Norwegian Advanced Instrumentation

1
Advanced instrumentation 2006-2011

• Outline of talk
• Introduction (groups, competences, projects
  underway, infrastructure, related projects)
• Four sub-projects
• RD for future silicon systems
• The Norwegian technical student program at CERN
• Support for an Industry Liaison with extended
  responsibilities related to Technology Transfer
  and recruitment
• Participation in the CLIC accelerator RD at CERN
• Summary

2
Advanced instrumentation 2006-2011

• Background
• Traditionally around half of the students in the
  Norwegian program are instrumentation students
  true also during LEP running due to the RDn
  programs at CERN
• Group competences and infrastructure see next
  slides
• International projects underway (SLHC, CMB at
  FAIR, ILC, medical imaging) also in next slides
• In additon to having a very solid scientific
  program at LHC to have more Norwegian CERN users
  at all levels must be the main goal for next
  period (this is also to be kept in mind for the
  physics projects)
• The following subprojects are essential for our
  CERN exploitation
• We now have around 10 technical students at CERN
  program led by Jens Vigen with financial
  contributions from the Norwegian Research
  Council, with additional contributions from the
  Universities and University Collegues sending
  the students (Bergen, NTNU, Sør-Trøndelag mostly)
• We have temporarily an ILO (ex technical student
  from NTNU with one year background in the
  Technology Transfer area at CERN) covering
  several areas of interest for the general
  Norwegian CERN exploitation
• A student is interested in carrying out a ph.d
  projects in accelerator physics (CERN has asked
  for in-kind contributions to CLIC RD) .... this
  person is finishing his Fellowship in ATLAS
  (Toroid system)

3
Recent/on-going activities relevant for the future

• Five major technology activities related to CERN
  
• Construction of silicon modules for ATLAS (UiB -
  Stugu, UiO Stapnes/Dorholt, SINTEF earlier -
  Avseth, HiG at some level - Wroldsen). Key effort
  from the electronics and mechanical workshops in
  Oslo, partly true also for workshops at UiB
• Completed successfully
• PHOS detector for ALICE (UiB - Klovning, UiO -
  Skaali, AME earlier - Hansen) note that AME and
  their technology development was strongly linked
  to CERN in 1980ies for LEP
• Ongoing
• High Level Trigger development for ALICE
  (UiB-Rohrich and Ullaland, HiB-Helstrup,
  UiO-Skaali and Tveter) high rates and high
  data-flow into readout and primary analysis
  stage
• Ongoing
• Construction of cryogenics tanks for ATLAS
  (NTNU-Owren, SB-verksted-Hansen, UiO
  partly-Stapnes) technology transfer NTNU/SINTEF
  to SB-verksted, and reference contract with CERN
• Completed succesfully
• RD50 (UiO Svensson and SINTEF) important and
  interesting RD work for the future linked to new
  facilities in Gaustadbekkdalen
• Onging and very important
• Here you find all skills needed to construct any
  detector system, including readout and
  datahandling ...
• __________________________________________________
  _________________________________________________
• Important note worth mentioning in other talks
  (for a different audience) than this
• This overview does not include the other half
  of the Norwegian CERN activities related to
  physics studies, simulation
• of physics processes and detectors, pattern
  recognition, data-analysis, GRID, computing
  methods, statistical methods
• etc, etc ..... I refer to the talks earlier today
  

4
RD50 - Radiation hard semiconductor devices for
very high luminosity colliders 
57 institutes (43 from EU) gt250 scientists

• Particle Detectors research lines _at_ UiO/PE
• Defect and impurity engineering of
  high-resistivity Si
• New materials primarily silicon carbide (SiC)
• Three-dimensional detector structures

5
MRL (Oslo, Aug-2003) 5000 m2

• Equipment
• Characterization laboratories, etc
• Electrical measurements Probe station, C-V,
  DLTS, ADSPEC/TSCAP (20- 106 Hz) (cryostats 10-700
  K, uniaxial stress), Laplace-O-DLTS
• Optical measurements PL, interferometry, inverse
  photoemission
• Scanning Nanoprobe ?-scopy (AFM, SSRM, TUNA,
  SCM) Foparken
• SIMS surface profilometer
• MEMS-lab etching, optical microscopes, etc

MeV ion accelerator at UiO/MRL Ion implantation
and RBS-analysis
SIMS instrument at UiO/MRL
National Electrostatics Corporation, 1 MV
terminal voltage
6
Electron microscope for e-beam lithography at UiO

