Prezentace aplikace PowerPoint

1
COST MP 0602 Action
Domain Committee Materials, Physical and
Nanoscience
Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain HISOLD
Kick-off Working Group meeting, Brno
27-28.8.2008
2
COST MP 0602 Action
Domain Committee Materials, Physical and
Nanoscience
Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain HISOLD
Kick-off Working Group meeting, Brno
27-28.8.2008
3
COST MP 0602 Action
Program, Monday 27. 8. 2007, morning, Lecture
room, IPM, 5th floor Plenary lectures from our
experts and colleagues (times include
discussion). 910-950 A. Kodentsov, TU
Eindhoven, Pascal Oberndorf, Next Experience
B.V., Netherlands On Pb-free (solder)
Interconnections for High- Temperature
Applications 950-1030 Limaye Paresh, IMEC, KU
Leuven, Belgium Reliability Issues in Lead
free electronic assemblies. 1030-1045 Coffee
Break 1045-1110 P.T. Tang, IPU Produktion,
Denmark Introduction to the MatPack project
(Centre for deposition, modelling and
characterisation of high melting point
lead-free micro solders) to our background and
the hot- stage microscope _____________________
____________________ 1110-1200 Presentation of
ideas and plans by the Chair, WG coordinators
(10-15 min. each)- Part I 1200-1330 LUNCH

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COST MP 0602 Action
Monday August 27, afternoon 1330 1700, Lecture
room, IPM, 5th floor   1330-1400 Presentation
of ideas and plans by the database managers
(10-15 min. each) Part II ______________________
____ 1400- 1530 Round robin discussions WGs
separately. (This time can be used to prepare
GPs). WG 1 Lecture room 5th floor WG 2
Meeting room 4th floor WG 3 Lecture room
II 4th floor 1530-1545 Coffee
Break Continuation again in the Lecture room
5th floor 1545-1645 Presentation of conclusions
from previous discussion, joint discussion of
all participants 1645-1730 Presentation of
Expressions of Interest and Group Projects both
prepared and planned Part I (project
leaders, 5- 10 min each) can be prolonged, if
necessary   Conference dinner from approx
1830, time may be adjusted
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COST MP 0602 Action
Tuesday August 28, morning 900-1200, Lecture
room, 5th floor 900- 940 J. Liu, Chalmers
University of Technology, Göteborg, Sweden Nano
lead free solders -Challenges and Future
Research Topics 940-1020 Presentation of
Expressions of Interest and Group Projects both
prepared and planned Part II (project
leaders, 5- 10 min each) 1020-1035 Coffee
Break WG separately as on Monday 1035-1200 P
resentation of Expressions of Interest and Group
Projects Part III Discussion in respect of
the outcomes of the previous presentations. 12
00-1330 LUNCH Tuesday August 28, afternoon
1330- approx. 1500, Lecture room, 5th floor
1330-1430 General discussion, Conclusions
(This time can be used to finalize the GPs)
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COST MP 0602 Action
20 member states Austria 14/03/2007 Belgium 28/
03/2007 Bulgaria 28/03/2007 Czech
Republic 17/04/2007 Denmark 16/07/2007 Finland 0
3/05/2007 France 17/04/2007 Germany 28/03/2007 H
ungary 28/06/2007 Italy 20/04/2007 The
Netherlands 20/04/2007 Poland 21/03/2007 Portugal
29/06/2007 Romania 28/06/2007 Serbia 28/03/200
7 Slovakia 21/03/2007 Slovenia 28/03/2007 Sweden
05/07/2007 Switzerland 04/04/2007 United
Kingdom 21/03/2007 2 applicants from non COST
countries Dr. Plevachuk, Lviv University,
Ukraine Prof. Sidorov, Ural State University,
Russia
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COST MP 0602 Action

• Working Group 1
• The establishment of materials property databases
  for Pb-free alloy systems suitable for
  high-temperature solder applications. The aim is
  to compile a set of databases (e.g. through
  application of thermodynamics and kinetics
  studies) containing compilations of information
  on
• phase diagrams, thermodynamic properties,
• materials properties (structural, physical,
  electrical, mechanical )
• process related properties of the solder and
  joint materials.

• Working Group 2
• The creation of a phenomenological description
  and models for the prediction of corrosion
  behaviour, deformation processes, failure modes
  etc. occurring in the soldered structure during
  fabrication and service at high temperatures.
• Development of processing-structure-property
  relations, an understanding of thermo-mechanical
  fatigue, scale and constraining effects of the
  thermo-mechanical response, the durability of
  interfaces and intermetallics and to identify
  optimum process conditions.

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COST MP 0602 Action

• Working Group 3
• Reactive phase formation study.
• Formation of intermetallic compounds at
  solder/substrate interfaces
• The development of texture of the reaction
  products in concentration gradients and the
  development of defect structures in the vicinity
  of the reaction interface.
• the study of the role of competitive nucleation
  and growth of intermediate phases on the
  interface of solder/substrate system.

