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CS/COE0447 Computer Organization

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Title: CS/COE0447 Computer Organization


1
CS/COE0447Computer Organization Assembly
Language
  • CHAPTER 1 Part 1

2
Five Computer Components
3
Embedded Computers
  • Not directly observable
  • Very widely used in many applications
  • Examples

4
Todays Topics
  • Layered approach to computer design
  • Machine code example
  • Components of ISA
  • Computer implementations
  • Inside a PC
  • IC technology and its trends
  • Input/output devices
  • Main memory
  • Secondary storage
  • Network
  • IC process overview

5
Layered Approach in Computer Design
Computer Architecture or Instruction Set
Architecture
6
Machine Code Example
7
Components of ISA
  • In most cases, a programmers reference manual
    (PRM) will disclose the ISA of a processor
  • To understand an ISA, find in PRM
  • Data types the processor supports
  • Supported instructions and their definitions
  • Registers (general-purpose special purpose)
  • Processor modes
  • Exception mechanism

8
Inside a PC
  • Integrated Circuits (ICs)
  • CPU (Central Processing Unit), companion chipset,
    memory, peripheral I/O chip (e.g., USB, IDE,
    IEEE1394, )
  • Printed Circuit (PC) boards
  • Substrate for ICs and interconnection
  • Distribution of clock, power supply
  • Heat dissipation
  • Hard disk, CD-RW (DVD-RW), (floppy disk)
  • Power supply
  • Converts line AC voltage to regulated DC low
    voltage levels
  • GND, /-12V, /-5V,
  • Chassis
  • Holds boards, power supply, and provides physical
    interface for user and other systems
  • Connectors and cables

9
Integrated Circuits
  • Primarily crystaline silicon
  • 1mm25mm on a side
  • Feature size 90nm 130nm
  • 100 1000M transistors
  • 25 250M logic gates
  • 3 10 metal conductive layers
  • CMOS (Complementary Metal Oxide Semiconductor)
    technology
  • Package spreads chip-level signal paths to board
    level
  • Provides heat dissipation
  • Ceramic or plastic with gold wires
  • 8 1000 leads
  • Various form-factors and shapes

10
Printed Circuit (PC) Boards
  • Fiberglass or ceramic
  • 1 20 conductive layers
  • 1 20 inch on a side
  • IC packages are mounted and soldered on a board

11
Technology Trend (Processor Complexity)
2x transistors/chip every 1.5 years!
12
Memory Capacity Trend (DRAM)
1.4x/year or 2x every 2 years 8000x since 1980!
13
Processor Performance Trend
Intel P4 2000 MHz (Fall 2001)
14
Technology Advances
  • Memory
  • DRAM capacity 2x / 2 years (since 96)
  • 64x size improvement in last decade
  • Processor
  • Speed (in terms of clock frequency) 2x / 1.5
    years (since 85)
  • 100x performance improvement in last decade
  • Disk
  • Capacity 2x / 1 year (since 97)
  • 250x size improvement in last decade

15
Your PC After Graduation
  • Processor speed
  • 68GHz
  • Memory capacity
  • 4GB8GB
  • Disk capacity
  • 1000GB or 1TB
  • New units Mega to Giga, Giga to Tera, (Tera to
    Peta, Peta to Exa, Exa to Zetta, Zetta to Yotta)
  • New, faster serial interfaces for various
    peripherals

16
My First PC (_at_college)
  • IBM PC AT
  • Based on 80286 (80586 is Pentium-1)
  • Processor speed
  • 20MHz (?) compared to 5,000MHz
  • Memory capacity
  • 1MB compared to 4000MB
  • Disk capacity
  • 40MB compared to 1000GB
  • No CD-ROM!
  • 14 inch monitor (not flat!), VGA (640x480)
  • Wheel mouse
  • 2 buttons

17
Input Devices
  • Accepts input from human (or from other machine)
  • Desktop computers
  • Keyboard
  • Mouse (touchpad)
  • Joystick
  • Servers
  • Terminals on network
  • Cell phone Embedded computers
  • Keypad

18
Input Devices, contd
  • Mouse
  • Wheel mouse (hard to find nowadays)
  • Optical mouse
  • Takes 1,500 photo shots of LED reflection to
    detect any movement
  • Keyboard or keypad
  • Not many changes so far
  • Web camera
  • Voice recognition
  • Partly successful
  • New input device?

