Title: JaegerBlalock
1Chapter 7Complementary MOS (CMOS) Logic Design
- Microelectronic Circuit Design
- Richard C. JaegerTravis N. Blalock
2Chapter Goals
- Introduce CMOS logic concepts
- Explore the voltage transfer characteristics CMOS
inverters - Learn to design basic and complex logic gates
- Discuss static and dynamic power in CMOS logic
- Present expressions for dynamic performance of
CMOS logic devices - Present noise margins for CMOS logic
- Introduce dynamic logic and domino CMOS logic
techniques - Introduce design techniques for cascade buffers
- Explore layout of CMOS logic gates
- Discuss the concept of latchup
3CMOS Inverter Technology
- Complementary MOS, or CMOS, needs both PMOS and
NMOS devices for their logic gates to be realized - The concept of CMOS was introduced in 1963 by
Wanlass and Sah, but it did not become common
until the 1980s as NMOS microprocessors were
dissipating as much as 50 W and alternative
design technique was needed - CMOS still dominates digital IC design today
4CMOS Inverter Technology
- The CMOS inverter consists of a PMOS stacked on
top on a NMOS, but they need to be fabricated on
the same wafer - To accomplish this, the technique of n-well
implantation is needed as shown in the figure
which shows the cross-section of a CMOS inverter
5CMOS Inverter
- Circuit schematic for a CMOS inverter
- Simplified operation model with a high input
applied - Simplified operation model with a low input
applied
6CMOS Inverter Operation
- When vI is pulled high (VDD), the PMOS inverter
is turned off, while the NMOS is turned on
pulling the output down to VSS - When vI is pulled low (VSS), the NMOS inverter is
turned off, while the PMOS is turned on pulling
the output up to VDD
7CMOS Inverter Layout
- Two methods of laying out a CMOS inverter are
shown - The PMOS transistors lie within the n-well,
whereas the NMOS transistors lie in the
p-substrate - Polysilicon is used to form common gate
connections, and metal is used to tie the two
drains together
8Static Characteristics of the CMOS Inverter
- The figure shows the two modes of static
operation with the circuit and simplified models - Notice that VH 5V and VL 0V, and that ID 0A
which means that there is no static power
dissipation
9CMOS Voltage Transfer Characteristics
- The VTC shown is for a CMOS inverter that is
symmetrical (KP KN) - Region 1 vO VH
vI lt VTN - Region 2 vDS vGS VTP
- Region 4 vDS vGS VTN
- Region 5 vO VL vI gt
VDD VTP
10CMOS Voltage Transfer Characteristics
- The simulation result shows the varying VTC of
the inverter as VDD is changed - The minimum voltage supply for a certain MOS
technology is 2VTln(2)
11CMOS Voltage Transfer Characteristics
- The simulation result shows the varying VTC of
the inverter as KN/KP KR is changed - For KR gt 1 the NMOS current drive is greater and
it forces vI lt VDD/2 - For KR lt 1 the PMOS current drive is greater and
it forces vI gt VDD/2
12Noise Margins for the CMOS Inverter
- Noise margins are defined by the regions shown in
the given figure
13Noise Margins for the CMOS Inverter
14Propagation Delay Estimate
- The two modes of capacitive charging that
contribute to propagation delay
15Propagation Delay Estimate
- If it is assumed the inverter in symmetrical,
(W/L)P 2.5(W/L)N, then tPLH tPHL
16Rise and Fall Times
- The rise and fall times are given by the
following expressions
17Reference Inverter Example
- Design a reference inverter to achieve a delay of
250ps with a 0.1pF load given the following
information
18Reference Inverter Example
- Assuming the inverter is symmetrical and using
the values given in Table 7.1
19Reference Inverter Example
- Solving for RonN
- Then solve for the transistor ratios
20Delay of Cascaded Inverters
- An ideal step was used to derive the previous
delay equations, but this is not possible to
implement - By using putting the following circuit in SPICE,
it is possible to produce more accurate equations
21Delay of Cascaded Inverters
- The output of the previous circuit looks like the
following an it can be seen that the delay for
the nonideal step input is approximately twice
than the ideal case
22Static Power Dissipation
- CMOS logic is considered to have no static power
dissipation - Since the ROFF of the two transistors is very
large, the DC current driving a capacitive load
is zero - This is not completely accurate since MOS
transistors have leakage currents associated with
the reverse-biased drain-to-substrate connections
23Dynamic Power Dissipation
- There are two components that add to dynamic
power dissipation - Capacitive load charging at a frequency f given
by PD CVDDf - The current that occurs during switching which
can be seen in the figure
24Power-Delay Product
- The power-delay product is given as
The figure shows a symmetrical inverter switching
waveform
25CMOS NOR Gate
Reference Inverter
CMOS NOR gate implementation
26CMOS NOR Gate Sizing
- When sizing the transistors, it is ideal to keep
the delay times the same as the reference
inverter - To accomplish this, the on-resistance on the PMOS
branch of the NOR gate must be the same as the
reference inverter - For a two-input NOR gate, the (W/L)p must be made
twice as large
