Title: Digital Integrated Circuits A Design Perspective
1Digital Integrated CircuitsA Design Perspective
Jan M. Rabaey Anantha Chandrakasan Borivoje
Nikolic
Designing CombinationalLogic Circuits
November 2002.
2Combinational vs. Sequential Logic
Combinational
Sequential
Output
(
)
f
In, Previous In
Output
(
)
f
In
3Static CMOS Circuit
4Static Complementary CMOS
VDD
In1
PMOS only
In2
PUN
InN
F(In1,In2,InN)
In1
In2
PDN
NMOS only
InN
PUN and PDN are dual logic networks
5NMOS Transistors in Series/Parallel Connection
Transistors can be thought as a switch controlled
by its gate signal NMOS switch closes when switch
control input is high
6PMOS Transistors in Series/Parallel Connection
7Threshold Drops
VDD
VDD
PUN
S
D
VDD
D
S
0 ? VDD
0 ? VDD - VTn
VGS
VDD ? 0
PDN
VDD ? VTp
VGS
S
D
VDD
S
D
8Complementary CMOS Logic Style
9Example Gate NAND
10Example Gate NOR
11Complex CMOS Gate
OUT D A (B C)
A
D
B
C
12Constructing a Complex Gate
13Properties of Complementary CMOS Gates Snapshot
High noise margins
V
and
V
are at
V
and
GND
, respectively.
OH
OL
DD
No static power consumption
There never exists a direct path between
V
and
DD
V
(
GND
) in steady-state mode
.
SS
Comparable rise and fall times
(under appropriate sizing conditions)
14CMOS Properties
- Full rail-to-rail swing high noise margins
- Logic levels not dependent upon the relative
device sizes ratioless - Always a path to Vdd or Gnd in steady state low
output impedance - Extremely high input resistance nearly zero
steady-state input current - No direct path steady state between power and
ground no static power dissipation - Propagation delay function of load capacitance
and resistance of transistors
15Switch Delay Model
Req
A
A
NOR2
INV
NAND2
16Input Pattern Effects on Delay
- Delay is dependent on the pattern of inputs
- Low to high transition
- both inputs go low
- delay is 0.69 Rp/2 CL
- one input goes low
- delay is 0.69 Rp CL
- High to low transition
- both inputs go high
- delay is 0.69 2Rn CL
Rn
B
17Delay Dependence on Input Patterns
AB1?0
A1 ?0, B1
A1, B1?0
Voltage V
time ps
NMOS 0.5?m/0.25 ?m PMOS 0.75?m/0.25 ?m CL
100 fF
18Transistor Sizing
4 4
2 2
19Transistor Sizing a Complex CMOS Gate
B
8
6
4
3
C
8
6
4
6
OUT D A (B C)
A
2
D
1
B
C
2
2
20Fan-In Considerations
A
Distributed RC model
(Elmore delay) tpHL 0.69 Reqn(C12C23C34CL)
Propagation delay deteriorates rapidly as a
function of fan-in quadratically in the worst
case.
B
C
D
21tp as a Function of Fan-In
Gates with a fan-in greater than 4 should be
avoided.
tp (psec)
tpLH
fan-in
22tp as a Function of Fan-Out
All gates have the same drive current.
tpNOR2
tpNAND2
tpINV
tp (psec)
Slope is a function of driving strength
eff. fan-out
23tp as a Function of Fan-In and Fan-Out
- Fan-in quadratic due to increasing resistance
and capacitance - Fan-out each additional fan-out gate adds two
gate capacitances to CL - tp a1FI a2FI2 a3FO
24Fast Complex GatesDesign Technique 1
- Transistor sizing
- as long as fan-out capacitance dominates
- Progressive sizing
Distributed RC line M1 gt M2 gt M3 gt gt MN (the
fet closest to the output is the smallest)
InN
MN
In3
M3
In2
M2
Can reduce delay by more than 20 decreasing
gains as technology shrinks
In1
M1
25Fast Complex GatesDesign Technique 2
critical path
critical path
0?1
charged
charged
In1
1
In3
M3
M3
1
In2
1
In2
M2
discharged
M2
charged
1
In3
discharged
In1
M1
charged
M1
0?1
delay determined by time to discharge CL, C1 and
C2
delay determined by time to discharge CL
26Fast Complex GatesDesign Technique 3
- Alternative logic structures
F ABCDEFGH
27Fast Complex GatesDesign Technique 4
- Isolating fan-in from fan-out using buffer
insertion
28Fast Complex GatesDesign Technique 5
- Reducing the voltage swing
- linear reduction in delay
- also reduces power consumption
- But the following gate is much slower!
