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MSc - Microprocessors

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Title: MSc - Microprocessors


1
  • MSc - Microprocessors
  • Dr. Konstantinos Tatas
  • com.tk_at_fit.ac.cy

2
Useful Information
  • Instructor Lecturer K. Tatas
  • Office hours TBA
  • E-mail com.tk_at_fit.ac.cy
  • http//staff.fit.ac.cy/com.tk
  • Lecture periods/week 3
  • Duration 10 weeks
  • ECTS 7 (175 hours)

3
Course Objectives
  • By the end of the course students should be able
    to
  • Evaluate the complex trade-offs involved in
    embedded system design
  • Write detailed embedded system requirements and
    specification documents
  • Write executable specifications using UML/SystemC
  • Develop applications using ARM Developer Suite
  • Write efficient ARM assembly and C programs in
    ARM and Thumb mode
  • Analyze program performance using traces
  • Use code transformations to improve
    performance/code size/power consumption.

4
Course Outline (1/2)
  • Week 1 Introduction to embedded systems
    Embedded microprocessor evolution Design
    metrics and constraints (performance, power,
    cost, time-to-market) and design optimization
    challenges - Distributed and Real-time systems
  • Week2 Key embedded system technologies
    Integrated Circuit technology Microprocessor
    technology CAD tool technology Sensor
    technology
  • Week 3 Embedded system specification and
    modeling Object-oriented specification
    (UML/C/SystemC) Assignment 1
  • Week 4 Computer Architecture Instruction sets
    RISC vs. CISC pipelining - The ARM
    microprocessor architecture - ARM assembly ARM
    mode Thumb mode - ARM and Thumb instruction set
    - ARM conditional execution
  • Week 5 Processor I/O Serial I/O Busy/wait
    I/O Interrupts Exceptions Traps ARM
    memory mapped I/O - Caches Memory Management
    Units Protection Units ARM cache and MMU
    Assignment 2

5
Course Outline (2/2)
  • Week 6 Assignment 1
  • Week 7 Programme design and analysis DFGs
    CDFGs Compilers Assemblers Linkers Basic
    compiler optimizations/code transformations
    Measuring programme speed Trace-driven
    performance analysis Energy optimization
    programme size optimization
  • Week 8 Code transformations Loop unrolling
    loop merging loop tiling performance
    optimizing transformations
  • Week 9 Test
  • Week 10 Assignment 2

6
Course Assessment
  • Final exam 40
  • Coursework 60
  • Assignment 1 15
  • Assignment 2 15
  • Quizzes 10
  • Test 10
  • Lab exercises 10

7
References
  • Books
  • W. Wolf, Computers as Components
  • W. Wolf, High-Performance Embedded Computing
  • H. Kopetz, Real-Time Systems Design Principles
    for Distributed Embedded Applications
  • S. Furber, ARM System-on-Chip Architecture
  • P. Panda, Memory Issues in Embedded
    Systems-on-Chip
  • F. Vahid and T. Givargis, Embedded System
    Design A Unified Hardware/Software Introduction
  • F. Catthoor, Data Access and Storage Management
    for Embedded Programmable Processors

8
Microprocessors for Embedded systems
  • Computing systems are everywhere
  • Most of us think of desktop computers
  • PCs
  • Laptops
  • Mainframes
  • Servers
  • But theres another type of computing system
  • Far more common...

9
Embedded systems overview
  • Embedded computing systems
  • Computing systems embedded within electronic
    devices
  • Hard to define. Nearly any computing system other
    than a desktop computer
  • Billions of units produced yearly, versus
    millions of desktop units
  • Perhaps 50 per household and per automobile

Computers are in here...
and here...
and even here...
Lots more of these, though they cost a lot less
each.
10
A short list of embedded systems
Anti-lock brakes Auto-focus cameras Automatic
teller machines Automatic toll systems Automatic
transmission Avionic systems Battery
chargers Camcorders Cell phones Cell-phone base
stations Cordless phones Cruise control Curbside
check-in systems Digital cameras Disk
drives Electronic card readers Electronic
instruments Electronic toys/games Factory
control Fax machines Fingerprint identifiers Home
security systems Life-support systems Medical
testing systems
Modems MPEG decoders Network cards Network
switches/routers On-board navigation Pagers Photoc
opiers Point-of-sale systems Portable video
games Printers Satellite phones Scanners Smart
ovens/dishwashers Speech recognizers Stereo
systems Teleconferencing systems Televisions Tempe
rature controllers Theft tracking systems TV
set-top boxes VCRs, DVD players Video game
consoles Video phones Washers and dryers
  • And the list goes on and on

