Intermediate Tracker

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Intermediate Tracker

• Introduction
• Intermediate trackers/FTD for LC
• Simulation study
• Outside Si-tracker option
• Silicon strip RD for the intermediate tracker
• Summary

• H. J. Kim, KNU
• 2004/11/09 7th ACFA workshop

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? Why VTX and tracking important?
recoil mass reconstruction - importance of
tracking resolution
q qbar ( b bbar -gt Vertex! )
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General view of Three detector option
GLD(Huge)
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Purpose of Intermediate Tracker
To improve 1) the linking efficiency of a main
track to the corresponding VTX hits,2) the
reconstruction efficiency of low-momentum tracks
and of particles which decay between the VTX and
the Main tracking system 3) the momentum
resolution of tracks. If the beam background
is very severe, you can turn off the HV of inner
layers of TPC without serious performance
loss Trigger and/or Time stamping
capability Standalone tracking
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(No Transcript)
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Silicon Tracking for SiD (Jaross talk)

• Why silicon microstrips? SiD
  starting point Robust against
  beam halo showers Thin, even for forward
  tracks. Wont degrade ECALStable alignment
  and calibration. No wandering T to D.
• Excellent momentum resolution (?p/p22 x
  10-5)

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TESLA tracking system
Magnetic field 4 Tesla
cos(q).995
from TESLA TDR
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From Behnkes talk
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From Behnkes talk
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Typical Large/Huge models under consideration
Large/Huge
GLC design (ACFA)
m
m
SC-coil
SC-coil
HCAL (Pb(Fe)/scinti or digital)
Pb/scinti HCAL
W/Scinti ECAL
Pb/Scinti ECAL
TPC (Jet chamber as option)
Jet chamber
Si intermedi.-Trk
Si intermedi.-Trk
SiVTX pixel(cold version)
SiVTX pixel
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? Intermediate Tracker Configuration
stand-alone tracking capability
5 layers at r 9 to 37 cm angular coverage
cosTlt0.9 spatial resolution s 10 µm
thickness of a layer 0.6 Xo
Huge detector concept TPC Rmin 40 cm
Do not expect much changes in IT
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Intermediate Tracker Designfor GLC -
Double-sided silicon microstrip detectors
i. excellent spatial resolution ii.
well-established technology


Layout of the IT surrounding the VTX.- The
distance between the last layer of VTX and the
first layer of Trackeris about 39cm in Large
detector design.i. 5 layers of coaxial
cylinders at 9, 16, 23, 30 and 37cmii. covers
lt0.90 coinciding with the region covered by
VTX
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Momentum Resolution
10, 20, 30, 40 w/ std. design parameters
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Linking Efficiency
Linking efficiency is able to be measured by
Residual which is defined as a precision from
the difference of distance between the position
of extrapolate track of main tracking the hit
position on IT or VTX layers
Figure. The definition of Residuals.
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Residuals for a single pion
For a single pion, a linking efficiency with
ITVTX is improved by 20 compared to that
with VTX only.
Residuals vs. generation energy for a single pion
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Why Si Tracker ? (Sugimotos talk)

• 5x10-5 does not satisfy the design criteria if
  the beam energy spread is 0.1
• The performance goal should be 2x10-5
• How?
• ? Outside Si Tracker for a Huge Detector ???

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The Detector Model

• Si Vertex Detector
• 5 layers, t70mm, s3mm
• cosq lt 1 (non-realistic)
• Si Inner Tracker
• 3 layers (12, 24, 36 cm), t300mm, s7mm
• cosq lt1 (non-realistic)
• TPC
• 40cm lt R lt 200cm, Zlt235cm
• Ar gas, 220 samples, s150mm
• Si Outer Tracker
• R205cm(barrel)/Z250cm(EC), s7mm
• Momentum resolution is calculated following
  Glucksterns method
• No sophisticated method such as Kalman filter is
  used

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Performance
DPt/Pt2
Pt (GeV/c)
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Performance
DP/P2 (M.S. not included)
FTD?
cosq
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? Silicon sensor RD lt- Details by B.G.Cheon