- Or requires use of sense amplifiers on the
receiving end to restore the signal level (memory
design)
tpHL 0.69 (3/4 (CL VDD)/ IDSATn )
0.69 (3/4 (CL Vswing)/ IDSATn )
29Sizing Logic Paths for Speed
- Frequently, input capacitance of a logic path is
constrained - Logic also has to drive some capacitance
- Example ALU load in an Intels microprocessor is
0.5pF - How do we size the ALU datapath to achieve
maximum speed? - We have already solved this for the inverter
chain can we generalize it for any type of
logic?
30Buffer Example
In
Out
CL
1
2
N
(in units of tinv)
For given N Ci1/Ci Ci/Ci-1 To find N Ci1/Ci
4 How to generalize this to any logic path?
31Ratioed Logic
32Ratioed Logic
33Ratioed Logic
34Active Loads
35Pseudo-NMOS
36Pseudo-NMOS VTC
3.0
2.5
W/L
4
2.0
p
1.5
V
W/L
2
t
u
p
o
V
1.0
W/L
0.5
W/L
1
p
p
0.5
W/L
0.25
p
0.0
0.0
0.5
1.0
1.5
2.0
2.5
V
V
in
37Improved Loads (2)
V
V
DD
DD
M1
M2
Out
Out
A
A
PDN1
PDN2
B
B
V
V
SS
SS
Differential Cascode Voltage Switch Logic (DCVSL)
38DCVSL Example
39DCVSL Transient Response
A B
V
e
A B
g
a
t
l
o
A
,
B
V
A,B
Time ns
40Pass-TransistorLogic
41Pass-Transistor Logic
42Example AND Gate
43NMOS-Only Logic
3.0
In
Out
2.0
V
x
e
g
a
t
l
o
V
1.0
0.0
0
0.5
1
1.5
2
Time ns
44NMOS-only Switch
V
C
2.5 V
C
2.5
M
2
A
2.5 V
B
A
2.5 V
M
n
B
M
C
1
L
does not pull up to 2.5V, but 2.5V -
V
V
TN
B
Threshold voltage loss causes
static power consumption
NMOS has higher threshold than PMOS (body effect)
45NMOS Only Logic Level Restoring Transistor
V
DD
V
DD
Level Restorer
M
r
B
M
2
X
M
A
Out
n
M
1
Advantage Full Swing
Restorer adds capacitance, takes away pull down
current at X
Ratio problem
46Restorer Sizing
3.0
- Upper limit on restorer size
- Pass-transistor pull-downcan have several
transistors in stack
W
/
L
1.75/0.25
V
r
e
W
/
L
1.50/0.25
g
r
a
t
l
o
V
W
/
L
1.25/0.25
W
/
L
1.0/0.25
r
r
Time ps
47Solution 2 Single Transistor Pass Gate with VT0
V
DD
V
DD
0V
2.5V
Out
0V
V
DD
2.5V
WATCH OUT FOR LEAKAGE CURRENTS
48Complementary Pass Transistor Logic
49Solution 3 Transmission Gate
C
C
A
A
B
B
C
C
C
2.5 V
A
2.5 V
B
C
L
C
0 V
50Resistance of Transmission Gate
51Pass-Transistor Based Multiplexer
S
VDD
GND
In1
In2
S
52Transmission Gate XOR
B
B
M2
A
A
F
M1
M3/M4
B
B
53Delay in Transmission Gate Networks
m
R
R
R
eq
eq
eq
In
C
C
C
C
(c)
54Delay Optimization
55Transmission Gate Full Adder
Similar delays for sum and carry
56Dynamic Logic
57Dynamic CMOS
- In static circuits at every point in time (except
when switching) the output is connected to either
GND or VDD via a low resistance path. - fan-in of n requires 2n (n N-type n P-type)
devices - Dynamic circuits rely on the temporary storage of
signal values on the capacitance of high
impedance nodes. - requires on n 2 (n1 N-type 1 P-type)
transistors
58Dynamic Gate
Mp
Clk
Out
In1
In2
PDN
In3
Me
Clk
Two phase operation Precharge (CLK 0)
Evaluate (CLK 1)
59Dynamic Gate
off
Mp
Clk
on
1
Out
In1
In2
PDN
In3
Me
Clk
off
on
Two phase operation Precharge (Clk 0)
Evaluate (Clk 1)
60Conditions on Output
- Once the output of a dynamic gate is discharged,
it cannot be charged again until the next
precharge operation. - Inputs to the gate can make at most one
transition during evaluation. - Output can be in the high impedance state during