11
Some common characteristics of embedded systems
  • Single-functioned
  • Executes a single program, repeatedly
  • Tightly-constrained
  • Low cost, low power, small, fast, etc.
  • Reactive and real-time
  • Continually reacts to changes in the systems
    environment
  • Must compute certain results in real-time without
    delay

12
An embedded system example Digital camera
  • Single-functioned -- always a digital camera
  • Tightly-constrained -- Low cost, low power,
    small, fast
  • Reactive and real-time -- only to a small extent

13
Embedded Software Development Requires as
Much/More Design Effort Than Hardware
14
A System-on-a-Chip Example
Courtesy Philips
15
Design at a crossroadSystem-on-a-Chip
  • Embedded applications where cost, performance,
    and energy are the real issues!
  • DSP and control intensive
  • Mixed-mode
  • Combines programmable and application-specific
    modules
  • Software plays crucial role

16
Disciplines involved in Embedded System Design
  • Digital System Design
  • Software Design
  • Analog/Mixed-Signal/RF System Design
  • Operating Systems
  • Microprocessors/Computer Architecture
  • Verification
  • Testing
  • etc

17
Languages traditionally used in Embedded System
Design
  • Software design
  • C/C
  • Java
  • Assembly
  • Verification
  • VHDL/Verilog
  • SystemVerilog
  • Tcl/tk
  • Vera
  • Specification/modeling
  • UML
  • SDL
  • C/C
  • Hardware design
  • VHDL
  • Verilog

18
Design challenge optimizing design metrics
  • Obvious design goal
  • Construct an implementation with desired
    functionality
  • Key design challenge
  • Simultaneously optimize numerous design metrics
  • Design metric
  • A measurable feature of a systems
    implementation
  • Optimizing design metrics is a key challenge

19
Design challenge optimizing design metrics
  • Common metrics
  • Unit cost the monetary cost of manufacturing
    each copy of the system, excluding NRE cost
  • NRE cost (Non-Recurring Engineering cost) The
    one-time monetary cost of designing the system
  • Size the physical space required by the system
  • Performance the execution time or throughput of
    the system
  • Power the amount of power consumed by the system
  • Flexibility the ability to change the
    functionality of the system without incurring
    heavy NRE cost

20
Design challenge optimizing design metrics
  • Common metrics (continued)
  • Time-to-prototype the time needed to build a
    working version of the system
  • Time-to-market the time required to develop a
    system to the point that it can be released and
    sold to customers
  • Maintainability the ability to modify the system
    after its initial release
  • Correctness, safety, many more

21
Design metric competition -- improving one may
worsen others
  • Expertise with both software and hardware is
    needed to optimize design metrics
  • Not just a hardware or software expert, as is
    common
  • A designer must be comfortable with various
    technologies in order to choose the best for a
    given application and constraints

22
Time-to-market a demanding design metric
  • Time required to develop a product to the point
    it can be sold to customers
  • Market window
  • Period during which the product would have
    highest sales
  • Average time-to-market constraint is about 8
    months
  • Delays can be costly

23
Losses due to delayed market entry
  • Simplified revenue model
  • Product life 2W, peak at W
  • Time of market entry defines a triangle,
    representing market penetration
  • Triangle area equals revenue
  • Loss
  • The difference between the on-time and delayed
    triangle areas

24
Losses due to delayed market entry (cont.)
  • Area 1/2 base height
  • On-time 1/2 2W W
  • Delayed 1/2 (W-DW)(W-D)
  • Percentage revenue loss (D(3W-D)/2W2)100
  • Try some examples
  • Lifetime 2W52 wks, delay D4 wks
  • (4(326 4)/2262) 22
  • Lifetime 2W52 wks, delay D10 wks
  • (10(326 10)/2262) 50
  • Delays are costly!

