CS/COE0447 Computer Organization

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CS/COE0447Computer Organization Assembly
Language

• CHAPTER 1

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Layered Approach in Computer Design
Computer Architecture or Instruction Set
Architecture
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Machine Code Example
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Components of ISA

• In most cases, a programmers reference manual
  (PRM) will disclose the ISA of a processor
• To understand an ISA, find in PRM
• Data types the processor supports
• Supported instructions and their definitions
• Registers (general-purpose special purpose)
• Processor modes
• Exception mechanism

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Inside a PC

• Integrated Circuits (ICs)
• CPU (Central Processing Unit), companion chipset,
  memory, peripheral I/O chip (e.g., USB, IDE,
  IEEE1394, )
• Printed Circuit (PC) boards (next slide)
• Substrate for ICs and interconnection
• Distribution of clock, power supply
• Heat dissipation
• Hard disk, CD-RW DVD-RW, (floppy disk)
• Power supply
• Chassis
• Holds boards, power supply, and provides physical
  interface for user and other systems
• Connectors and cables

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Closeup photo of one side of a motherboard PCB,
showing conductive traces and solder points for
through-hole components on the opposite side.
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Integrated Circuits

• 1mm25mm on a side
• 100 1000M transistors
• 25 250M logic gates

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Technology Trend (Processor Complexity)
2x transistors/chip every 1.5 years!
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Moores Law

• The term Moore's Law has been coined by Carver
  Mead around 1970.4 Moore's original statement
  can be found in his publication "Cramming more
  components onto integrated circuits", Electronics
  Magazine 19 April 1965
• The complexity for minimum component costs has
  increased at a rate of roughly a factor of two
  per year ... Certainly over the short term this
  rate can be expected to continue, if not to
  increase. Over the longer term, the rate of
  increase is a bit more uncertain, although there
  is no reason to believe it will not remain nearly
  constant for at least 10 years. That means by
  1975, the number of components per integrated
  circuit for minimum cost will be 65,000. I
  believe that such a large circuit can be built on
  a single wafer.1
• Astounding that it has held for so long!!!

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Memory Capacity Trend (DRAM)
1.4x/year or 2x every 2 years 8000x since 1980!
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Technology Advances (!)

• Memory
• DRAM capacity 2x / 2 years (since 96)
• 64x size improvement in last decade
• Processor
• Speed (in terms of clock frequency) 2x / 1.5
  years (since 85)
• 100x performance improvement in last decade
• Disk
• Capacity 2x / 1 year (since 97)
• 250x size improvement in last decade

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Main memory

• PC/servers use DRAM (Dynamic RAM)
• SDRAM
• DDR SDRAM
• RDRAM (RAMBUS DRAM)

A typical SDRAM module
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Main memory, contd

• Embedded computers use DRAM or SRAM (or both)
  depending on applications

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Storage

• Secondary storage
• Non-volatile
• Stores programs, user-saved data, etc.
• In PC/server domain, magnetic disk (hard-disk) is
  usually used
• In embedded computers, flash memory or ROM is
  usually employed

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Storage, contd
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Storage, contd
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Computer Networks

• Local Area Network (LAN)
• Within limited distance (e.g., in a building)
• Mostly based on Ethernet
• 10Mbps, 100Mbps, 1Gbps, 10Gbps,
• Wide Area Network
• Connecting networks far apart
• Proliferation of wireless LAN (IEEE802.11)
• 1 100Mbps

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(Simple) IC Process Overview

• Silicon ingot (silicon cylinder)
• (Blank) Wafers
• Various steps to build circuits on wafers
• Patterns of chemicals placed wafer
• Wafer test to sort out bad parts
• Tested die (diced into components dies,
  chips)
• Packaging steps
• Wire bonding (connected to the I/O pins of a
  package)
• Chip test to sort out bad parts (mistakes
  happen during packaging)
• Products

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