Materials Selection for lead free
high-temperature solders Ag-Bi-, Zn-Sn-,
Zn-Al-Mg- (Ge,Ga,Bi,Sn) - studied in Japan,
ternary eutectic around 318C Sb-Sn- - most
widely used, patents exist, for the temperatures
up to 250C peritectic reaction Sb health
problems? - YES
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COST MP 0602 Action
Expressions of Interest and Group Projects
László Bencze, HUNGARY, Arkadij Popovic,
SLOVENIA ( H. Ipser, K. Fitzner, D.
Zivkovic) Determination of the thermodynamic
properties of the Al-Cu-Sn, Ag-Sb-Sn, Au-Sb-Sn
and Cu-Sb-Sn alloys. Pavel Broz, J. Vrestal,
Czech Republic (A. Dinsdale, A. Watson, UK, A.
Kroupa.) Thermodynamic and Phase Diagram Studies
of Systems for High Temperature Lead-Free
Solders Systems - Zn-Al-X (X Mg, Ni, Sb) K.
Fitzner, Poland ( H. Ipser, A. Popovic, L.
Bencze, D. Zivkovic. Determination of the
thermodynamic properties of the Ag-Sn-Sb,
Au-Sn-Sb and Cu-Sn-Sb alloys. Calculations of
phase equilibria S. Gomes-Fries, I. Steinbach,
Germany (??) Microstructure formation in the
interdiffusion of lead-free solder-substrate
under thermomechanical load (materials Sn based
on Ni, Cu substrate)
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COST MP 0602 Action
Herbert Ipser, Austria (Krzysztof Fitzner,
Gabriella Borzone, Ales Kroupa) Sb-Sn-X alloy
systems for high-temperature soldering
applications phase equilibria and thermodynamic
properties(in particular Ag-Sb-Sn, Au-Sb-Sn,
Cu-Sb-Sn) Ni-P-Sn phase equilibria and
thermodynamic properties phase diagram
calculation Sn-Ag, Sn-Ag-In mechanical
properties of solders and solder joints with Cu
and Ni substrates J.C. Tedenac, France (Isabelle
Drouelle, B. Legendre) BiSn X sytem (p
metal) Phase diagram calculation, thermodynamic
properties Microstructure fomation and
interfacial diffusion studies Substrates
Ni-Ti A. Kroupa, Czech Republic (A. Dinsdale, A.
Watson, H. Ipser, L.Zabdyr) Phase equilibria in
Zn-Sn-X metallic systems for high-temperature
lead-free solders Pavol Sebo,
Slovakia (??) Interaction of Advanced High
Temperature Lead-Free Solders with Metallic
Substrates - Bi-Cu, Bi-Ag, Zn-Al and the
influence of additive elements (Sn,Ga,Sb)
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COST MP 0602 Action
L. Zabdyr, Poland (??) Physico-chemical
properties and structural characterisation of
Ag-Bi-X, Au-Sn-X and Sn-Zn-X multicomponent
alloys John Botsis, Joel Cugnoni (??) Thermomech
anical behavior of Pd-free solder joints scale
constraining effects , materials not
specifed Jaromir Drapala, Czech Republic (J.
Vrestal, A. Kroupa) Theoretical and experimental
study of phase equilibria in solder materials for
high-temperature applications (Bi-Ag, Sb-Sn,
Zn-Sn, Zn-Al eutectic alloys with Mg, Ni, Cu, Sn,
Bi ) Jozef Medved, Slovenia (??) High
temperature compatible solder materials for
application in biomedicine (materials not
specified)
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COST MP 0602 Action
J. Villain, Germany (Georg J. Schmitz,
Gabriella Borzone, Natalia Sobczak)SAC Ni
system, Simulation and verification of
microstructure depending on cooling rate,
Determination of grain distribution and
orientation incl. eutectic parts and primary
phases Manufacturing of pure IMCs J. Villain,
Germany (Herbert Ipser, Gabriella Borzone,
Natalia Sobczak, Andy Watson, J. Botsis SnZn Al
X sytem, pure and in combination with Cu/Sn and
Cu/Ni/Au-metallization, phase diagram
calculation, thermodynamic properties,
determination of the solubility of Cu, Ni, Au
depending on solder volume and reflow temperature
and time Determination of grain distribution and
orientation incl. eutectic parts and primary
phases depending on cooling rate,   determination
of the mechanical properties (e.g. Youngs Modul,
ultimate tensile strength, shear strength,
micro/nano hardness) Yuriy Plevachuk,
Ukraine (W. Hoyer, J-C Gasser) Electrophysical
and structure-sensitive properties of Sb-Sn-X
multicomponent alloys
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COST MP 0602 Action

• GROUP PROJECTS
• Gabriella Borzone, Italy
• Partners Dr. Andy Watson, Dr. Enrica Ricci ,
  Prof. Daniele Gozzi, Prof. Gualtiero Gusmano,
  Dr.Virginia Cinelli, Dr. Ales Kroupa, .
• Sb-Sn-X alloy systems for High-temperature
  soldering applications
• George Vassilev
• Partners Delfim F. Soares, Dragana Zivkovic,
  Jolanta Romanowska,
• Design, process and control in a multiscale
  domain of Cu-Ni-X-Y (X, YSn, Bi, Zn, Ti) based
  alloys
• A. Dinsdale, UK
• Partners P.Conway, A. Watson, A. Kroupa, J.
  Vrestal, H. Ipser, N. Moellans, ACCESS, L.
  Zabdyr, A. Kodentsov, KTH Stockholm,
• Modelling the reactions at the interface between
  Sn based lead free solders and electroless nickel
  substrates