Title: Applying LCA into Decision Making
1Applying LCA into Decision Making
Nina Chen (yuechen_at_mit.edu) Greg
McRae (mcrae_at_mit.edu) Department of Chemical
Engineering MIT
2Outline
- Motivation and scope of study
- Process-product Input Output (PIO)-LCA mechanism
- Case studies
- Value of information
- Conclusion
3Key Environmental Challenges and Needs
More quantitative environmental metrics
Systematical evaluation approach to environmental
impacts Database that includes important
chemical properties Consideration of
uncertainty in the environmental evaluation
Rapid environmental evaluation Life Cycle
Assessment (LCA) beyond the factory Dynamic
simulation of the processes Advanced process
control, sensing and metrology
Multi-objective optimization and decision support
4Scope
- Develop methodologies and metrics for rapid
economic and environmental evaluation - Integrate the treatment of uncertainties into
decision making about alternative technologies - Identify opportunities for creating win-win
situations
Strategy
- Focus on understanding uncertainty and processes
- Use existing PIO-LCA method at different stages
- Explore value of information
5Frequently Encountered Issues in Life Cycle
Analysis
- Large amount of data are required
- Large uncertainties are imbedded in
- Environmental information
- 1 order of magnitude in air pollutant
emission factors - 2 3 orders of magnitude in cancer
toxicity indicators - 3 6 orders of magnitude in
non-cancer toxicity indicators - Process information
- New technologies
- Unknown equipment
- Upstream information incomplete
- Time and resources do not allow indefinite
refining of data and model
What Shall We Do?
6Life Cycle Analysis Model of This Work
Upstream Downstream Emissions, Material and
Energy Usage
Weighting Factors
Flow Rates
Human Toxicity Global Warming Effect Ozone
Depletion Effect Respiratory Effect
Products Byproducts Chemical Energy Water Waste
Input Output LCA Model
Design Decisions
Emissions
Process Model
Impact Indicator
Environmental Performance
Yield Process Time
Compliance with Regulations
Human Exposure
Environmental Concentration
Fate, Transport, and Exposure Model
Environmental Properties Chemical
Properties Exposure Properties
Alternative Designs
7Components of an Environmental Valuation Model
Characterization
Weighting
Activity Emission Factors
Factors
Factors
Eij
Hik
Greenhouse
Greenhouse
Methane Reforming
effect
effect
wk
CO2
Acid
Acid
CO
Deposition
Deposition
2
NO
x
Environmental
SO
Carcinogen
Carcinogen
Impact
2
Indicator W
Exposure
Exposure
N
O
2
Energy
CO
Cu CVD
Generation
Process
VOC
Photochemical
Photochemical
smog
smog
CH
4
PM
...
Ozone
Ozone
HCHO
depletion
depletion
...
...
Ã¥
Ã¥
Precursor Generation
W
Eij
H
w
ik
k
k
i
...
