Title: USB 2'0 Electrical Overview
1(No Transcript)
2USB 2.0 Electrical Overview
- Jon LuekerIntel Corporation
3Highlights of the USB 2.0 Electrical Specification
- High-speed signaling mode 480 Mb/s
- Existing cables and connectors
- Seamless forward/backward compatibility
- High-speed functionality smoothly layeredover
existing USB 1.1 - Specifications for each element testable through
the use of required test modes
4USB 2.0 - An Extensionof USB 1.1
- All the functionality of USB 1.1
- High-speed signaling mode
- Protocol for detecting high-speed capability
- Protocols for entering/exiting high-speed
- Mechanism for disconnect detection
- Low-/full-speed specifications tightened, but
only for high-speed capable ports - Section 7.2 (Power Distribution)specifications
unchanged
5USB 2.0 is Interoperable with USB 1.1
- All compliant USB 1.1 devices, hubs, and cables
will work with new 2.0 host controllers - USB 2.0 devices and hubs will work with 1.1 host
controllers (but not at 480 Mb/s!) - High-speed signaling is supported over compliant
USB 1.1 cables and connectors
6Legacy USB Devices(Other than Hubs)
- Compliant USB 1.1 devices will generally beUSB
2.0 compliant - Exception Low-speed devices with unshielded,
captive cables - USB 2.0 requires foil and drain wire in low-speed
captive cables
This Is a Compliance Issue It Doesnt Affect
1.1/2.0 Interoperability!
7USB 2.0 High-speed Capable Devices
- Required to support full-speed signaling
- Required to at least enumerate in full-speed
- Required to meet tightened full-speedelectrical
specifications - Must not support low-speed mode
Its Likely That Vendors of High-Speed Capable
Devices Will Support Full-Speed Operating Modes (
250 Million Existing USB 1.1 Ports! )
8USB 2.0 Hubs andHost Controllers
- Required to support low, full, and high-speed
modes on downstream facing ports - Required to support full-/high-speed on upstream
facing ports - Required to support tightened low-/full-speed
electrical specifications
9USB 1.1/2.0Interoperability Matrix
10High-Speed Electrical Layer
- New signaling
- New transceiver elements
- New bus states
- New low-level protocols
- New test modes
11Differential Current Drive
12Source/Load Terminations
- Use of terminations at source and load enable
high signal integrity - Reflection coefficient (RT - Z0) / (RT Z0)
Example For Z0 52 Ohms and RT 40 Ohms,
reflection coefficient is -13 In the case of a
source terminated link, there is a 13
additive/subtractive inter-symbol
interference With source and load terminations of
40 Ohms, the effect is reduced to (13)2, or
1.7 Double terminations have a similar benefit
in reducing the effects of connector and board
related discontinuities
13USB 2.0 Dual Terminations
Single Termination
Dual Termination
- Simulation assumes ideal transceivers and
terminations - Typical imperfections are modeled for cable,
connectors, bond wires, etc. - 2.7X increase in eye opening, 2.7X decrease in
jitter
Dual Termination Makes USB 2.0 Speeds Possibleon
USB 1.X Cable Assemblies
14Full-Speed DriversProvide Terminations
- Full-speed drivers asserting SE0 look like
resistance to ground - ZDRV RS 45 Ohms, /- 10
- RS may be integrated on-die or placed off-chip
15Existing Cablesand Connectors
- No changes to connector specifications
- Cable specs added to USB 1.1 guarantee
performance, but pre-ECN cables will support
high-speed
16DC Coupled
- Low-/full-speed modes require DC coupling
- DC coupling for high-speed simplifies board
design and minimizes cost - Worst case skin-effect losses still
leavereliable eye opening - Use of individual ferrite beads on D and D-
lines no longer possible, but shielded low-speed
cable requirement helps a lot
No New Magnetics Required for USB 2.0
17High-Speed Signaling Is Only Sensed Differentially
Differential Common Mode Total Signal
High-Speed Driver Generates Differential and
Common Mode Components, but Receiver Only Senses
Differential Portion
18High-Speed Timing Regenerated in Repeater
- High-speed signaling incurs no cumulative
jitteror degradation - Bit errors and non-compliant behavior are
easilyisolated to a single link
19High-Speed Bus States/Levels
20USB 2.0 Transceiver Functionality
3.3V
Rpu_Enable
HS_Current_Source_Enable
HS_Drive_Enable
HS_Data_Driver_Input
High Speed Current Driver
Legacy Driver
Rs
LS/FS_Data_Driver_Input
Rpu
Assert_Single_Ended_Zero
FS_Edge_Mode_Sel
Rs
LS/FS_Driver_Output_Enable
Data
HS_Differential_Receiver_Output
Data-
HS Differential Data Receiver
Differential_Receiver_Enabled
Transmission Envelope Detector
Legacy_Differential_Receiver_Output
Legacy Data Receiver
HS_Disconnect_Detected
Disconnection Envelope Detector
SE_Data_Receiver_Output
Single Ended Receivers
SE_Data-_Receiver_Output
21High-Speed Current Driver
- Directing current to ground is fast but wastes
power - Turning current on/off saves power but requires
settling time - Use of these two options is left to the designer
22RPU Switch
- When device enters high-speed mode, RPU is
disconnected - It is recommended that switching elements be
attached to both lines to achieve balanced
parasitics
23High-Speed DifferentialData Receiver
- Required to receive differential signaling with
amplitude as small as /- 200mV - Guideline Tolerant of common mode voltages from
50mV to 600mV - Reception of data is qualified by envelope
detection
24Transmission Envelope Detector
Differential
!Squelch
- Must indicate Squelch when differential
amplitudeis lt 100mV - Must indicate !Squelch when differential
amplitudeis gt 150mV - Must incorporate filtering to prevent indication
ofSquelch during crossover - Should react in less than 4 bit times
25Disconnection Envelope Detector
- Disconnect threshold detector goes high when
signals above disconnect threshold are detected - Output is sampled during last 8 bits of 40 bit
uSOF EOP - This prevents spurious disconnect detection in
the presence of allowable signaling overshoot