and after evaluation (PDN off), state is stored
on CL
61Properties of Dynamic Gates
- Logic function is implemented by the PDN only
- number of transistors is N 2 (versus 2N for
static complementary CMOS) - Full swing outputs (VOL GND and VOH VDD)
- Non-ratioed - sizing of the devices does not
affect the logic levels - Faster switching speeds
- reduced load capacitance due to lower input
capacitance (Cin) - reduced load capacitance due to smaller output
loading (Cout) - no Isc, so all the current provided by PDN goes
into discharging CL
62Properties of Dynamic Gates
- Overall power dissipation usually higher than
static CMOS - no static current path ever exists between VDD
and GND (including Psc) - no glitching
- higher transition probabilities
- extra load on Clk
- PDN starts to work as soon as the input signals
exceed VTn, so VM, VIH and VIL equal to VTn - low noise margin (NML)
- Needs a precharge/evaluate clock
63Issues in Dynamic Design 1 Charge Leakage
CLK
Clk
Mp
Out
A
Evaluate
VOut
Clk
Me
Precharge
Leakage sources
Dominant component is subthreshold current
64Solution to Charge Leakage
Keeper
Clk
Mp
Mkp
A
Out
B
Clk
Me
Same approach as level restorer for
pass-transistor logic
65Issues in Dynamic Design 2 Charge Sharing
Charge stored originally on CL is redistributed
(shared) over CL and CA leading to reduced
robustness
Clk
Mp
Out
A
B0
Clk
Me
66Charge Sharing Example
Clk
Out
A
A
B
B
B
!B
C
C
Clk
67Charge Sharing
V
DD
M
Clk
p
Out
C
L
A
M
a
X
C
a
M
B
0
b
C
b
M
Clk
e
68Solution to Charge Redistribution
Clk
Clk
Mp
Mkp
Out
A
B
Clk
Me
Precharge internal nodes using a clock-driven
transistor (at the cost of increased area and
power)
69Issues in Dynamic Design 3 Backgate Coupling
Clk
Mp
Out1
1
Out2
0
In
A0
B0
Clk
Me
Dynamic NAND
Static NAND
70Backgate Coupling Effect
Out1
Voltage
Clk
Out2
In
Time, ns
71Issues in Dynamic Design 4 Clock Feedthrough
Coupling between Out and Clk input of the
precharge device due to the gate to drain
capacitance. So voltage of Out can rise above
VDD. The fast rising (and falling edges) of the
clock couple to Out.
Clk
Mp
Out
A
B
Clk
Me
72Clock Feedthrough
Clock feedthrough
Clk
Out
In1
In2
In3
In Clk
Voltage
In4
Out
Clk
Time, ns
Clock feedthrough
73Other Effects
- Capacitive coupling
- Substrate coupling
- Minority charge injection
- Supply noise (ground bounce)
74Cascading Dynamic Gates
V
Clk
Clk
Mp
Mp
Out2
Out1
In
Clk
Clk
Me
Me
t
Only 0 ? 1 transitions allowed at inputs!
75Domino Logic
Mp
Clk
Mkp
Mp
Clk
Out1
Out2
1 ? 1 1 ? 0
0 ? 0 0 ? 1
In1
In4
PDN
In2
PDN
In5
In3
Me
Clk
Me
Clk
76Why Domino?
Clk
Clk
Like falling dominos!
77Properties of Domino Logic
- Only non-inverting logic can be implemented
- Very high speed
- static inverter can be skewed, only L-H
transition - Input capacitance reduced smaller logical
effort
78np-CMOS
Me
Clk
Mp
Clk
Out1
1 ? 1 1 ? 0
In4
PUN
In1
In5
In2
PDN
0 ? 0 0 ? 1
In3
Out2 (to PDN)
Mp
Clk
Me
Clk
Only 0 ? 1 transitions allowed at inputs of PDN
Only 1 ? 0 transitions allowed at inputs of PUN
79NORA Logic
Me
Clk
Mp
Clk
Out1
1 ? 1 1 ? 0
In4
PUN
In1
In5
In2
PDN
0 ? 0 0 ? 1
In3
Out2 (to PDN)
Mp
Clk
Me
Clk
to other PDNs
to other PUNs
WARNING Very sensitive to noise!