Cano-Ruiz 2000
8Model Input One Usage Matrix (B)
Electricity
Usage Matrix
B
Electricity
Cu CVD
Cu Film
Cu1(hfac)(tmvs)
H2
9Model Input Two Fabrication Matrix (C)
Fabrication Matrix
Electricity
Cu CVD
Cu Film
Cu1(hfac)(tmvs)
H2
10Model Input Three Market Share Matrix (F)
Market Share Matrix
Electricity
Cu CVD
Cu Film
Cu1(hfac)(tmvs)
H2
11Model Input Four Emission Matrix (E)
Emission Matrix
Electricity
Cu CVD
Cu Film
Cu1(hfac)(tmvs)
H2
12Model Input Five Characterization Matrix (H)
- Characterization matrix (H)
- Large uncertainties imbedded in the values
GWP100 Respiratory Human Toxicity
Effect Potential (non-
cancer)
kg CO2 equivalent/kg
kg PM10 equivalent/kg
DALYs/kg
Unit
1 -23.3
0.15 4.21E-9 -8.3 1
CO2 kg
SO2 kg
PM10 kg
Based on willingness to pay
Valuation Factor
w
3e-2 40 85000
13Mathematical Model
- Model Input Six Price vector (p)
- Allocation matrix (G) for multiple product
processes - Throughput matrix (D)
- Dji FjiGji
- Direct product requirement (qdirect)
- qdirect (I BD)d
- Total product requirements
- q (I Aprod AprodAprod AprodAprodAprod
)d (I Aprod)-1d - where Aprod ? BD
Gji the amount of throughput of process j that
is attributed to one unit of product i made in
process j
Dji the amount of throughput of process j that
is attributed to the demand of one unit of
product I at current price and market share
14Mathematical Model
- Total process throughput requirements (x)
- x Dq
- Life cycle environmental exchanges inventory (e)
- e Ex
- Impact valuation by process (?process)
- ?process Diag(x) ET H w
- Impact valuation by emission (?emission)
- ?emission Diag(e) H w
15A Smaller Case
- Eighteen processes
- Fourteen products
- One hundred and two emissions
- Seven environmental impacts
Gas-fired Plant
Nature Gas Production
Coal
Gas
Coal-fired Plant
Coal Production
Hydroelectric Plant
Electricity
Cu CVD
Cu Film
Cu1(hfac)(tmvs)
16Case StudyCu CVD
Pressure Sensor and Controller
The process model is provided by University of
Maryland.
Film Thickness Sensor and Controller
Precursor Cu1(hfac)(tmvs)
Wafer
Heater
Temperature Sensor and Controller
Scrubber
Carrier Gas Hydrogen
Sensor Path
Control Path
17Analysis Results of the Environmental Model
- When uncertainties are considered, power
generation still contribute to a significant part
of environmental impact. - Large uncertainty in coal-fired power plant and
oil-fired power plant is from the uncertainty in
PM10 effect and CO2 effect in GWP
18Second Case Study Chamber Cleaning with NF3 or
F2?
RF Power
SiO2 Deposited on Wall
NF3/F2, Ar, N2
F, NF, NF2, Ar
Plasma Generator
N2, F-, NF
SiF4
F?, F2, N2, SiF4, O2
- Merits of NF3
- High disassociation rate
- High removal rate
- High etch rate
- Drawback of NF3
- High cost
O2
SiF4
F?, F2, O2, N2, SiF4
CVD Reaction Chamber
- Merits of F2
- Low cost
- Drawbacks of F2
- High toxicity
- High reactivity
- On-site generation creates explosive H2
Comparison criterion considered Life cycle
impacts given the same cleaning performances
19Process Modeling with Kinetics
- Lumped kinetics and Perfectly Stirred Tank
Reactor (PSTR) model - Key assumptions
- Free electrons are generated mainly by ionization
Are --gt Ar2e - Electron loss and production are linear to
electron concentration - Diffusion of electrons dominates the transport of
electrons.
NF3 e ? NF2 F? e k32.06E-17
Te1.7exp(-37274/Te) NF2 e ? NF F ? e
k21.57E-17 Te1.8exp(-27565/Te) NF e ? N
F ? e k11.57E-17Te1.8exp(-27565/Te)
F2 e ? F- F? k 1.02E-5Te-0.9exp(1081.8/Te
) 4F? SiO2 ? SiF4 O2
20Process Modeling with Stoichiometrics
Driving forces of LCA impacts Cleaning gas
usages Energy consumptions
Cleaning Gases Energy
- where for NF3 cleaning
- for F2 cleaning
- Fluorine Utilization Yield F uniform(10-5,
0.6) - Energy Utilization Yield ?E uniform(10-10,
0.6) - Cleaning Time t (s) uniform(6E-4, 1200)
21Comparison of Relative Impacts of GWP of Two
Models
Process Model with Kinetics
1.9
3.3
Process Model with Stochiometrics
Relative GWP of NF3 Process to F2 Process
- 23 orders of magnitude of uncertainties in
inputs does not necessarily leads to low
confidence in decision - Increase of modeling detail decreases the
uncertainty of the outputs - But the decision is still the same F2 is
better! - Required confidence level should determine depth
of analysis
22Process Modeling Hierarchy and Resource Needs
Process Model Hierarchy
Distributions of Yield
Resources Needed
1 Simple stoichiometric yield 1
2 Lumped kinetics (3 reactions) 10
3 Detailed kinetics (60 reactions) 100
4 Model based experiments 1000
23Right Procedure of Analysis
Problem
Key Parameters
Analysis Models
Relative GWP
F of NF3 Cleaning -0.64
F of F2 Cleaning 0.46
Cleaning Time t (s) -0.28
E of NF3 Cleaning -0.20
E of F2 Cleaning 0.12
4F SiO2 ? SiF4 O2
1. Stoichiometric
LCA
Gas Usage (mol)
Decision go to next level?