27CMOS NOR Gate Body Effect
- Since the bottom PMOS body contact is not
connected to its source, its threshold voltage
changes as VSB changes during switching - Once vO VH is reached, the bottom PMOS is not
affected by body effect, thus the total
on-resistance of the PMOS branch is the same - However, the rise time is slowed down due to
VTP being a function of time
28Two-Input NOR Gate Layout
29Three-Input NOR Gate Layout
- It is possible to extend this same design
technique to create multiple input NOR gates
30Shorthand Notation for NMOS and PMOS Transistors
31CMOS NAND Gates
CMOS NAND gate implementation
Reference Inverter
32CMOS NAND Gates Sizing
- The same rules apply for sizing the NAND gate as
the did for the NOR gate, except for now the NMOS
transistors are in series - The (W/L)N will be twice the size of the
reference inverters NMOS
33Multi-Input CMOS NAND Gates
34Complex CMOS Logic Gate Design Example
- Design a CMOS logic gate for (W/L)p,ref5/1 and
for (W/L)n,ref2/1 that exhibits the function Y
A BC BD - By inspection (knowing Y), the NMOS branch of the
gate can drawn as the following with the
corresponding graph, while considering the
longest path for sizing purposes
35Complex CMOS Logic Gate Design Example
- By placing nodes in the interior of each arc,
plus two more outside the graph for VDD (3) and
the complementary output (2), the PMOS branch
can be realized as shown on the left figure - Connect all of the nodes in the manner shown in
the right figure, and the NMOS arc that PMOS arc
intersects have the same inputs
36Complex CMOS Logic Gate Design Example
- From the PMOS graph, the PMOS branch can now be
drawn for the final CMOS logic gate while once
again considering the longest PMOS path for sizing
37Complex CMOS Gate with a Bridging Transistor
Design Example
- Design a CMOS gate that implements the following
logic function using the same reference inverter
sizes as the previous example Y AB CE
ADE CDB - The NMOS branch can be realized in the following
manner using bridging NMOS D to implement Y. The
corresponding NMOS graph is shown to the right.
38Complex CMOS Gate with a Bridging Transistor
Design Example
- By using the same technique as before, the PMOS
graph can now be drawn
39Complex CMOS Gate with a Bridging Transistor
Design Example
- By using the PMOS graph the PMOS branch can now
be realized as the following (considering the
longest path for sizing)
40Minimum Size Gate Design and Performance
- With CMOS technology, there is a area/delay
tradeoff that needs to be considered - If minimum feature sized are used for both
devices, then the tPLH will be decreased compared
to the symmetrical reference inverter
41Minimum Size Complex Gate and Layout
- The following shows the layout of a complex
minimum size logic gate
42Dynamic Domino CMOS Logic
- One technique to help decrease power in MOS logic
circuits is dynamic logic - Dynamic logic uses different precharge and
evaluation phases that are controlled by a system
clock to eliminate the dc current path in single
channel logic circuits - Early MOS logic required multiphase clocks to
accomplish this, but CMOS logic can be operated
dynamically with a single clock
43Dynamic Domino CMOS Logic
- The figure demonstrates the basic concept of
domino CMOS logic operation
44Simple Dynamic Domino Logic Circuit
45Dynamic Domino CMOS Logic
- It should be noted that domino CMOS circuits
only produce true logic outputs, but this problem
can be overcome by using registers that have both
true and complemented output to complete the
function shown by the following
46Cascade Buffers
- In some circuit, the logic must be able to drive
large capacitances (10 to 50pF) - By cascading an even number of increasing larger
inverters, it is possible to drive the loads
47Cascade Buffers
- The taper factor ß determines the increase of the
cascaded inverters size in manner shown of the
previous image. - where Co is the unit inverters load capacitance
- The delay of the cascaded buffer is given by the
following
Where to is the unit inverters propagation delay
48Optimum Design of Cascaded Stages
- The following expressions can aid in the design
of an optimum cascaded buffer
49The CMOS Transmission Gate
- The CMOS transmission gate (T-gate) is one
of the most useful circuits for both analog and
digital applications - It acts as a switch that can operate up to VDD
and down to VSS
50The CMOS Transmission Gate
- The main consideration that needs to be
considered is the equivalent on-resistance which
is given by the following expression
51CMOS Latchup
- There is one major downfall to the CMOS logic
gate Latchup - There are many safeguards that are done during
fabrication to suppress this, but it can still
occur under certain transient or fault conditions
52CMOS Latchup
- Latchup occurs due parasitic bipolar transistors
that exist in the basic inverter as shown below
53CMOS Latchup
- The configuration of these bipolar transistors
create a positive feedback loop, and will cause
the logic gate to latchup as shown to the left - By using heavily doped material where Rn and Rp
exist, there resistance will be lowered thereby
reducing the chance of latchup occurring
54