Overall ECAL schedule - PowerPoint PPT Presentation

About This Presentation
Title:

Overall ECAL schedule

Description:

Design now frozen after two iterations. Production to start any day, finish by end of Dec ... Testing and firmware development. 1 October 2003. Paul Dauncey. 5 ... – PowerPoint PPT presentation

Number of Views:18
Avg rating:3.0/5.0
Slides: 8
Provided by: paulda6
Category:

less

Transcript and Presenter's Notes

Title: Overall ECAL schedule


1
Overall ECAL schedule
  • Mechanics components will be complete by end of
    year
  • To assemble ECAL, they need the VFE boards
  • VFE boards require VFE chips and PCBs to be
    complete
  • VFE chips
  • Design now frozen after two iterations
  • Production to start any day, finish by end of Dec
  • Will be tested by the end of Jan
  • VFE PCBs
  • Design close to being fixed
  • Will have two pre-production boards assembled by
    end of Nov
  • Testing complete by end of Dec
  • Complete PCB production in Jan
  • Assembly of the VFE boards to start in Feb
  • Start ECAL assembly in Mar
  • System test with cosmics in Paris at latest in
    Jul, DESY beam test in Aug

2
BUT
  • Considered essential to have a VFE board/readout
    board test before VFE PCB production
  • N.B. Too late to test prototype/prototype before
    their pre-production
  • Will be preproduction/prototype so hard to argue
    they need to change if problems found
  • Schedule would have VFE PCBs released for
    production in Jan
  • To not cause a delay to this (and hence whole
    ECAL), would need to do VFE/readout test in Dec
  • Possible but not likely given prototype readout
    boards arriving in early Nov
  • We said at Paris we would aim for asap but Jan at
    latest
  • This gives one month delay to whole ECAL assembly
    schedule
  • But still aim for DESY beam test in Aug
  • Despite delays of 3 months to other parts of
    the project, we are the critical path for the
    whole ECAL

3
Longer term
  • Working backwards from the end
  • DESY beam test in Aug and system test in Jul mean
    we need (minimum of) Jun for testing after board
    production
  • One month is short for board production tests,
    crate test, testing all final firmware, system
    tests/commissioning, etc.
  • Production fabrication and assembly must finish
    by end of May
  • One month for this should be reasonable
  • Production layout must finish by end of Apr
  • Assuming changes are needed
  • Redesign must finish by end of Mar
  • This assumes one month for layout (!) after
    changes finalised

4
Testing and firmware development
  • We therefore have three deadlines for
    firmware/testing
  • End of Dec be ready for VFE/readout test
  • Presumably using Chipscope, not final firmware
  • End of Mar identify all changes to board
  • Finalise hardware changes in time for re-layout
    (if needed)
  • End of Jun be ready for system test
  • Need final, fully-functional versions of all
    firmware
  • All three are critical path for whole ECAL
    project
  • The final one is self-explanatory lets consider
    the other two in more detail

5
VFE/readout tests by end Dec
  • Four sets of tests which we need to do
  • Run the basic readout sequence and see data out
    of ADCs
  • Trigger/SH can be randomly timed dont need
    320MHz fine adjust
  • Measure the noise in this configuration
  • Need to take 100s of events and record ADC
    values of all 216 chns
  • Need to tune timing parameters of readout
    sequence turn-around for changing them 30 mins?
    Is this too long for sensible testing?
  • Use the DACs to see signals above the pedestals
    and get a (non-)linearity measurement
  • Need DACs, calibration pulse and to have fine
    320MHz adjust of SH
  • Use the Paris cosmic testbench to see cosmic
    signals
  • Need external trigger to fire FE sequence need
    BE trigger logic to veto further triggers or can
    use Chipscope?
  • This implies the tests will be done in Paris
    only one fully-loaded pre-prototype VFE
    PCB anyway so unlikely to let us borrow it

6
VFE/readout tests (cont)
The parts of the FE which need to be working for
tests 1 2 3 4
7
Board changes/verification by end Mar
  • Connectivity/layout errors
  • JTAG tests will find these quickly
  • Choice of FE FPGA component size/speed
  • Need semi-final versions of FE code to be sure
    what would be enough?
  • Too much ADC noise
  • Will be known at time of VFE tests
  • Cause and solution may be harder to determine
  • Missing VME functionality
  • E.g. those not used (tested?) by CMS DMA and VME
    interrupts
  • Miscellaneous features or missing functionality
  • How bad would these have to be for us to fix them
    if we find them?
  • VFE required changes
  • Should be found during VFE tests
  • To be really sure, should have full system
    working what is enough?
Write a Comment
User Comments (0)
About PowerShow.com