25
The performance design metric
  • Widely-used measure of system, widely-abused
  • Clock frequency, instructions per second not
    good measures
  • Digital camera example a user cares about how
    fast it processes images, not clock speed or
    instructions per second
  • Latency (response time)
  • Time between task start and end
  • e.g., Cameras A and B process images in 0.25
    seconds
  • Throughput
  • Tasks per second, e.g. Camera A processes 4
    images per second
  • Throughput can be more than latency seems to
    imply due to concurrency, e.g. Camera B may
    process 8 images per second (by capturing a new
    image while previous image is being stored).
  • Speedup of B over S Bs performance / As
    performance
  • Throughput speedup 8/4 2

26
Three key embedded system technologies
  • Technology
  • A manner of accomplishing a task, especially
    using technical processes, methods, or knowledge
  • Three key technologies for embedded systems
  • Processor technology
  • IC technology
  • Design technology

27
Processor technology
  • The architecture of the computation engine used
    to implement a systems desired functionality
  • Processor does not have to be programmable
  • Processor not equal to general-purpose
    processor

Datapath
Controller
Datapath
Controller
Datapath
Controller
Control logic
index
Registers
Control logic and State register
Register file
Control logic and State register
total
Custom ALU
State register

General ALU
IR
PC
IR
PC
Data memory
Data memory
Program memory
Program memory
Data memory
Assembly code for total 0 for i 1 to
Assembly code for total 0 for i 1 to
Single-purpose (hardware)
General-purpose (software)
Application-specific
28
Processor technology
  • Processors vary in their customization for the
    problem at hand

total 0 for i 1 to N loop total
Mi end loop
Desired functionality

General-purpose processor
Single-purpose processor
Application-specific processor
29
General-purpose processors
  • Programmable device used in a variety of
    applications
  • Also known as microprocessor
  • Features
  • Program memory
  • General datapath with large register file and
    general ALU
  • User benefits
  • Low time-to-market and NRE costs
  • High flexibility
  • Pentium the most well-known, but there are
    hundreds of others

30
Single-purpose processors
  • Digital circuit designed to execute exactly one
    program
  • a.k.a. coprocessor, accelerator or peripheral
  • Features
  • Contains only the components needed to execute a
    single program
  • No program memory
  • Benefits
  • Fast
  • Low power
  • Small size

31
Application-specific processors
  • Programmable processor optimized for a particular
    class of applications having common
    characteristics
  • Compromise between general-purpose and
    single-purpose processors
  • Features
  • Program memory
  • Optimized datapath
  • Special functional units
  • Benefits
  • Some flexibility, good performance, size and power

32
IC technology
  • The manner in which a digital (gate-level)
    implementation is mapped onto an IC
  • IC Integrated circuit, or chip
  • IC technologies differ in their customization to
    a design
  • ICs consist of numerous layers (perhaps 10 or
    more)
  • IC technologies differ with respect to who builds
    each layer and when

33
IC technology Design Approaches
34
Full-custom design
  • All layers are optimized for an embedded systems
    particular digital implementation
  • Placing transistors
  • Sizing transistors
  • Routing wires
  • Benefits
  • Excellent performance, small size, low power
  • Drawbacks
  • High NRE cost (e.g., 300k), long time-to-market

35
The Custom Approach
Intel 4004
Courtesy Intel
36
Transition to Automation and Regular Structures
Courtesy Intel
37
(No Transcript)
38
IC technology Design Approaches
IC Technology Implementation Approaches
Custom
Semicustom
Cell-based
Array-based
Standard Cells
Pre-diffused
Pre-wired
Macro Cells
Compiled Cells
(Gate Arrays)
(FPGA's)
39
Semi-custom
  • Lower layers are fully or partially built
  • Designers are left with routing of wires and
    maybe placing some blocks
  • Benefits
  • Good performance, good size, less NRE cost than a
    full-custom implementation (perhaps 10k to
    100k)
  • Drawbacks
  • Still require weeks to months to develop

40
Cell-based Design (or standard cells)
Routing channel requirements are reduced by
presence of more interconnect layers
41
Standard Cell Example
Brodersen92
42
Standard Cell - Example
3-input NAND cell (from ST Microelectronics) C
Load capacitance T input rise/fall time
43
IC technology Design Approaches
IC Technology Implementation Approaches
Custom
Semicustom
Cell-based
Array-based
Standard Cells
Pre-diffused
Pre-wired
Macro Cells
Compiled Cells
(Gate Arrays)
(FPGA's)
44
Programmable Logic Devices
  • All layers (diffusion, polysilicon, multi-
    metal) may exist
  • Designers can purchase an IC
  • Connections on the IC are either created or
    destroyed to implement desired functionality
  • Field-Programmable Gate Array (FPGA) and recently
    Gate Arrays are very popular
  • Benefits
  • Low NRE costs, almost instant IC availability
  • Drawbacks
  • Bigger, expensive (perhaps 30 per unit), power
    hungry, slower

