The THERMODEL program

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The THERMODEL program

• Fast and accurate model generation, based on
  dynamic thermal responses which are either
  measured or simulated
• network identification by deconvolution
• both time domain (transient) and frequency domain
  responses (thermal Bode plots) can be specified
  as input
• output RC ladder network (two-port model)
• Tipical application model generation for
  thermal/electro-thermal simulations

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A cantiliver was investigated. At its free
standing end P dissipation step was forced. The
response for this excitation was simulated by a
FEM tool. By using the FEM transient simulation
results as input, the compact model of this
cantiliver was generated by THERMODEL, in form of
a thermal RC ladder. The figure below the
shows, that the maxima of the time-constant
spectrum calculated by THERMODEL coinside with
the discrete time constants of the analaitical
model of the cantiliver.

• Application example I
• MEMS modeling

FEM results
THERMODEL results
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Application example II

The first derivative of the real part of the
thermal Bode plot used by THERMODEL
The thermal transfer impedance between a given
T(s) location and a dissipator on an IC chip
surface was modeled. The thermal Bode plot of the
above structure was provided by a thermal
simulator (THERMAN). Based on this thermal Bode
plot THERMODEL generated an RC ladder network
composed of 18 stages.
Loci provided by the RC model generated by
THERMODEL and the thermal simulator
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Application example III electro-thermal
simulation of integrated circuits

THERMODEL
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Electro-thermal simulation of IC-s compact
thermal model by THERMODEL