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Herv

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Modularity: ladders with 4,5or 6 sensors. 4 Quadrants ... including the construction of a long ladder prototype with variable length ... – PowerPoint PPT presentation

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Title: Herv


1
Electronics of the Silicon Envelope
  • Hervé Lebbolo, François Rossel , Aurore
    Savoy-Navarro
  • LPNHE-Universités de Paris 67
  • TOPICS
  • Main parameters of the Si-Envelope
  • Front-End Issues
  • Long shaping time
  • Proposed F.E schema
  • Digitization on detector F.E
  • DAQ Trigger very preliminary ideas

Intermediate Meeting on Readout DAQ for the
Linear Collider Meeting
CERN, February 6th 2003
2
The Si-Envelope componentsdue to their location
the functions of each piece of the Si-envelope
may (slightly) differ
Si-FCH
SET
SIT
FTD
3
As in AMS Si-tracker, we propose to build long
ladders made of N sensors bonded to each other
F.E. electronics
connector
4
The Si-envelope components in a few numbers
Si-envelope Component Items Total Number
Si-FCH (XUV) Nb of layers Nb of ladders , 4 sensors Nb of ladders, 5 sensors Nb of ladders, 6 sensors Nb of RO channels/endcap Power dissipation 4 XU 2 VV 192 480 288 983,000 393 Watts
SET Nb of layers Nb of ladders Nb of RO channels Power dissipation 2 1-sided 1 2-sided 4480 2,293,760 920 Watts
SIT Nb of layers Nb of ladders Nb of RO channels Power dissipation 2 2-sided 38 94 132 270,336 110 Watts
5
Proposed Si-FCH DESIGN
4 XUV made of 6 2-sided sensors 4 XU 2 VV
XUVVUXXUVVUX
Modularity ladders with 4,5or 6 sensors 4
Quadrants
6
The Front-End Electronics issues
Starting point the AMS electronics R.O.
System Proposed Front-End design the
basics The Long shaping time Digitization on
the detector F.E. ?
7
Starting point the AMS Si-tracker Readout system
(With particular thanks to G. Ambrosi, Ph.
Azzarello, W.Lusterman and the ETH-Zurich,
Geneva U. Peruggia U. AMS teams for their
support)
Tracker Front-End
Tracker Data Reduction
12 bit low power A/D (CLC949), as need large
dynamic range /- 100 MIPs dig. _at_ 5
MHz A/D coupled to DSP via FPGA (Xilinx
XC4013) buffer for up to 3 evts sequencer for
FE timing signals and synchro data
transfer. 16 bits-DSP _at_30MHz for calib and data
compression
Input Capa 33 72 pF VA_hdr/AMS64 64
charge ampli CR-RC shaper SH 64 ch
connected to voltage-current output buffer by
analog mux? seq. RO_at_ up 10 MHz Measured
ENC (3504/pFxC) electrons at 6 µsec peaking
time
8
AMS2 new improved Readout system
By courtesy of G. Ambrosini
New Front End New hybrid VA_hdr9a,
0.8µ Internally generated biases, internal calib
capa Nominal gain 1.4 µA/fC Nominal peaking time
6 µsec ENC(300 Cdet x 5/pF)e- ? Good gain
stability small pedestal spread
  • New readout scheme
  • Simplified and HCC
  • (Hybrid Control Circuit)
  • Minimize digital cable line
  • Control daisy chain of VA
  • Increase system reliability
  • Follows space rules

9
Long ladder prototype
Lab test bench _at_LPNHE-Paris
Currently building a 7-sensor ladder with AMS
technique (i.e. using AMS sensors) and bonding
them together thus variable length for test
L N x 30 cm long This long ladder
will be ready by Feb 20th equipped with FE
electronics à la AMS (VA Preampli) or direct
access at the µcrostrip
output. Also starting simulation studies on
new FERO possible designs (Ongoing similar
studies at UC Santa Cruz, on a 2 m
long ladder)
Sensors 70.0x40.1 mm2 300 µm depth 110µm/208µm
RO pitch p(junction side) n(ohmic side)
10
Proposed F.E. Readout chain very preliminary
ideas
512 channels/ladder
2560 channels/drawer
A/D0.35µtechno, 8 bits 1MHz clock, 1.2mW
11
What infos do we need from the Si-tracker?
1) Detector occupancy? Will be different
according to the detector location
SET preliminary studies ? occupancy ? 1
SIT, FTD or Si-FCH should have higher
occupancies (higher
backgrounds) ? SPARSIFICATION on
detector F.E. ? 2) Double Multiple hit rates ?
Thus ambiguities must be estimated 3) Pulseheight
info (Q) needed? Yes if cluster centroid
(? 8 bit A/D ?) 4) Timing information ? R.O both
ends of the long ladder? 5) Pedestal substraction
on board? 6) DSP-like processing for eventual
cluster algorithm and eventual fastrack
processing algorithm at what level in the
electronic chain ??? 7) Power dissipation
studies preliminary results ? dont seem to be a
major issue (more
detailed ongoing studies) All these issues must
be studied with electronics and physics /or
detector performance simulations and tests on the
test bench (just starting . . .)
12
Output of the signals very preliminary proposal
13
DAQ intermediate trigger very preliminary
ideas
Based on the current experience with the trigger
system related to the tracking system in CDF, we
are foreseeing to study a Fastrack
trigger (or realtime processing) system that
could be used to 1) Do a fast clustering
and determine in realtime the cluster centroid
2) Do a fast tracking for stiff tracks (above 1
or 1.5 GeV/c momentum) with the overall
Si tracking information, i.e. starting
with the SIT SET and then linking to the
µvertex informations And
similarly in the forward region, perform a track
segment reconstruction in FTD and Si-FCH,
separately and possibly link them.
14
Concluding remarks
Our main efforts are currently focusing on
developing the Lab test bench including the
construction of a long ladder prototype with
variable length and
different possible Front-Ends The starting
scheme AMS FE and RO system Also looking for
compatibility with the general RO DAQ frame of
the LC experiment In parallel , both
electronics and physics detector performances
simulation studies are/will be undergoing for
studying new FE and RO schemes and algorithms to
eventually include in the RO chain for more
sophisticated realtime processing of data
(cluster centroid, fast tracking etc). Use of
present CDF experience and ongoing LHC
developments. More to come in the
next months (PRC submission )
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