• Equipment Status
• Clean Room (Synthesis,
• processing and
• characterization)
• Processing equipment (RTP, furnaces, evaporation,
  bonder, ....)
• ALCVD-lab
• Electron beam lithography (JEOL 6400F Raith-kit)
  (FUN-/NanoMAT)
• MeV implanter Rutherford Backscattering
  Spectrometry (RBS)
• Equipment from old SINTEF-lab is expected in late
  2004 (early 2005)

JEOL model JSM-6400F ELPHI Quantum (Raith)
7
SINTEF RD for CERN projects

• Partner (important) in infrastructure buildup in
  Gaustadbekkdalen their sensor lab has been
  moved to same facilities
• RD-20, CERN 1992-1994
• Dev.of High Resolution Si Strip Detectors for
  Exp.at High Luminosity at the LHC
• RD-48 (ROSE), CERN 1996-2000
• Radiation Hardening of Silicon Detectors
• RD-50, CERN 2002 - Collaboration with UiO
• Development of Radiation Hard Semiconductor
  Devices for Very High Luminosity Colliders
• SINTEF very interested in 3D sensors (Andreas
  Werner) and this project preparing a SFI
  application where 3D sensors is one sub-project.

8
Advanced instrumentation projects underway

• New RD period underway internationally
  (traditionally the periods where the CERN
  technology exchange is the most interesting for
  us)
• For LHC upgrades (CMS and ATLAS have now RD SG
  for upgrades with timescale 2014 2 years
• The detector technology close to the interaction
  point needs new development (in fact, the IDs
  will be completely replaced).
• The ATLAS B-layer is foreseen to be replaced in
  2012 and new sensors, more integrated approached,
  deeper sub-micron, new power schemes will need
  to be developed.
• For linear collider detectors several RD
  projects are ongoing and a conseptual design
  reports are foreseen by end 06-07 for
  accelerators and detectors https//wiki.lepp.corn
  ell.edu/wws/bin/view/Projects/WebHome
• Increased CERN RD for medical systems over the
  next decade (EU projects), and Norwegian
  activities at CERN related to Technology Transfer
  agreements and medical instrumentations
• For heavy ions see later

Driven by this plot, but also by lifetime of IR
quads 700 fb-1
9
LHC detector changes ID changes

• In the current ATLAS/CMS trackers a factor ten
  luminosity increase would imply that the
  detectors die within months, and/or become
  useless due to increased occupancy creating
  problems for the tracking, and/or going beyond
  the acceptable readout rates.
• This applies to both PIXEL and Strip systems in
  ATLAS and CMS. The TRT in ATLAS will have an
  occupancy which approaches 100 and cannot be
  used.
• An other way of saying this is that the current
  technologies, with important new developments
  could work at a factor 3 higher radius.
• So we are looking at a full silicon tracker (the
  best current example is CMS)

10
LHC detector upgrade Elements of new IDs ?

• Electronics in DSM work well, parts already
  tested to 100 MRad (and more but not powered), ie
  0.13um or 0.09um processes can do the job (CMOS
  or SiGe) - and costs are quite reasonable
• The lowest layers need special attention even
  more true for sensors (make replaceable?)
• Yield/costs ATLAS PIXEL chip has around 80
  yield, production costs promising (but
  prototyping costs large one iteration assumed
  in plot on the left)

• Sensors main issues are
• Reverse currents rise.
• Trapping increases.
• Bulk type inverts to effectively p-type
  depletion voltage increase.
• Consider to use p type bulk material to operate
  more effectively under-depleted, collection
  electrons (less trapping)
• For example A conservative target for SLHC short
  strips would be survival of 2 1015 cm-2 1MeV
  neutron equivalent, with S/N gt 10
• For PIXEL area more difficult, replaceable or 3D
  type (see RD50 studies for 1016 cm-2 1MeV neutron
  equivalent sensors)
• Both CMS and ATLAS have very good experience with
  sensor production and quality in current
  experiments
• For the innermost layer(s) special measures or
  replaceable system need to be considered most
  significant RD area

10,000e
5000e
Important RD area Very significant improvements
in power distribution (serial powering or rad
hard DC/DC) needed
11
Advanced instrumentation projects underway

