2006 Work Plan

1
2006 Work Plan

• Y. Sugimoto
• 25-Apr-2006

2
Study Items

• Basic study of fully depleted CCD
• Simulation studies for FPCCD VTX
• Radiation damage
• Thin wafer and the support structure
• Conceptual design of FPCCD for ILC
• Readout ASIC

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Basic study of fully-dep. CCD

• Charge spread
• Back-illumination CCD (S7170-0909-deep2)
• LASER / Fe55
• April May
• Lorentzs angle
• From May 8th 2 weeks at KEK cryogenic center
• S7170-0909-deep2 with S5466 as a reference

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Simulation studies for FPCCD VTX

• Background rejection with cluster shape
• Tracking efficiency with beam background
• Flavor tagging
• Vertex charge

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Radiation damage study

• Clock dependence of CTI
• Using standard CCD irradiated before
• Electron annealing
• Verify Nicks report
• Using CCDs irradiated with neutron before
• Irradiate with b-source or beam?
• Radiation damage of fully-depleted CCD
• Irradiate with b-source or beam?
• Radiation damage of FPCCD
• When can we get the FPCCD? Up to HPK

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Thin wafer and the support structure

• Consider 2 options
• Partially thinned wafer
• Si-RVC-Si sandwich
• Simulation with FEA program
• Measurement of flatness for partially thinned
  wafer (S7170-0909-deep2)
• Can we get RVC sample?

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Conceptual design of FPCCD

• Simulation using FEMLAB
• Discussion with HPK
• Simulation using ENEXSS-TCAD

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Readout ASIC

• Goal (3 years)
• 16/32 ch Amp-CDS-ADC with 0.635 mm pitch
• System noise lt 50 electrons (depends on CCD)
• 4 6 bit 20 Mpix/sec
• Power lt 10 mW/ch (depends on thermal design of
  VTX)
• Target of this year
• 1ch sample device
• Organization
• Osaka Univ. group is also doing RD of CP-CCD and
  the R.O. ASIC for X-ray astronomy
• Ikeda-san (JAXA) is collaborating with Osaka
  group for the ASIC
• ? Collaboration with Ikeda-san would be efficient
  for our RD

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RD Schedule
Charge spread /Lorentz angle
Deadline for proposal to LNS
Machine-time?
WS
Study of radiation damage
Clock v.s. CTI, Damage of full-dep. CCD,etc,
Thin wafer / Support
FPCCD Conceptual design
RD of r.o. ASIC
B.G. rejection by cls shape
Flavor tagging efficiency, etc.
Tracking efficiency
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Funding sources

• TOKUTEI-KOUBO T
• KIBAN-(C) C
• GAKUJYUTU-SOSEI G
• KEK Annual budget A

Basic study of fully depleted CCD Basic study of fully depleted CCD C
Simulation study for FPCCD VTX for ILC Simulation study for FPCCD VTX for ILC C
Radiation damage Standard size C, A
Radiation damage Fine Pixel T, G
Radiation damage Electronics A, T
Thin wafer / support structure Thin wafer / support structure C
FPCCD conceptual design FPCCD conceptual design C, G
Readout ASIC Readout ASIC G
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Expected manpower
Basic study of fully depleted CCD Basic study of fully depleted CCD Y.S., K.N., all
Simulation study for FPCCD VTX for ILC Simulation study for FPCCD VTX for ILC T.N., PD-A, A.M., PD-B
Radiation damage Standard size Y.S., K.N., PD-B, T.N., PD-A, St-A, and all
Radiation damage Fine Pixel Y.S., K.N., PD-B, T.N., PD-A, St-A, and all
Radiation damage Electronics K.N.
Thin wafer / support structure Thin wafer / support structure Y.S.
FPCCD conceptual design FPCCD conceptual design Y.S., PD-B
Readout ASIC Readout ASIC PD-A, St-A, K.I.
PD-A Post-doc at Tohoku (Oct.06) PD-B Post-doc
at KEK (Oct.06) St-A Student at Tohoku
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Summary

• We have won satisfactory level of funding for
  sensor RD (not enough for all of RD items of
  VTX)
• We have a lot of things to do
• We now need manpower
• At least 2 post-docs (Tohoku and KEK) by
  GAKUJUTSU-SOSEI grant
• We anticipate more post-docs supported by
  Postdoctoral fellowships for foreign
  researchers of JSPS ( http//www.jsps.go.jp/engl
  ish/e-fellow/fellow.html )
• We also hope many graduate students to join