45
Gate Array Sea-of-gates
Uncommited Cell
Committed Cell(4-input NOR)
46
Sea-of-gate Primitive Cells
Using oxide-isolation
Using gate-isolation
47
Sea-of-gates
Random Logic
Memory Subsystem
LSI Logic LEA300K (0.6 mm CMOS)
48
Prewired Arrays
  • Classification of prewired arrays (or
    field-programmable devices)
  • Based on Programming Technique
  • Fuse-based (program-once)
  • Non-volatile EPROM based
  • RAM based
  • Programmable Logic Style
  • Array-Based
  • Look-up Table
  • Programmable Interconnect Style
  • Channel-routing
  • Mesh networks

49
Altera MAX
From Smith97
50
Altera MAX Interconnect Architecture
row channel
column channel
LAB
Array-based (MAX 3000-7000)
Mesh-based (MAX 9000)
51
LUT-Based Logic Cell
4
C
....C
1
4
xx
xxxx
xxxx
xxxx
Bits
D
xxxx
4
control
Logic
xx
xx
D
xx
xx
function
x
x
3
xx
of
xx
D
2
xxx
D
1
Logic
xx
x
xx
function
x
x
of
x
x
xxx
F
4
Bits
xxxx
Logic
control
F
xx
xx
3
xx
function
xx
x
x
xx
F
of
xx
2
xxx
F
1
xx
xx
x
xxxxx
x
H
x
P
Multiplexer Controlled
Xilinx 4000 Series
by Configuration Program
52
Array-Based Programmable Wiring
Vertical tracks
53
Transistor Implementation of Mesh
Courtesy Dehon and Wawrzyniek
54
RAM-based FPGA
Xilinx XC4000ex
55
Design Technology
  • The manner in which we convert our concept of
    desired system functionality into an
    implementation

Compilation/ Synthesis
Libraries/ IP
Test/ Verification
System specification
System synthesis
Hw/Sw/ OS
Model simulat./ checkers
Compilation/Synthesis Automates exploration and
insertion of implementation details for lower
level.
Behavioral specification
Behavior synthesis
Cores
Hw-Sw cosimulators
Libraries/IP Incorporates pre-designed
implementation from lower abstraction level into
higher level.
RT specification
RT synthesis
RT components
HDL simulators
Test/Verification Ensures correct functionality
at each level, thus reducing costly iterations
between levels.
Logic specification
Logic synthesis
Gates/ Cells
Gate simulators
To final implementation
56
The co-design ladder
  • In the past
  • Hardware and software design technologies were
    very different
  • Recent maturation of synthesis enables a unified
    view of hardware and software
  • Hardware/software codesign

The choice of hardware versus software for a
particular function is simply a tradeoff among
various design metrics, like performance, power,
size, NRE cost, and especially flexibility there
is no fundamental difference between what
hardware or software can implement.
57
Independence of processor and IC technologies
  • Basic tradeoff
  • General vs. custom
  • With respect to processor technology or IC
    technology
  • The two technologies are independent

58
Design Decision Trade-offs
59
Generalised Design Flow
60
Architecture ReUse
  • Silicon System Platform
  • Flexible architecture for hardware and software
  • Specific (programmable) components
  • Network architecture
  • Software modules
  • Rules and guidelines for design of HW and SW
  • Has been successful in PCs
  • Dominance of a few players who specify and
    control architecture
  • Application-domain specific (difference in
    constraints)
  • Speed (compute power)
  • Dissipation
  • Costs
  • Real / non-real time data

61
Platform-Based Design
Only the consumer gets freedom of
choice designers need freedom from
choice (Orfali, et al, 1996, p.522)
  • A platform is a restriction on the space of
    possible implementation choices, providing a
    well-defined abstraction of the underlying
    technology for the application developer
  • New platforms will be defined at the
    architecture-micro-architecture boundary
  • They will be component-based, and will provide a
    range of choices from structured-custom to fully
    programmable implementations
  • Key to such approaches is the representation of
    communication in the platform model

