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Silicon on Insulator

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Need to extend Moore's Law. Commercial Availability of SOI wafers ... IBIS's commercial SIMOX wafers (3'' 6'') 1987. Novel SOI Devices. Dual gate SOI. ... – PowerPoint PPT presentation

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Title: Silicon on Insulator


1
Silicon on Insulator
  • Advanced Electronic Devices
  • Karthik Swaminathan

2
Reasons for SOI
  • Replacement for SOS
  • Need to extend Moores Law
  • Commercial Availability of SOI wafers

3
Advantages of SOI
  • Reduced Source and Drain to Substrate
    Capacitance.
  • Absence of Latchup.
  • Lower Passive current.
  • Denser Layout ? Low cost.

4
SOI Wafer Fabrication
  • Bond and Etch Back
  • SIMOX (Separation by IMplantation Of oXygen)
  • SIMON(Separation by IMplantation Of Nitrogen)

5
SIMOX
SIMOX
silicon
6
Fully Depleted (FD) SOI
  • This is what you expect.
  • FDSOI MOSFET
  • Depleted channel.

http//www.soisic.com/SOI_keys_benefits.htm
7
Partially Depleted (PD) SOI
  • What if active Si layer is thick ?
  • Body in channel floating ? Floating body effect.

http//www.soisic.com/SOI_keys_benefits.htm
8
Is SOI just in the textbooks ?
1987 IBISs commercial SIMOX wafers (3 6)
1988 HPs 2GHz CMOS circuit
1989 TIs commercial 64k SRAM
March 2004 Apples Xserve G5
End 2004 AMD 90nm processor
9
Novel SOI Devices
  • Dual gate SOI.
  • SOI Single electron transistors.

10
Double-Gate SOI MOSFET
  • ITRS roadmap dual gate SOI at 15nm.
  • Thick gate oxide to ensure equal thickness on
    both sides.

IEEE Tran on Elec. Dev. 50,3,March
2003,Ultimately Thin Double-Gate SOI
MOSFETs Thomas Ernst et al.
11
Issues Negative resist for EBL
  • PMMA resist is a good positive resist for EBL.
  • Do we have a good negative EBL resist ? high
    resolution.
  • NO ? alternate techniques.

12
Negative Resist SOI ?
  • EBL.
  • Plasma oxidation.
  • Etching of amorphous silicon.
  • BOX removal.

13
Negative resist silicon ?
  • EBL
  • Plasma oxidation
  • Electron cyclotron resonance chlorine etching of
    silicon.

14
SOI SET
15
TEM image of trenches
16
AFM image of SET
17
Conductance Oscillations Vds 10mV
18
SET by pattern dependent oxidation
19
Pattern dependent oxidation
20
Pattern dependent oxidation
  • Thermal gate oxidation.
  • Oxygen diffuses through the BOX and reaches the
    pattern edges which are oxidized.
  • Stresses due to volume change prevent oxidation
    of the island.

21
Conductance Oscillations Ld50nm Vds 1mV
22
Conductance Oscillations Ld70nm Vds 1mV
23
Conductance Oscillations Ld100nm Vds 1mV
24
Gate capacitance vs Ld
25
Summary
  • Future devices will involve SOI.
  • SOI provides certain benefits over bulk CMOS for
    smaller gate lengths.
  • SOI SETs may become a promising technology in the
    future.
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