Title: Towards Reliable Fully Integrated Radios for DR
1Towards Reliable Fully Integrated Radios for DR
- Michael Mark
- Jesse A. Richmond
- Nathan M. Pletcher
- DR Seminar
- April 30, 2007
2History of ULP Radios for DR in Our Group
FBAR-based low power oscillator
2-Channel Prototype Transceiver
Super-Regenerative Transceiver
VLSI 2004 (Otis et al)
ISSCC 2005 (Otis /Chee)
ESSCIRC 2002 (Otis)
ISPLED 2003 (Roundy et al)
2004 (Pletcher / Otis)
Passive Weak-up Receiver
Transmit Beacon
3History of ULP Radios for DR in Our Group
Future Work Topic of This Talk
Active Antenna Transmitter
PicoCube
VLSI 2006 (Chee)
2006 (Burghardt et al)
JSSCC 2006 (Chee)
2006 (Pletcher / Gambini)
Injection Locked Transmitter
Fully Integrated WuRx
4Film Bulk Acoustic Resonator (FBAR)
Avago 1.9 GHz FBAR (BAW)
100µm
5Film Bulk Acoustic Resonators (FBARs)
- Why FBAR?
- provide highly accurate high Q resonances at RF
- can be used for frequency references and RF
filter - low power and low insertion loss due to high Q
- small form factor
- possible candidate to replace quartz (for
frequency references) and bulky SAW for filter
applications - FBAR Limitations
- limited frequency tuning range (tuning range
1/Q) - worse temperature coefficient than quartz
- economical integration of high quality FBARs and
CMOS still an issue
100µm
6Limited Frequency Tuning Range
- Problems Interference and Fading
- Interference
- Receiver might be jammed by a strong signal at a
frequency at - or close to - the receive
frequency and has no way of escaping that
scenario - Fading
- Fading results from superposition of transmitted
signals that have experienced differences in
attenuation, delay or phase shift, or might be
simply due to the attenuation of a single signal
100µm
7Example Multipath Fading
r
d
8Temperature Dependency of Resonances
- Problems
- temperature coefficient of FBAR approx. -25
ppm/ºC (crystal 5 ppm/ºC) - Frequency variation with temperature might cause
TX frequency to fall out of receive band - Clock-frequency drift requires more pessimistic
logic timing
100µm
(courtesy B. Otis)
9FBAR - CMOS Integration
- Many different ways of connecting CMOS with FBAR
- chip-on-board mainly for proof of concept
circuits - chip-on-chip mainly for proof of concept
circuits - flip-chip yield issues no hermetic sealing
- above IC integration ideal way of doing it
however expensive and up to now Q of FBAR fully
integrated on CMOS is lower that Q of standalone
FBAR
100µm
(pictures courtesy by B. Otis)
10How to Deal with These Limitations?
100µm
11How to Achieve More Tuning Range?
100µm
12Interpolative Oscillator
- Allows to generate a frequency of oscillation by
interpolation between two or more resonator
frequencies - Maximum spacing of the resonance frequencies of
single resonators ?1 and ?2 is given by -
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-
100µm
13Frequency Division and Mixing
- Principle high
frequency reference generated by FBAR-based
oscillator, Fractional-N divider generates
variable lower frequencies and single sideband
up-conversion mixer produces a signal with
frequency fRef fDiv - Issues circuit and
power overhead, spectral impurity
100µm
14High Reference Frequency PLL
- Idea is to build a fractional-N PLL with a FBAR
reference oscillator (at e.g. 500 MHz) and a wide
PLL bandwidth, relaxing the close in phase noise
requirements for the VCO, which might lead to a
low overall power consumption. - Similar to Divide-and-Mix approach but promises
higher spectral purity -
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-
100µm
Ref W. Rhee et al. JSSC08
15Temperature Compensated Oscillator
- Key Idea Cancellation of temperature dependence
by adding two different frequencies with equal
absolute frequency shift per degree - Analogous to the idea of a bandgap voltage
reference - Enabled by the fact that FBARS with different
resonance frequencies can be made to have
different relative temperature coefficients as
well. - E.g. Resonator 1 f0 2.1 GHz Tc -25 ppm
Resonator 2 f0 1.8 GHz Tc
-29.2 ppm ? absolute frequency
shift 52.5 kHz/ºC -
-
100µm
16High Reference Frequency PLL
- Circuit Implementation
- Difference oscillator uses two oscillators and
a mixer to subtract one frequency from the other - Leads to a temperature stable output frequency of
300 MHz for our previous example -
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-
100µm
17FBAR CMOS Integration
- FMOS a novel approach for integrating FBARs
with CMOS - Based on Avagos Microcap technology, CMOS and
FBAR will be combined into one hermetic sealed
package - In close collaboration with Avago Technologies
and University of Washington (Prof. B. Otis) -
-
-
100µm
courtesy R. Ruby, Avago Technologies
18FBAR CMOS Integration Microcap
- New Generation packaging for further integration
and miniaturization used for Avagos FBAR filter - A blank wafer is bonded on top of FBAR wafer to
for a hermetic sealing for FBAR - The packaged FBARs can then be wire-bond or
flip-chip assembled -
-
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19FBAR CMOS Integration FMOS
- Principle Idea Replacing the cap wafer with an
actual CMOS wafer with circuit on it - Requires matched wafer sizes for FBAR and CMOS
wafer (6 inch), as well as wafer level technology
access - Therefore an Avago In-house 0.4 um CMOS process
without any special RF features is used - Process is characterized for low-frequencies but
untested at RF - Shrinking of transistor
gate length down to
0.28 um possible -
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20FMOS Timeline
- First tape out in October 2006
mainly device test structures for RF
characterization and some oscillators and
dividers - Measurements and characterizations showed
sufficient accuracy of CMOS models for
applications around 2 GHz - Next tape out planned in June 2007. Focus on
interpolative and temperature compensated
Oscillators -
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21Summary
- FBAR based radios have proven to be excellent
candidates for ultra low power radios for DR-like
applications, however they have some limitations - Ongoing research on how to overcome these
limitations was presented - We are on our way to overcome at least some of
the obstacles towards more reliable ultra-low
power radios for DR like applications -
-
100µm