SourceR.Newton
62
Platform-based Design System-on-Chip
  • Use of predefined Intellectual Property (IP)
  • A platform-based system consists of a RISC
    processor, memories, busses and a common language
  • Platform-based design poses the problem of
    partitioning a solution between hardware (HDL)
    and software (programming processors)

63
Platforms Enable Simplified SoC Design
  • Customer demands
  • Fast turn-around time
  • Easy access to pre-qualified building blocks
  • Web enabled
  • Design technology
  • Core platforms
  • Big IP
  • Emerging SoC bus standards
  • Embedded software
  • HW/SW co-verification

64
And Automation of IP Selection Integration
65
Heterogeneous Programmable Platforms
FPGA Fabric
Embedded memories
Embedded PowerPc
Hardwired multipliers
Xilinx Vertex-II Pro
High-speed I/O
66
Xilinxs products
67
Xilinxs products
68
Comparison of CMOS design methods
Design Method NRE Unit Cost Power Dissipation Complexity of Implementation Time-to-Market Performance Flexibility
µProcessor/DSP low medium high low low low high
PLA low medium medium low low medium low
FPGA low high medium medium medium medium medium
Gate/Array medium medium low medium medium medium medium
Cell Based high low low high high high low
Custom Design high low low high high Very high low
Platform Based high Low/medium low high Medium/low high medium
69
Impact of Implementation Choices
70
Design Economics (1)
  • The selling price of an IC ?StotalCtotal/(1-m),
    Ctotal is manufacturing cost for a single IC, m
    desired profit margin
  • Costs for produce an IC
  • Non-recurring engineering costs (NREs)
  • Recurring engineering costs
  • Fixed costs

71
Design Economics (2)
  • Non-recurring engineering costs (NREs)
  • Engineering design cost
  • Prototype manufacturing cost
  • Recurring costs
  • Process
  • Package
  • Test

72
NRE and unit cost metrics
  • Costs
  • Unit cost the monetary cost of manufacturing
    each copy of the system, excluding NRE cost
  • NRE cost (Non-Recurring Engineering cost) The
    one-time monetary cost of designing the system
  • total cost NRE cost unit cost of
    units
  • per-product cost total cost / of units
  • (NRE cost / of units) unit cost
  • Example
  • NRE2000, unit100
  • For 10 units
  • total cost 2000 10100 3000
  • per-product cost 2000/10 100 300

73
NRE and unit cost metrics
  • Compare technologies by costs -- best depends on
    quantity
  • Technology A NRE2,000, unit100
  • Technology B NRE30,000, unit30
  • Technology C NRE100,000, unit2
  • But, must also consider time-to-market

74
Wafer and die cost
Die yield number of good dies/total number of
dies
75
Example
  • Assuming
  • 20 engineers are employed full-time for a year
    with a 50,000/year average salary
  • Additional 200,000 overhead costs of which
    100,000 for total testing
  • A wafer cost of 200 per wafer
  • A 2 packaging cost per chip
  • 10 dies/wafer
  • 70 die yield
  • 98 final test yield
  • A market for 100,000 items
  • Calculate the minimum shelf price of the chip

76
Design productivity exponential increase
100,000
10,000
1,000
100
Productivity (K) Trans./Staff Mo.
10
1
0.1
0.01
1981
1995
1997
2007
1983
1987
1989
1991
1993
1999
2001
2003
1985
2005
2009
  • Exponential increase over the past few decades

77
The growing design-productivity gap
Design Productivity Crisis (SRC 1997) Potential
Design Complexity and Designer Productivity
Moores Law Standard cell density and speed
Equivalent Added Complexity
58 / yr compounded Complexity Growth Rate
Density (Kgates / mm2)ASIC clock (MHz)
Logic Transistor per Chip ( M )
Productivity ( K) Trans./Staff Mo.
21 / yr compounded Productivity Growth Rate
78
Design productivity gap
  • 1981 leading edge chip required 100 designer
    months
  • 10,000 transistors / 100 transistors/month
  • 2002 leading edge chip requires 30,000 designer
    months
  • 150,000,000 / 5000 transistors/month
  • Designer cost increase from 1M to 300M
  • While designer productivity has grown at an
    impressive rate over the past decades, the rate
    of improvement has not kept pace with chip
    capacity

