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MEMS: Basic structures

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MEMS: Basic structures & Current Applications Presented by: Amit Kumar Sharma Amit Bansal Amit Goyal What are MEMs? Micro Electro Mechanical Systems/Sensors. – PowerPoint PPT presentation

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Title: MEMS: Basic structures


1
MEMS Basic structures Current Applications
  • Presented by
  • Amit Kumar Sharma
  • Amit Bansal
  • Amit Goyal

2
What are MEMs?
  • Micro Electro Mechanical Systems/Sensors.
  • Machines fabricated at micro scale .
  • The basic principles being that of Electrical and
    Mechanical machines.
  • In the simplest terms miniaturization of
    electro-mechanical devices by application of
    semiconductor fabrication techniques.

3
MEMs

4
Microengine(Comb Drive Actuator)
  • How they work
  • The light brown fingers are fixed to the
    substrate, and the black fingers are free to
    move. 
  • By applying a voltage alternately to the top and
    bottom brown fingers, the electrostatic force
    causes the black structure to start to resonate. 
  • A mass attached to the comb drive resonator can
    be made to translate

5
Microengine(Comb Drive Actuator)
6
Microengine(Comb Drive Actuator)
7
Microengine(Comb Drive Actuator)
8
Microengine(Comb Drive Actuator)
9
Microengine(Comb Drive Actuator)
10
Microengine(Comb Drive Actuator)
11
Microengine(Comb Drive Actuator)
12
Microengine(Comb Drive Actuator)
13
Microengine(Comb Drive Actuator)
14
Microengine(Comb Drive Actuator)
15
Microengine(Comb Drive Actuator)
16
Microengine(Comb Drive Actuator)
17
Microengine(Comb Drive Actuator)
18
Microengine(Comb Drive Actuator)
19
Microengine(Comb Drive Actuator)
20
Microengine(Comb Drive Actuator)
21
Microtransmission(Gears and Shaft)
  • To increase the torque available from a rotary
    drive, a multi-layer microtransmission was
    developed.
  • Output gear of a microengine, may be meshed with
    a linear rack to provide linear motion with a
    high degree of force.

22
Microtransmission(Gears and Shaft) contd.
  • The transmission, shown, employs sets of small
    and large gears that mesh with each other to
    transfer power while providing torque
    multiplication and speed reduction .

23
Micromirror(Digital Micromirror Devices )
  • DMD's are large matrix (640 by 480 and higher) of
    tiny mirrors (16µm square mirrors with 1µm
    spacing between mirrors).
  • DMDs are used in smaller, lighter display
    devices having better resolutions.

24
Micromirror(Digital Micromirror Devices )
  • On a DMD consists of three physical layers and
    two "airgap" layers. The airgap layers separate
    the three physical layers and allow the mirror to
    tilt 10 or -10 degrees.
  • When a voltage is applied to either of the
    address electrodes, the mirrors can tilt 10
    degrees or -10 degrees, representing "on" or
    "off" in a digital signal.

25
APPLICATIONS
26
Three-axis accelerometer
  • inertial sensors, examples of which are Analog
    Devices ADXL1508 and Motorola's XMMAS40GWB9. The
    primary application of these accelerometers is as
    airbag-deployment sensors in automobiles, but
    they are also being used as tilt or shock sensors
  • The application of these types of accelerometers
    as inertial measurement units is limited by the
    need to manually align and assemble them into
    three-axis systems, the resulting alignment
    tolerances, their lack of on-chip A/D conversion
    circuitry, and their lower limit of sensitivity.

27
Three-axis accelerometer contd.
  • For inertial measurement
  • units (three-axis
  • acceleration and three-axis
  • rotation rate) were built
  • using Sandias Integrated
  • MicroElectroMechanical
  • Systems (IMEMS) Technology.
  • This system-on-a-chip is a
  • realization of a full three-
  • axis inertial measurement
  • unit that does not require
  • manual assembly and
  • alignment of sense axes.

28
Projection TV
  • Home theater system
  • Screen size greater than 40 inches (101 cm)

29
Projection TV
  • In a projector, light shines on the DMD. Light
    hitting the "on" mirror will reflect through the
    projection lens to the screen. Light hitting the
    "off" mirror will reflect to a light absorber.
    Each mirror is individually controlled and is
    totally independent of all the other mirrors.

30
The Future of Projection TV virtual reality
31
Microactuator
  • Microactuator for HDD is developed to satisfy the
    growing needs for higher track density and higher
    performance of the future generation drives

32
Microactuator
  • a micro-actuator attached between the slider and
    the suspension beam in order to move the slider
    with high speed and high accuracy.

33
Microactuator
  • To achieve relative motion between the head and
    suspension, the device pictured below positions
    the rotor with tiny springs and generates forces
    between rotor and stator using electrostatic
    attraction.

34
Micromechanical Switches
  • Low contact resistance.
  • Low threshold voltage.
  • High switching speed

35
Micromechanical Switches
  • When a voltage is applied to the gate electrode,
    the beam is pulled down by electrostatic force
    until the switch closes.
  • When the gate voltage is removed, the restoring
    force on the beam returns it to its original
    position.


36
Micromechanical Switches
  • SEM micrograph of a completed three terminal
    switch.
  • Low contact resistance.
  • Low threshold voltage.
  • High switching speed

37
Conclusion
  • A technology involving micromachined devices
    embedded below the surface of a wafer, prior to
    fabrication of microelectronic devices, was
    developed and applied to build complex sensor
    systems on a single chip. A three-layer
    polysilicon process made possible intricate
    coupling mechanisms that link linear comb-drive
    actuators to multiple rotating gears. This
    technology has been used to build devices such as
    microengines, microtransmissions, and
    micromirrors. These devices were also combined to
    yield intricate mechanical systems-on-a-chip.

38
Conclusion
  • The predominant technology at present state is
    surface micromachining, and current developments
    show that this trend will continue in the future.
  • The other industries such as space, aeronautical,
    and automotive will continues to substitute the
    conventional sensors with the MEMS equivalents.
  • The designer of electromechanical systems should
    pay attention to the availability of sensors and
    devices on the market.
  • When possible, the choice have to fall on MEMS
    devices, as these are commonly cheaper, more
    accurate and reliable, and less cumbersome.
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