• double sided silicon strip
• tree metal process
• implant strips in ohmic
• side are orthogonal to
• those in junction side
• readout strips in junction
• side have the same
• direction as that of ohmic
• side

Front Side - brown implanted n - blue
p-stop - sky blue SiO2 - gray Al for
readout
Back Side - blue implanted p - first gray
1st metal - sky blue SiO2 - vertical gray
VIA - second gray 2nd metal
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? MASK Design P Side
64ch 100um pitch sensor
512ch 100um pitch sensor Without hour glass
1cm PIN Diode
16ch 100um pitch sensor
32ch 100um pitch sensor
For SDD RD
PIN Diode array
512ch 100um pitch sensor With hour glass
16ch 100um pitch SSD
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? Silicon Sensor
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? Measurements
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? Measurements of the sensor
These are disappeared after insulating wafer edges
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? Sensor Readout
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USB2 with 25Mhz 12bit FADC for Readout RD
FX2
CPLD
FADC
input
trigger
31 FPGA I/O for RD
SRAM
Flash RAM
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Radiation hardness beamtest with proton

• Radiation damage problem
• -gt Signal reduction
• -gt Noise increase
• -gt Depletion voltage increase
• -gt Sensor damage
• Radiation damage Measurement
• -gt 30-50MeV Cyclotron proton, neutron beam
  irradiation
• (Korean cancer center hospital, Seoul, Korea)
• -gt Leakage current measurement
• -gt Capacitance measurement
• -gt Signal measurement
• Processing improvement
• -gt Radiation damage characteristics study
• -gt Radiation hardness improvement

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Intermediate Tracker RD Activities in Korea
v linking and reconstruction efficiency (Fast
Simulation) v track momentum resolution (Full
Simulation) v DSSD simulation/design/fabrication
Electronics(RC chip, VA1TA, FADC), DAQ v S/N
ratio measurement and beam test
DAQ/Electronics/Test
KNU/KU/CNU
Sensor
Sensor design Process chart
KNU / SNU
Simulation (process and device)
KNU/SKKU
- Kyungpook National University -
Korea University - Seoul National University
- Chunnam National University -
Sungkyunkwan University
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Summary

• Intermediate Tracker is necessary to improve
  momentum resolution and track linking efficiency
• TPCSi Tracker System in GLD including SOT will
  satisfy the original design criteria even for
  DEb0.1 in wide angular range (cosqlt0.9).
• Double (single) side silicon strip sensor RD is
  ongoing in Korea

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Study issue

• Intermediate tracker geometry optimization
• FTD geometry optimization
• Double side vs Single side strip senor
• Intermediate tracker trigger?
• Time stamping (Separation of bunches)
• Radiation hardness
• Mechanical structure

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Backup slide
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? Cleaning Room
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? MASK Design N Side
64ch 50um pitch sensor
512ch 50um pitch sensor
32ch 50um pitch sensor
1cm PIN Diode
16ch 50um pitch sensor
For SDD RD
PIN Diode array
Backside of SSD
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Radiation damage by n, p and e
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? Intermediate Tracker Option
Require good srF and sz Reasonable
(moderate) cost
Type srF sz
MSGC GEM 30µ 30µm Fast Signal
SSD 10 µm 20 µm
Straw Chamber 50 µm 1mm
Fiber Tracker 50 µm 1mm Fast Signal
Inner DC 80 µm 1mm
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DPt/Pt2 Measurement Term
SiD GLD (sSi7mm) GLD (sSi10mm) TESLA (sSi10mm) TESLA (sSi7mm)
TPC 1.2x10-4 1.2x10-4 1.5x10-4 1.5x10-4
VTXTPC 4.6x10-5 4.6x10-5 5.2x10-5 5.2x10-5
VTXSITTPC 2.9x10-5 3.4x10-5 4.1x10-5 3.5x10-5
VTXSITTPCSOT 1.9x10-5 2.3x10-5 2.6x10-5 2.2x10-5
VTXSITSOT 2.1x10-5 2.4x10-5 3.2x10-5 3.7x10-5 2.8x10-5
sVTX3mm in all cases