... fast thermal processing:' Laserzapping, Ion beam zap, Laser scan, Q switch, CW, Electron Beam Zap, ... What is RTA II. Transient enhanced diffusion. Chapter ...
To separate a thin device layer from the bulk of the wafer. by inserting an electrically insulating layer. Insulator, 0.1 10 um ... Source: Ibis, www.ibis.com ...
Range becomes larger than in an amorphous material ... Buried amorphous layer. Arsenic starts large elastic loss, disorder similar to As distribution ...