Title: CS/COE0447 Computer Organization
1CS/COE0447Computer Organization Assembly
Language
2Five Computer Components
3Embedded Computers
- Not directly observable
- Very widely used in many applications
- Examples
4Todays Topics
- Layered approach to computer design
- Machine code example
- Components of ISA
- Computer implementations
- Inside a PC
- IC technology and its trends
- Input/output devices
- Main memory
- Secondary storage
- Network
- IC process overview
5Layered Approach in Computer Design
Computer Architecture or Instruction Set
Architecture
6Machine Code Example
7Components of ISA
- In most cases, a programmers reference manual
(PRM) will disclose the ISA of a processor - To understand an ISA, find in PRM
- Data types the processor supports
- Supported instructions and their definitions
- Registers (general-purpose special purpose)
- Processor modes
- Exception mechanism
8Inside a PC
- Integrated Circuits (ICs)
- CPU (Central Processing Unit), companion chipset,
memory, peripheral I/O chip (e.g., USB, IDE,
IEEE1394, ) - Printed Circuit (PC) boards
- Substrate for ICs and interconnection
- Distribution of clock, power supply
- Heat dissipation
- Hard disk, CD-RW (DVD-RW), (floppy disk)
- Power supply
- Converts line AC voltage to regulated DC low
voltage levels - GND, /-12V, /-5V,
- Chassis
- Holds boards, power supply, and provides physical
interface for user and other systems - Connectors and cables
9Integrated Circuits
- Primarily crystaline silicon
- 1mm25mm on a side
- Feature size 90nm 130nm
- 100 1000M transistors
- 25 250M logic gates
- 3 10 metal conductive layers
- CMOS (Complementary Metal Oxide Semiconductor)
technology
- Package spreads chip-level signal paths to board
level - Provides heat dissipation
- Ceramic or plastic with gold wires
- 8 1000 leads
- Various form-factors and shapes
10Printed Circuit (PC) Boards
- Fiberglass or ceramic
- 1 20 conductive layers
- 1 20 inch on a side
- IC packages are mounted and soldered on a board
11Technology Trend (Processor Complexity)
2x transistors/chip every 1.5 years!
12Memory Capacity Trend (DRAM)
1.4x/year or 2x every 2 years 8000x since 1980!
13Processor Performance Trend
Intel P4 2000 MHz (Fall 2001)
14Technology Advances
- Memory
- DRAM capacity 2x / 2 years (since 96)
- 64x size improvement in last decade
- Processor
- Speed (in terms of clock frequency) 2x / 1.5
years (since 85) - 100x performance improvement in last decade
- Disk
- Capacity 2x / 1 year (since 97)
- 250x size improvement in last decade
15Your PC After Graduation
- Processor speed
- 68GHz
- Memory capacity
- 4GB8GB
- Disk capacity
- 1000GB or 1TB
- New units Mega to Giga, Giga to Tera, (Tera to
Peta, Peta to Exa, Exa to Zetta, Zetta to Yotta) - New, faster serial interfaces for various
peripherals
16My First PC (_at_college)
- IBM PC AT
- Based on 80286 (80586 is Pentium-1)
- Processor speed
- 20MHz (?) compared to 5,000MHz
- Memory capacity
- 1MB compared to 4000MB
- Disk capacity
- 40MB compared to 1000GB
- No CD-ROM!
- 14 inch monitor (not flat!), VGA (640x480)
- Wheel mouse
- 2 buttons
17Input Devices
- Accepts input from human (or from other machine)
- Desktop computers
- Keyboard
- Mouse (touchpad)
- Joystick
-
- Servers
- Terminals on network
- Cell phone Embedded computers
- Keypad
18Input Devices, contd
- Mouse
- Wheel mouse (hard to find nowadays)
- Optical mouse
- Takes 1,500 photo shots of LED reflection to
detect any movement - Keyboard or keypad
- Not many changes so far
- Web camera
- Voice recognition
- Partly successful
- New input device?
