SLAC Detector R

1
Sensor Researchat theSLAC National
Accelerator Laboratory
Chris Kenney For the Detector RD group
2
The Plan
Attack fundamental sensor parameters Energy
resolution Spatial resolution Time
resolution Radiation tolerance Efficiency Reduc
e material and system complexity Driven by
future needs of particle physics Couple SLACs
front-end and electronics design capability to
sensor development
Use Stanfords world class micro and nano
fabrication facilities All sensors in this talk
were or will be made at Stanford
3
PolyChrome Imager
Energy, Complexity, Efficiency
Filters
Equivalent to increasing mirror diameter by
factor of two
Survey Telescopes (eg. SDSS, LSST, JDEM, TMT)
utilize multi-band color photometry - where
separate images are taken in each color
band. Use filter for each color band Uselessly
absorbs majority of photons (LSST will throw out
83)!!!!
CMOS
300-500 nm 0.5 mm thick
Transistors n Diffusions p Diffusions Vias S
ilicon Oxide
500-700 nm 5 mm thick
New paradigm record all photons in multiple
bands simultaneously Sort color by depth of
interaction
700-1500 nm 295 mm thick
Proprietary Confidential
4
Photometric Redshift
Energy, Complexity, Efficiency
Photo-z a technique to determine redshift (z)
using multi-color photometric images. The
color-sensitive image sensor has overlapping band
passes - what affect does this have on
photo-z? Factor of two degradation not a bad
start
overlapping passbands
perfect filters
no attempt to optimize for this case.
Measured z - True z
Measured z - True z
5
X-Rays Too
Similar absorption curves for visible and
x-rays Simultaneous multiple-energy contrast
image
SLAC intends to design and fabricate multi-layer,
proof-of-concept devices
Proprietary Confidential
6
Improving Ge Detector Fabrication
Efficiency Energy
Germanium has been successfully used in
CDMS GeODM proposes a 1.5 ton sensitive
mass Requires scaling from 1 cm thick, 3
diameter to 1 thick, 6 diameter germanium
wafers Mass of such thick wafers is 90 X that of
standard silicon wafers Must develop and
automate new procedures and tools to meet this
challenge (e.g. resist coaters run 3000
rpm) Work with manufactures to grow such heavy
boules Maintain low-radioactivity cleanliness
6 inch Ti blank ( similar properties as Ge)
3 inch Ge detector for dark matter searches
7
3D-Architecture Radiation Sensors
RadiationTiming
S. Parker, C. Kenney, J. Segal, NIM A395 (1997)
328-343.
Expected width 3195 /-5 mm Measured width
3203 /-4 mm
With Manchester New Mexico Hawaii Czech Tech.
U. Prague Nuclear Physics Inst. Czech Academy of
Sciences Los Alamos CERN
8
3D Electrode Response
Efficiency
Electrodes are partially efficient

• Electrodes are filled with polysilicon
• Mechanism
• Short lifetimes
• Insulating barrier

Collect all or none?
With ESRF, Manchester, Hawaii, MBC
9
Future Work 3D Diodes
Improve efficiency dopant chemistry, anneals,
and cleans Radiation tolerance studies with UNM
and LANL (FC) ATLAS FP production about 200
FE-I3 sensors Contribute to ATLAS IBL, if 3D
sensors are chosen Have transferred technology
to SINTEF - our industrial partner Filling the
electrode holes with polysilicon was performed at
Stanford Second batch of wafers in progress with
FE-I4 and FE-I3 sensors
10
Dual Readout
Complexity Material
Strips yellow Pixels - blue
Combine strips and pixels Reduced
material Pixel-to-strip pulse height
correlation Improved spatial resolution
C. Da Via, S. Parker, et al., Dual readout
strip/pixel systems, NIM A594, pp. 7-12 (2008).
Future LHC forward physics trigger Design,
fabricate, and test first prototype sensor (FC)
With, Manchester Hawaii
11
Active-Edge Planar Sensors
Material
Reduces material Non Cartesian geometries
Seamless tiling
Wire bonds
(FC)
Synchrotron x-ray scan
Optical
With Molecular Biology Consortium, Manchester
Hawaii
12
Edge Contact to Backside
Complexity
Easier bias connection Reduce costs, material,
and complexity
Abrupt junction forms contact to backside
Temporary metal turns many pixels into a few
strips
Sensor to be bump bonded (FC) to FE-I4p ASIC
13
Spherical and Cylindrical Diodes
Efficiency Energy

• Depletion and Capacitance Functions
• Planar (Parallel Plates)
• VR2 x NQ/ e e0
• C e e0 p R2 / D
• 3D (Cylindrical)
• V (NQ/4 e e0 )xR2 D2(12ln(R/D))
• C 2 p e e0 R ln ( D / R ) -1
• 2.5D (Spherical)
• V (NQ/3 e e0 )xD3/R-3D2/2R2/2
• C 2 p e e0 (1 / D ) (1 / R) -1

14
Hexagonal Hemispheres
Efficiency Energy

• Can tile an area
• Near hemispherical depletion geometry
• No charge sharing
• Theoretical depletion is 13 V
• Future
• Radiation hardness
• X-ray spectroscopy
• Fabricate 2 mm thick, hemispherical sensors

15
Temporal Vertex Tagging at LHC
Timing
Push silicon time resolution
Constant-fraction RMS 100 ps
SLAC will continue to improve the time resolution
of 3D and planar silicon sensors Would benefit
from ESA testbeam
0.13 CMOS ASIC with 32 channels radiation hardened
Dtime 300ps
(440m 5cm)
(440m - 5cm)
Left detector
Right detector
(440m 15cm)
(440m 15cm)
Dtime -900ps
30 cm
With Brunel, CERN, Manchester Hawaii
16
Diamond
Radiation, Speed, Material

