Status of the FMD

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Status of the FMD
LHCC referees meeting, 10 October 2005 Børge
Svane Nielsen Niels Bohr Institute
2
Prototype status
Hamamatsu sensor prototype well within specs ?
Inner production started, delivery end November ?
Outer design done, prototype ordered IDEAS inner
hybrid prototype VA1_3 chips within specs,
all produced ? 2nd hybrid prototype delivered
and tested ? Hybrid production
starting Prototype module (sandwich) status
MIP particles seen (680 MeV e-) Noise
level as expected or better ? 2nd prototype
tested in e- beam early October Readout
electronics status ? Prototype
VA1-Digitizer-RCU chain working Mechanics ?
TPC-ITS-T0-V0-FMD assembly test done
3
Silicon sensors
Inner prototype 300 µm thick 2 x 512
strips 250 µm pitch
Leakage current (specs lt 3 µA)
Bonding pads
300 nA
Bias voltage
300 V
Detector capacitance
13cm
2 nF
300 V
Bias voltage
Bonding pads
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Prototype module

• 3 prototype inner detector sandwich modules
  built
• Hybrids glued to sensors with thin ceramic
  spacers
• Readout pads bonded to silicon at periphery
  of hybrid

bonds
hybrid
sensor
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Beam test of modules
680 MeV e- beam test at ASTRID ring at Aarhus
University, DK
FMD module
e- beam
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Noise estimate
Inner sensor noise estimate
Noise Source Short strips (14 mm) Long Strips (50 mm)
Elect. cap. 263 e- 309 e-
Bias ? 208 e- 208 e-
Ileak 47 e- 88 e-
Total 338 e- 390 e-
Signal (1 MIP) 22000 e- 22000 e-
Signal/Noise 65 56
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Test beam results, July

• Tested prototype with high energy electron beam
• (680 MeV)
• Clear signal peak
• Signal/Noise ? 60

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Test beam results, October
S/N56
S/N47
S/N58
S/N56
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Read-out electronics
Lab test with sandwich and prototype
DigitizerRCU readout
RCU

• Good progress with prototype
• Digitizer and USB version of RCU
• prototype Digitizer card firmware built
• complete DigitizerRCU chain works
• first beam tests with full electronics chain
  successfull
• preparing for final version

Digitizer
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Integration test
Installation of FMD3 and FMD2 together with ITS,
etc.
Beam pipe support
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Conclusions

• FMD prototype modules show excellent signal to
  noise characteristics (? 601).
• Hit sharing accounts for most of the particles
  seen between the MIP peak and the noise peak.
• Production of inner sensors and hybrids started.
• Final design of outer module, digitizer and
• mechanics progressing well.