19Output Devices
- Passes information to human (or to other machine)
- Desktop computers
- Display (CRT or LCD)
- Sound
-
- Servers
- Terminals on network
- Cell phone Embedded computers
- Screen
- Sound
- Vibration
20Output Devices, contd
- Display
- CRT to LCD
- LCD size from 10 inch to 24 inch
- Resolution from 640x480 to 1600x1200
- Sound
- Simple tick to theatre-like effects, 5.1
channel, etc.
21Main memory
- PC/servers use DRAM (Dynamic RAM)
- SDRAM
- DDR SDRAM
- RDRAM (RAMBUS DRAM)
A typical SDRAM module
22Main memory, contd
- Embedded computers use DRAM or SRAM (or both)
depending on applications - On-chip SRAM (embedded SRAM)
- On-chip SDRAM (embedded SDRAM)
- SDRAM
- Mobile SDRAM (1.8V operation)
23Storage
- Secondary storage (cf. main memory)
- Non-volatile
- Stores programs, user-saved data, etc.
- In PC/server domain, magnetic disk (hard-disk) is
usually used - In embedded computers, flash memory or ROM is
usually employed
24Storage, contd
25Storage, contd
26Computer Networks
- Local Area Network (LAN)
- Within limited distance (e.g., in a building)
- Mostly based on Ethernet
- 10Mbps, 100Mbps, 1Gbps, 10Gbps,
- Wide Area Network
- Connecting networks far apart
- At home,
- Modem 14.4Kbps, 28.8Kbps, 33.6Kbps, 56Kbps
- Cable modem/DSL several hundred Kbps several
Mbps - Higher-speed DSL technologies
- Proliferation of wireless LAN (IEEE802.11)
- 1 100Mbps
27(Simple) IC Process Overview
- Silicon ingot (silicon cylinder)
- (Blank) Wafers
- Various steps to build circuits on wafers
- Photomask process
- Chemical process
- Mechanical process
- Wafer test to sort out bad parts
- Tested die
- Packaging steps
- Wire bonding
- Material filling
- Marking
- Chip test to sort out bad parts
- Products
28Testing Your Chip
- Function
- The chip is working correctly as intended
- Speed
- The chip is running at 4 GHz as intended
- Speed binning
- Power
- The chip consumes 50 Watt at 4 GHz as intended
- Reliability
- The chip will be operational for 10 years as
written on manual and box
29Calculating Your Chip Cost
- Things to consider
- Mask cost we need 20 40 masks used to form
different patterns used in different process
steps a.k.a. Non-Recurring Engineering (NRE) cost - Wafer cost
- Cost put in process steps
- Defect parts (we spend money producing defect
parts!) - Any other overhead including marketing
- Can we calculate cost of each chip now?
- What happens if we adopt a new technology that
can build smaller transistors?
30(Simple) IC Process Overview
- Silicon ingot (silicon cylinder)
- (Blank) Wafers
- Various steps to build circuits on wafers
- Photomask process
- Chemical process
- Mechanical process
- Wafer test to sort out bad parts
- Tested die
- Packaging steps
- Wire bonding
- Material filling
- Marking
- Chip test to sort out bad parts
- Products
31Testing Your Chip
- Function
- The chip is working correctly as intended
- Speed
- The chip is running at 4 GHz as intended
- Speed binning
- Power
- The chip consumes 50 Watt at 4 GHz as intended
- Reliability
- The chip will be operational for 10 years as
written on manual and box
32Calculating Your Chip Cost
- Things to consider
- Mask cost we need 20 40 masks used to form
different patterns used in different process
steps a.k.a. Non-Recurring Engineering (NRE) cost - Wafer cost
- Cost put in process steps
- Defect parts (we spend money producing chips with
defects!) - Any other overhead including marketing
- Can we calculate cost of each chip now?
- What happens if we adopt a new technology that
can build smaller transistors?
33Packaging
mounting
wire bonding
packaging material filling marking
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