79
The mythical man-month
  • The situation is even worse than the productivity
    gap indicates
  • In theory, adding designers to team reduces
    project completion time
  • In reality, productivity per designer decreases
    due to complexities of team management and
    communication
  • In the software community, known as the mythical
    man-month (Brooks 1975)
  • At some point, can actually lengthen project
    completion time! (Too many cooks)
  • 1M transistors, 1 designer5000 trans/month
  • Each additional designer reduces for 100
    trans/month
  • So 2 designers produce 4900 trans/month each

80
Summary
  • Embedded systems are everywhere
  • Key challenge optimization of design metrics
  • Design metrics compete with one another
  • A unified view of hardware and software is
    necessary to improve productivity
  • Three key technologies
  • Processor general-purpose, application-specific,
    single-purpose
  • IC Full-custom, semi-custom, PLD
  • Design Compilation/synthesis, libraries/IP,
    test/verification

81
Real-time and distributed systems
  • Dr. Konstantinos Tatas

82
What is real-time? Is there any other kind?
  • A real-time computer system is a computer system
    where the correctness of the system behavior
    depends not only on the logical results of the
    computations, but also on the physical time when
    these results are produced.
  • By system behavior we mean the sequence of
    outputs in time of a system.

83
Real-time means reactive
  • A real-time computer system must react to stimuli
    from its environment
  • The instant when a result must be produced is
    called a deadline.
  • If a result has utility even after the deadline
    has passed, the deadline is classified as soft,
    otherwise it is firm.
  • If severe consequences could result if a firm
    deadline is missed, the deadline is called hard.
  • Example Consider a traffic signal at a road
    before a railway crossing. If the traffic signal
    does not change to red before the train arrives,
    an accident could result.

84
Reliability
  • The Reliability R(t) of a system is the
    probability that a system will provide the
    specified service until time t, given that the
    system was operational at the beginning (t-t0)
  • The probability that a system will fail in a
    given interval of time is expressed by the
    failure rate, measured in FITs (Failure In Time).
  • A failure rate of 1 FIT means that the mean time
    to a failure (MTTF) of a device is 109 h, i.e.,
    one failure occurs in about 115,000 years.
  • If a system has a constant failure rate of ?
    failures/h, then the reliability at time t is
    given by
  • R(t) exp(-?(t-to))
  • MTTF 1/?

85
Example
  • What must be the system failure rate so that 99
    of the systems in the field work reliably for the
    first 100,000 hours?

86
Safety
87
Maintainability
88
Name some hard, firm and soft deadline embedded
systems
89
Example
  • an automotive company produces 2,000,000
    electronic engine controllers of a special type.
  • The following design alternatives are discussed
  • (a) Construct the engine control unit as a single
    SRU with the application software in Read Only
    Memory (ROM).The production cost of such a unit
    is 250. In case of an error, the complete unit
    has to be replaced.
  • (b) Construct the engine control unit such that
    the software is contained in a ROM that is placed
    on a socket and can be replaced in case of a
    software error. The production cost of the unit
    without the ROM is 248. The cost of the ROM is
    5.
  • (c) Construct the engine control unit as a single
    SRU where the software is loaded in a Flash EPROM
    that can be reloaded. The production cost of such
    a unit is 255.
  • The labor cost of repair is assumed to be 50 for
    each vehicle. (It is assumed to be the same for
    each one of the three alternatives).
  • Calculate the cost of a software error for each
    one of the three alternative designs if 300,000
    cars have to be recalled because of the software
    error (example in Sect. 1.6.1).
  • Which one is the lowest cost alternative if only
    1,000 cars are affected by a recall?

90
Distributed RT system model
  • From the POV of an outside observer, a real-time
    (RT) system can be decomposed into three
    communicating subsystems
  • a controlled object (the physical subsystem, the
    behavior of which is governed by the laws of
    physics),
  • a distributed computer subsystem (the cyber
    system, the behavior of which is governed by the
    programs that are executed on digital computers)
  • a human user or operator
  • The distributed computer system consists of
    computational nodes that interact by the exchange
    of messages.
  • A computational node can host one or more
    computational components.

91
Event-Triggered Control Versus Time-Triggered
Control
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