• For ALICE running after 2012, there are a number
  of running options, the relative importance of
  which will depend on the initial results. Most
  probably this program will focus on rare probes
  and thus require higher luminosity and/or faster
  detectors and readout chains.
• A high-granularity silicon pixel detector, which
  is radiation hard and can be read out at high
  rates, is mandatory.
• QCD matter at large baryon densities is not
  sufficiently explored, neither experimentally nor
  theoretically. Nuclear reaction experiments at
  FAIR, the future facility at GSI (e.g. Compressed
  Baryonic Matter - CBM experiment) aim at a
  detailed and comprehensive investigation of
  super-dense baryonic matter. The research program
  includes the measurement of penetrating probes,
  which escape essentially undistorted from the
  compressed nuclear collision zone. The planned
  Compressed Baryonic Matter experiment at GSI is a
  natural follow-up of the ALICE program. Important
  physics questions would include the production of
  heavy quarks in nuclear matter.
• Due to the low energies involved the rate would
  be low, and successful measurements would require
  high rate collisions and triggers, and
  corresponding high-speed detectors and readout
  chains
• So in both cases the following technologies/resear
  ch fields are interesting
• 3D silicon pixel detectors have electrodes that
  go all the way through the bulk of the material.
  This allows the electrodes to be positioned much
  closer together without the need to reduce the
  thickness of the detector, and thus the active
  volume. The close positioning of the electrodes
  is beneficial for both the full depletion voltage
  and charge collection efficiency. 3d detectors
  are expected to be radiation tolerant.
• However, reading out the fine-granular pixels
  with high-speed requires the integration of
  electronics component on the detector and the
  development of a new high-speed readout and
  on-chip processing scheme in order to handle the
  huge data rate The DAQ concept will use
  self-triggered front-end electronics, where each
  particle hit is autonomously detected and the
  measured hit parameters are stored with precise
  timestamps in large buffer pools.

12
Advanced instrumentation CBM studies

• Vertex tracker (possible example of specs)
• 700 µm material budget tolerable
• about 35 µm x 35 µm pixel size needed
• only a small part (50 cm2) is exposed to very
  high doses replacing this part after a major D
  run is feasible
• required dose and also interaction rate depends
  on D0 efficiency thin detectors (100 µm) require
  significantly less than thick (700 µm) ones
• fast readout allowing clear event association
  very valuable (at least)
• THUS WANTED
• thin (lt700 µm)
• high resolution (s 10 µm)
• fast (best lt100 ns)
• radiation tolerant (30, better gt100 Mrad)
• self-triggered, high bandwidth FEE

13
International Research Training Group
Forskerskole

• Graduiertenkolleg Forskerskole
• Starting date 1.10.2004
• Successful meeting at UiB in April with 30-40
  participants, follow up now in September in
  Heidelberg, next meeting in Oslo in April
• Duration 4.5 years extendable by 4.5 years
• Funding
• DFG 12 stipends running costs
• UiB, UiO, HiB a few stipends 700 kNOK ?

14
IRTG - participants
15
IRTG research program

• Development and Application of Intelligent
  Detectors

• Includes
• physics simulation
• detector simulation
• detector construction, system integration
• readout design, development and operation
• trigger design, development and operation
• data handling and data management
• online data analysis
• offline data analysis
• GRID computing

• Applies to
• Nuclear Physics
• High Energy Physics
• Space Physics
• Detector Physics
• Sensoric
• Microelectronics and Electronics
• Computer Engineering
• Computer Science

16
Looming in the background Prototype cardiology
CdZnTe camera (IDEAS), and an X-ray camera
(INTERON goal) medical instrumentation
17
Advanced instrumentation proposed strategy

• Given the points discussed above the four
  sub-projects on page 1 have six main
• goals
• Join forces to develop challenging new silicon
  technology taking advantage of knowledge base and
  new infrastructure in Norway
• Focus on basic technology development the first
  three years, related to 3D silicon sensors and
  new integration methods for sensors and
  electronics.
• Include a large number of students, in silicon
  detector system research using fully the link to
  Forskerskole students.
• Establish a new ILO and TT system where the focus
  is longer term and on technology transfer and
  knowledge, via projects and human resources
  spending time on CERN, in addition to the
  traditional CERN contract follow up.
• Strengthen the technical students program, and
  co-ordinate training of Norwegian students to
  provide an overall consistent environment for
  them where there is increased contact between the
  students, Norwegian CERN staff and researchers,
  and Norwegian Industries being involved in CERN
  projects.
• Participate in CLIC accelerator research to have
  a minimal activity in accelerator research, and
  also to answers CERN request for voluntary
  contributions to CLIC.