• Past Work
• Various Electrode Geometries
• Processed at Stanford (SNF)
• ESRF Beam Bunch Period

• Future Plans
• Establish in-house diamond expertise
• 3D diamond sensors
• Push diamond processing technology
• Would benefit from ESA testbeam

30 nanometers
J. Morse ESRF


17
Gray-tone Diffusions
Radiation Thickness
Extend radiation tolerance and thickness
Gray tone lithography
Peak electric field limits thickness and
radiation tolerance Use gray-tone lithography to
modulate implant profile Creates continuously
varying dopant-density profile SLAC will develop
and demonstrate this technology
Ion implantation
Graded dopant profile
M. Christophersen and B. Phlips, Appl. Phys.
Lett. 92 (2008)
Proprietary Confidential
18
Double Metal Sensors
Complexity Material
Reduce costs, material, and complexity

• Use sensor to route power and control lines
• Prototype sensors made
• Undergoing testing
• Awaiting bump bonding (FC)
• Would benefit from ESA testbeam

Made by Hamamatsu
See talks on Systems and DAQ
19
Neutron Sensors
Non HEP
Efficiency
Potential factor of ten increase in efficiency
for thermal neutrons
6Li n ? a (2.05 MeV) 3H (2.73 MeV)
J. Uher et al., NIM A576 (2007) 32-37
With Czech Technical U. Praha Mid-Sweden
University Sundsvall University of Hawaii
20
Synchrotron Beam Stops
Efficiency Energy, Material
Non HEP
In use at Diamond Light source
200 mm
Quadrant beamstop
Energy resolving beamstop
With Diamond Light Source, Hawaii, Molecular
Biology Consortium
21
Stanford Nanofabrication Facility
SLAC personnel have been making devices at SNF
for two decades

• 10,500 ft2 class 100 cleanroom
• Privately (Paul Allen), Intel, and NSF funded,
  etc.
• ASML 400 nm Stepper with Front-to-Back
  capability
• Electron-beam lithography (2)
• Optical contact aligners (4)
• Furnaces Anneal and LPCVD (20)
• Plasma etchers (12)
• Deep etchers (2)
• 17 full time staff

22
Stanford Nano-characterization Laboratory

• Dual-beam Focused Ion Beam
• Transmission Electron Microscope
• Scanning Electron Microscopes
• Auger Scanning Microscope
• SPMs and AFMs
• X-Ray Photoemission Spectroscopy

FIB
XPS
23
Stanford NanoCenter
Major commitment to stay at cutting edge of
fabrication

• 100 M in Building and Equipment
• 100,000 ft2 of lab and office space
• 6,000 ft2 nano-characterization and
  nano-patterning laboratory
• 3,000 ft2 clean room for device fabrication
• eBeam Litho, TEMs,

24
Efficient Use of Resources
All this on one wafer!

• Multi Project Wafers
• ATLAS FE-I3 planar active edge
• ATLAS FE-I3 cylindrical pixels
• ATLAS FE-I4p planar active edge
• ATLAS Strips planar active edge
• Optical Sorting Aperture BNL NSLS I II
• Synchrotron beam stops Diamond Light Source (3)
• Active pinhole collimators ALS
• Active blade collimators
• Skew beam stops ALS
• Pixels, active edge - Protein Crystallography,
  TR-SAXS (ALS, SSRL, ) (3)
• Active synchrotron attenuators
• Edge field plate test strips
• Spherical diodes (3)
• Cylindrical diodes (2)
• Quadrant toroidal synchrotron beam stops (7)
• Electron spectrometer pixels (2)
• Energy resolving synchrotron beam stops

Synergies with electronics designers

• ATLAS FE-I4 planar active edge
• Quadrant sensors (5)
• Concentric annuli sensors (3)
• Electron beam array
• Edge-to-backside bias test
• Linear diode array
• Active edge photodiode

25
Milestones
Red Maybe resource limited
26
Summary
Push fundamental sensor parameters energy, time,
radiation hardness, spatial, by exploiting new
technologies. Impacts on LHC forward physics,
ATLAS IBL and Upgrade, SLHC, SiD, LSST upgrade,
, and areas outside of HEP Leverage someone
elses capital (gt200 M) by utilizing Stanfords
fabrication facilities Combine with our
expertise in front-end ASICs and
electronics Stretch resources by following a
multi-project wafer philosophy when feasible
27
Backup Slides
28
Thermal-mechanical Mimics
In use for LHC forward physics

• Enhances development of engineering prototypes
• Designed to mimic ATLAS FE
• Matching wire bond pads
• Can generate same power
• Separate analog and digital power sections
• Polysilicon resistors

Univ. Manchester
29
LSST Bands
NOT TO SCALE
30
Mimic LSST Bands
Optimize such that band absorption curves cross
near officially-defined band limits. Theres a
lot of overlap in the middle of the spectrum!
31
Cylindrical Diodes
Efficiency Radiation

• Theoretical depletion is 8 V
• Near Hemi-Cylinder Depletion Geometry
• 300 micron pitch and 250 micron thick
• Made FE-I3 size sensors

Back view
Front view
32
Parallel Electron Beam Sensor
Non HEP
Speed
Scale to ten thousand beamlet system
Optical image
250 mm pitch
Sensor response
D. Pickard et al., JVST B25, 6 (2007) 2277-2283.
Wth Singapore Hitachi Stanford Manchester
Well separated channels
33
Probes For Neurobiology
Non HEP
Scale to thousands of needles Enables system
level understanding Spike trains observed Q2 2009
Patch Clamp
Retina Array
J. Hudson (UVA)
D. Gunning et al., NIM A604 (2009) 104-107.
With UC Santa Cruz Salk Institute Glasgow
Molecular Biology Consortium