Refine cleaning process model
PowerPlasma Generator 0.69
Power to the TElectron in NF3 Disassociation -0.37
NF3 in NF3 Production -0.33
Energy Used in F2 Production 0.21
Power to the TElectron in NF2 Disassociation -0.19
NF3 e ? NF2 F? e NF2 e ? NF F ? e NF
e ? N F ? e F2 e ? F- F?
2. Simple Kinetics
LCA
Further refine cleaning process model
Decision go to next level?
3. Detailed Kinetics
163 Gas Phase Reactions in Plasma Generator
24Process Modeling vs. System Boundary
System Boundary
Life Cycle
85
gt99
Chemical Industry
gt99
Semiconductor Industry
12 Month Effort?
6 Month Effort
2 Month Effort
Downstream Treatment
gt95
N/A
gt99
Confidence Level in Distinguishing NF3 and F2
Cleaning
1 hr Effort
N/A
gt95
Cleaning Tools
gt95
Process Modeling Level
Stoichiometry
Simple Kinetics
Detailed Kinetics
- Depth of process modeling and width of system
boundary are complementary to each other. - Based on existing knowledge, choose appropriate
direction
25Framework of Decision-Making Process
Generate new alternatives
Refine model, collect more data, increase data
accuracy
Ranking and Sensitivity Analysis
No
Alternative Technologies NF3 vs. F2 Cu CVD vs.
Cu plating
Is info enough for decision?
Environ. Impacts Model
Economic Impacts Model
Process Model
Yes
Uncertainty Analysis
Do nothing, or change to alternative
26Future Plan Value of Information (VOI)
- A simple example is it worthy to buy 1M
equipment for testing?
More Research
Current State 50 sure COO NF3 cleaning 3
COOF2 cleaning
90 sure (p)
Continue NF3 Cleaning
Cost of NF3 cleaning
(90)
Adopt F2 Cleaning
COOF2 cleaning if works well
More Research
(10)
COOF2 cleaning if not work well
More Research
10 sure (1-p)
Continue NF3 Cleaning
Cost of NF3 cleaning
(10)
Adopt F2 Cleaning
COOF2 cleaning if works well
(90)
COOF2 cleaning if not work well
Continue NF3 Cleaning
Cost of NF3 cleaning
(50)
COOF2 cleaning if works well
Adopt F2 Cleaning
(50)
COOF2 cleaning if not work well
27Conclusions and Key Points
- Large uncertainty in the inputs does not
necessarily lead to low confidence in decisions. - PIO-LCA combines both the merits of EIO and
engineering design method - Hierarchical modeling in combination with
uncertainty analysis are efficient ways to
support the decision making and resource
allocation process. - VOI may give direction on resources allocation.
28Acknowledgements
- Laura Losey
- David Bouldin, Mike Kasner, Tim Yeakley, and
Tina Gilliland Texas Instruments - Larry Novak Novak Consulting, LLC
- Alejandro Cano-Ruiz and Pauline Ho Reaction
Design - Daren Dance WWK
- Joe Van Gompel BOC Edwards
- Holly Ho TSMC, Taiwan
- McRae Group MIT
- Gleason Group MIT
- Engineering Research Center for Environmentally
Benign Semiconductor Manufacturing NSF/SRC.