18
Advanced instrumentation RD for future silicon
systems

• As mentioned the overall research objective is to
  produce and characterize 3D silicon sensors and
• to integrate transistors on the surface of these
  sensors.
• The production and characterization of the 3D
  detector itself will be done in collaboration
  with the
• MiNaLab in Oslo.
• The key steps are
• Formation of 3D structures
• Annealing and passivation of process induced
  defects in 3D structures
• Formation of p-n junctions in the 3D detector
  structures
• Characterisation of detector
• The integrated electronics has to be added as a
  second processing round with an appropriate CMOS
  process.
• The main goals of the project are therefore (one
  iteration)

19
Schematics of 3D- and ordinary detector structures

• Proposed by S.I. Parker, C.J. Kenney and J.
  Segal (NIM A 395 (1997) 328)
• Called 3-D because, in contrast to silicon
  planar technology, have three dimensional (3-D)
  electrodes penetrating the silicon substrate
• Important researches are now under investigation
  by a collaboration (not in RD50) within Brunel
  Univ., Hawaii Univ., Stanford Univ. and CERN

 
-
depletion thickness depends on p and n
electrode distance, not on the substrate
thickness ? (1) can operate at very low voltages
or (2) can have a high doping for ultra-high
radiation hardness
20
Charge collection in 3D sensors

• lower collection length than planar technology
• lower charge collection time than planar
  technology
• higher charge collection efficiency

computer simulations of the charge collection
dynamics for planar and 3D detectors
21
Real 3D devices
a 3D detector structure
a 3D structure grown at SINTEF
15 ?m
200 ?m
4 ?m
22
Semi-conductor systems Trends to be noted deep
sub micron
8192 pixel cells/die 13 millions
transistors/die 5 dies /detector Differential
preamp Power/die0.8W Pixel size50 x 450 ?m All
processing functions on cell ENC 100 e- rms _at_
Cdet0.1pF Threshold mismatch150 e-
rms Vdd1.8V Filtering 2 conjugate complex poles

• Beyond DSM processes (from CERN academic
  training)
• Is there an end to CMOS
• Ultimate CMOS nanoscale technology
• Introduction to mesoscopic physics
• Quantum confinement, and electronic transport in
  nanowires
• Quantum dots and Single Electron Tunneling (SET)
  Transistor
• Nanoelectronic systems

23
CERN and semi-conductor systems Trends to be
noted monolithic systems

• Motivation to develop a new pixel detector
• Radiation hardness improvement (leakage, reverse
  annealing issues)
• Decrease fabrication cost of pixel detector
• Develop a thin pixel detector
• Easy fabrication of large area devices
• Overcome readout limitation of Imaging
  architecture DEPFET MAPS
• Concepts of silicon pixel detectors in HEP(CCD
  excluded)
• 1st Hybrid silicon pixel
• 2nd DEPFET Monolithic on high resistivity
  substrate, bulk or SOI
• 3rd MAPS Monolithic on CMOS wafer substrate
• 4th concept not yet exploited deposition of
  detector material film on ASIC

Hybrid pixel
DEPFET pixel
MAPS
24
Semi-conductor systems Next steps

• Start 3D sensor development can start now
  will join forces/collaborate with US groups
  through ATLAS RD projects
• Evaluate electronics/readout components to
  integrate, methods to do it, and partner for
  carrying out the electronics development this
  project is less developed than the first
• Support and readout electronics, preparation for
  irradiations, etc can start right away too
• So basically this project can start immediately
  as soon as we have a funding base agreed

25
Advanced instrumentation Technical Students

• The Norwegian Technical student program is
  currently very successful and we wish to continue
  it. The ambitions are to keep it at the level of
  10-12 students yearly. From an initial investment
  of support for 3-4 months the students are
  typically extended by CERN to 12 months, and even
  14 months in some cases. The monthly cost is 3414
  CHF, i.e 17750 NOK.
• The two Norwegian CERN staff members who have
  been doing most of the work have been Jens Vigen
  and Nils Høimyr, and they are willing to continue
  to promote the program. Jens Vigen will lead the
  sub-project.
• Contract signed in 2005 on the right

