphasis on process critical mistakes) OK?
1) Design
4) Requested Corrections
NO
5) Redesign and Corrections
YES
NO
6) Submit changed GDS II file
7) New DRC OK?
YES
9) Masks
8) Mask Assembly and order
10) Processing
13) Chips to customer
12) Inspection and shipment
11) Processed wafers
14) Chips received
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Mask assembly

• The designs for the different projects are put
  together in one L-Edit file
• Must be in GDS II format
• Files containing GDS II layers besides them in
  the template files will be returned to the
  designer
• Cells with the same name as cells in the template
  file will be assumed identical to the cells in
  the template file
• After a final design check VUC orders the mask
  set that is delivered to SensoNor for processing

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Design submission

• Designers check list
• Basics
• Have you checked that.
• you have used the most resent version of
• templates?
• design rules?
• Bulk Etch Calculator
• DRC?
• all the layout rules are fulfilled? Run the DRC
  if possible.
• the absolute design limitations are adhered to?
  Use mechanical simulation tools, preferably a FEM
  based tool!
• Remember the steps immediately before and after
  the release etch!
• Have you documented it properly for us to check
  it?

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Design submission

• Designers check list
• Chip level Have you checked that.
• there is no thin membrane with a buried conductor
  placed beneath anywhere?
• no isolated p area will exist during the bulk
  silicon etch?
• the feature area of the RETCH mask is not larger
  than 30 of the total die are?
• you have planned no release etch in areas of n
  depth over 6 µm?
• anodic bonding areas are sufficient for hermetic
  silicon-glass seal?
• all tolerances are taken into account in your
  modelling

10
Design submission

• Designers check list
• CAD file and documents Have you checked that.
• the database uses a 0.5 µm grid??
• all vertices of polygons have x and y
  co-ordinates that are integer multiples of the
  grid size?
• all layers that are not in the MultiMEMS template
  are removed?
• you have not changed any parameters in the
  technology set-up and then forgotten to change
  them back to the proper values found in the
  template?
• all cells different from the cells in the
  template have unique names?
• all cells are actually used in the current
  hierarchy?
• you have saved your design as a GDS II file, with
  all MultiMEMS layers open?
• it is the last version of your design that you
  actually submit?

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Design submission

• Enclose with your submission
• The GDS II file
• A document shortly describing the function of the
  design should be enclosed to make faultfinding
  easier
• Documentation showing the fulfilment of the
  absolute design limitations for all potentially
  critical structures must be enclosed

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Design submission

• Ways to submit the GDS II file
• Email
• In most cases VUC will prefer the file as
  attachment to an e-mail. Use the address
  multimems_at_hive.no Remember to to get confirmation
  that the file has been duly received, as
  e-mailing can sometimes be unreliable due to
  Internet unreliability.
• CD, disc or Zip drive
• In case submission using internet is not
  acceptable, the CAD layout may be sent using a
  CD, disc or Zip drivePostal address Vestfold
  University College P.O.Box 2243, N-3103
  Tønsberg, Norway
• Other alternatives
• If none of the alternatives above can be used,
  please contact VUC. (Per Ohlckers on 47 3303
  7718 or Faculty telephone [phone])

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- Final Control and Shipment

• After the wafers have been processed by SensoNor
  they are sent to VUC for
• Final Control
• A visual inspection of all chips delivered to
  customers
• Shipment
• Additional testing possible after agreement
  between VUC and the customer (not included in the
  MPW price)

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Ch 7 MPW step-by-step

• End of this chapter
• Questions or comments?