19
Output Devices
  • Passes information to human (or to other machine)
  • Desktop computers
  • Display (CRT or LCD)
  • Sound
  • Servers
  • Terminals on network
  • Cell phone Embedded computers
  • Screen
  • Sound
  • Vibration

20
Output Devices, contd
  • Display
  • CRT to LCD
  • LCD size from 10 inch to 24 inch
  • Resolution from 640x480 to 1600x1200
  • Sound
  • Simple tick to theatre-like effects, 5.1
    channel, etc.

21
Main memory
  • PC/servers use DRAM (Dynamic RAM)
  • SDRAM
  • DDR SDRAM
  • RDRAM (RAMBUS DRAM)

A typical SDRAM module
22
Main memory, contd
  • Embedded computers use DRAM or SRAM (or both)
    depending on applications
  • On-chip SRAM (embedded SRAM)
  • On-chip SDRAM (embedded SDRAM)
  • SDRAM
  • Mobile SDRAM (1.8V operation)

23
Storage
  • Secondary storage (cf. main memory)
  • Non-volatile
  • Stores programs, user-saved data, etc.
  • In PC/server domain, magnetic disk (hard-disk) is
    usually used
  • In embedded computers, flash memory or ROM is
    usually employed

24
Storage, contd
25
Storage, contd
26
Computer Networks
  • Local Area Network (LAN)
  • Within limited distance (e.g., in a building)
  • Mostly based on Ethernet
  • 10Mbps, 100Mbps, 1Gbps, 10Gbps,
  • Wide Area Network
  • Connecting networks far apart
  • At home,
  • Modem 14.4Kbps, 28.8Kbps, 33.6Kbps, 56Kbps
  • Cable modem/DSL several hundred Kbps several
    Mbps
  • Higher-speed DSL technologies
  • Proliferation of wireless LAN (IEEE802.11)
  • 1 100Mbps

27
(Simple) IC Process Overview
  • Silicon ingot (silicon cylinder)
  • (Blank) Wafers
  • Various steps to build circuits on wafers
  • Photomask process
  • Chemical process
  • Mechanical process
  • Wafer test to sort out bad parts
  • Tested die
  • Packaging steps
  • Wire bonding
  • Material filling
  • Marking
  • Chip test to sort out bad parts
  • Products

28
Testing Your Chip
  • Function
  • The chip is working correctly as intended
  • Speed
  • The chip is running at 4 GHz as intended
  • Speed binning
  • Power
  • The chip consumes 50 Watt at 4 GHz as intended
  • Reliability
  • The chip will be operational for 10 years as
    written on manual and box

29
Calculating Your Chip Cost
  • Things to consider
  • Mask cost we need 20 40 masks used to form
    different patterns used in different process
    steps a.k.a. Non-Recurring Engineering (NRE) cost
  • Wafer cost
  • Cost put in process steps
  • Defect parts (we spend money producing defect
    parts!)
  • Any other overhead including marketing
  • Can we calculate cost of each chip now?
  • What happens if we adopt a new technology that
    can build smaller transistors?

30
(Simple) IC Process Overview
  • Silicon ingot (silicon cylinder)
  • (Blank) Wafers
  • Various steps to build circuits on wafers
  • Photomask process
  • Chemical process
  • Mechanical process
  • Wafer test to sort out bad parts
  • Tested die
  • Packaging steps
  • Wire bonding
  • Material filling
  • Marking
  • Chip test to sort out bad parts
  • Products

31
Testing Your Chip
  • Function
  • The chip is working correctly as intended
  • Speed
  • The chip is running at 4 GHz as intended
  • Speed binning
  • Power
  • The chip consumes 50 Watt at 4 GHz as intended
  • Reliability
  • The chip will be operational for 10 years as
    written on manual and box

32
Calculating Your Chip Cost
  • Things to consider
  • Mask cost we need 20 40 masks used to form
    different patterns used in different process
    steps a.k.a. Non-Recurring Engineering (NRE) cost
  • Wafer cost
  • Cost put in process steps
  • Defect parts (we spend money producing chips with
    defects!)
  • Any other overhead including marketing
  • Can we calculate cost of each chip now?
  • What happens if we adopt a new technology that
    can build smaller transistors?

33
Packaging
mounting
wire bonding
packaging material filling marking
34
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