26
Advanced instrumentation ILO

• Based on the experiences from 2005 and a project
  study carried out by the Norwegian Research
  Council the following
• job-description seems appropriate to covers these
  tasks
• Work as the Norwegian Industry Liaison Officer
  (ILO)
• Identify tenders at CERN that can be relevant for
  Norwegian companies and contact these companies
• Give support to the companies which want to
  receive an invitation to tender
• Participate in the negotiation between CERN and
  companies when this is needed
• Keep an active relationship with the technical
  department and the Norwegian staff at CERN to get
  Norwegian companies involved in the requirement
  specification process in forthcoming projects
• Attend to Norwegian technology and trade shows to
  promote CERN as a potential buyer of products and
  services
• Work as the Norwegian Technology Transfer Officer
  (TTO)
• Identify technologies developed at CERN which can
  be interesting for Norwegian companies
• Carry through marked researches for Norway on
  these technologies and contact the relevant
  companies
• Attempt to get Norwegian companies, research
  institutions and university into relevant
  pre-competitive RD collaborations at CERN
• Attend to Norwegian technology and trade shows to
  promote CERN technology
• Work as an employment contact
• Function as a contact person for Norwegian CERN
  job applicants and for the Norwegian employment
  service (AETAT)
• Contribute in the recruitment and promotion work
  of CERN at Norwegian universities and university
  colleges with the purpose of increasing the
  number of students and scientist at CERN and
  increase the interest for in general

27
Advanced instrumentation accelerator physics

• The specific goal of this sub-project is to
  support a Norwegian activity, specifically a Ph.D
  grant, with the goal of setting up a test beam
  line to prove the feasibility of the CLIC drive
  beam RF power generation.
• The compact linear collider study at CERN aims to
  develop the technology for an electron-positron
  linear collider with a centre-of-mass beam
  collision energy in the multi-TeV range. The
  concept is based on a two-beam scheme in which
  the RF power to accelerate the main beam is not
  produced by klystrons but rather by a low-energy,
  high-current drive beam. This drive beam is
  generated centrally and transported to the main
  linacs. Here, it is sent through a sequence of
  Power Extraction and Transfer Structures (PETS)
  in which the beam generates the RF power for the
  main beam. This process leads to a strong
  deceleration of the drive beam, which in
  conjunction with the high current and low energy
  could affect the beam stability and the power
  production efficiency.
• In order to test the feasibility of the
  drive-beam generation and RF power production,
  the CLIC Test Facility 3 (CTF3) is under
  construction at CERN. It will also be used to
  benchmark the drive beam stability in the
  decelerator and compare experimental results with
  theoretical simulations. To this end, a Test Beam
  Line (TBL), which consists of a number of PETS,
  will be installed and tested with beam to produce
  up to 5 TWatts of RF power.
• The student will play a key role in the design of
  the TBL. He or she will model the beam conditions
  for different options of the PETS and TBL
  lattice. This study should lead to a choice of a
  specific PETS and lattice that allows to verify
  the predictions of the beam stability
  simulations. The work therefore includes the
  specification of the instrumentation. It is
  planned to build and test a prototype TBL PETS
  during the duration of the PhD project. CTF3 will
  run each year and provides the opportunity of
  participation in the test program allowing the
  student to gain experience in machine operation
  and the actual performance of the different
  hardware components.
• The student needs to work in close collaboration
  with experts in different fields, in particular
  accelerator operation, accelerator physics, beam
  diagnostics and RF.

28
Organisation

• This project will be run as four independent
  subprojects with the following structure
• Silicon part UoO centrally Ole Dorholt,
  MiNilab Bengt Svensson, UoB Kjetil Ullaland.
• Techncial students Jens Vigen.
• ILO Steinar Stapnes executes the contracts in
  close co-operation with the Norwegian Research
  Council (for detailed mandate, budget framework
  and reporting)
• CLIC Steinar Stapnes supervises Erik Adli.
• For the International Research Team Dieter
  Roehrich and Bernhard Skaali will act as main
  contacts at UoB and UoO, respectively.
• The people mentioned above, including the ILO and
  specific resource persons as needed connected to
  the project, will formally meet at least twice a
  year to review the status, plans and progress,
  and to co-ordinate the efforts. In this process
  we will draw in people involved in the CERN
  technology transfer program in order to support
  Norwegians activities and industries taking part.
  One way to do this is steer a few technical
  students at CERN into such project. All together
  aim of this project is create a common meeting
  place for University researchers, and industry
  partners involved in CERN related technologies
  and instrumentation projects.
• The project will be lead by Prof. Steinar
  Stapnes, UoO, and have as deputy leader Prof.
  Kjetil Ullaland, UiB.

29
Participants
Not a closed project Welcome and expert other
people to participate
30
Conclusions

• The overall project is well based given
  experience, expertise and infrastructure
• The timing is good for RD with respect to a
  number of future projects
• We integrate all the technical CERN related
  projects to improve communication and
  collaboration something new in the Norwegian
  programme
• The resources are currently too small to do
  enough concerning integration of electronics
  need to work with partners abroad and plan this
  in more detail next
• Would benefit the project very significantly if
  we could find decent support for Norwegian
  Forskerskole grants