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Materials Classification and Properties Metals, Ceramics, and Semiconductors

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Properties of Materials. Physical. Mechanical. Chemical. Thermal. Electrical. Optical ... shear, torsion. Deformation. Hardness. Chemical Properties ... – PowerPoint PPT presentation

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Title: Materials Classification and Properties Metals, Ceramics, and Semiconductors


1
Materials Classification and PropertiesMetals,
Ceramics, and Semiconductors
  • NANO 52
  • Foothill College

2
Properties of Materials
  • Physical
  • Mechanical
  • Chemical
  • Thermal
  • Electrical
  • Optical

3
Physical Properties
  • Strength
  • Ductility
  • Melting point
  • Glass transition
  • Density

4
Mechanical Properties
  • Stress strain behavior
  • Strength
  • Tensile properties
  • Compression, shear, torsion
  • Deformation
  • Hardness

5
Chemical Properties
  • Acid - base
  • Reactivity
  • Corrosion
  • Oxidation
  • Passivation

6
Thermal Properties
  • Heat conductance
  • Heat capacity
  • Thermal expansion
  • Annealing temperature
  • (Melting point, softening point)

7
Electrical Properties
  • Electrical conductivity
  • Electrical resistance/impedance

8
http//www.corrosionsource.com/
9
Metal Structure / Bonding
  • Metallic bonds
  • All metals are made up of a vast collection of
    ions that are held together by metallic bonds.
  • A metal atom has a positive nucleus with negative
    electrons outside of it.
  • In a solid, each atom loses the outermost
    electron, which takes part in bonding.
  • They form a lattice of regularly spaced positive
    ions. Each ion has no control over its bonding
    electron.

http//www.chm.bris.ac.uk/pt/harvey/gcse/other.htm
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10
Examples of Ceramics
  • Clay, Minerals, Salts and Oxides
  • Technical Ceramics can also be classified into
    three distinct material categories
  • Oxides Alumina, zirconia
  • Non-oxides Carbides, borides, nitrides
  • Composites Particulate reinforced, combinations
    of oxides and non-oxides.

11
Ionic Bonding in Ceramics
  • Ceramic materials are formed from ionic bonds
    within their constituent atoms, oxides and salts.
  • Ionic bonds are not nearly as ductile as
    metals, causing ceramics to be brittle.

12
Metallic vs. Ionic Bonding
  • Much easier to deform materials with metallic
    than with ionic bonding. Why?
  • Sliding atom planes over each other (deformation)
    very unfavorable energetically in ionic solids!
  • ? metals are ductile ceramics (ionic) are
    brittle

13
Semiconductors
14
Semiconductors
http//worldwatts.com/silicon_semiconductor.html
15
Semiconductors
  • In solid state physics and related applied
    fields, the band gap is the energy difference
    between the top of the valence band and the
    bottom of the conduction band in insulators and
    semiconductors.

16
Semiconductors
  • The ease with which electrons in a semiconductor
    can be excited from the valence band to the
    conduction band depends on the band gap between
    the bands, and it is the size of this energy
    bandgap that serves as an arbitrary dividing line
    (roughly 4 eV) between semiconductors and
    insulators.
  • Electrons excited to the conduction band also
    leave behind electron holes, or unoccupied states
    in the valence band. Both the conduction band
    electrons and the valence band holes contribute
    to electrical conductivity.
  • The holes themselves don't actually move, but a
    neighboring electron can move to fill the hole,
    leaving a hole at the place it has just come
    from, and in this way the holes appear to move,
    and the holes behave as if they were actual
    positively charged particles.
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