NeSSI Communication Solution - PowerPoint PPT Presentation

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NeSSI Communication Solution

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Title: A PROFIBUS PA solution for the NeSSI Author: Armin Tesch Last modified by: Armin Tesch Created Date: 10/20/2003 4:40:36 PM Document presentation format – PowerPoint PPT presentation

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Title: NeSSI Communication Solution


1
  • NeSSI Communication Solution

2
Agenda
  • Introduction to Softing
  • Requirements for a communication interface
  • PROFIBUS PA vs. FOUNDATIONTM Fieldbus
  • Demo application here at the conference
  • Softings solution OEM package
  • Next steps

3
Softing Background (1)
  • Softing AG Softing GmbH, founded in 1979
    Public corporation since 1999 Traded in
    Frankfurt Corporate headquarters in Munich
    Office in Düsseldorf
  • Softing North America, Inc. founded in
    2001 North American headquarters
    in Newburyport, MA Sales office in Detroit,
    MI Sales, Marketing Engineering

Softing Offices Sales Network
existing

.
planned
4
Softing Background (2)
  • Products and Services for Industrial
    Communication and Industrial Control
  • Support of vendor-independent international
    standards
  • Fieldbus systems, Ethernet protocols and related
    technologies
  • Products PC interfaces, diagnostic tools, OPC
    toolkits, Gateways
  • Services custom tailored projects (examples)
  • Communication Interfaces (HW and SW)
  • Configuration and device parameterization
  • Support for device registration
  • Strong background in PROFIBUS and FOUNDATIONTM
    Fieldbus
  • Creator of the first PROFIBUS FMS implementation
  • Unique set of FF stacks, like Link Master, Field
    Device, HSE, Linking Device

5
Profibus PA Foundation Fieldbus
Unique Solution for PA and FF
  • Softing Field Device based on Mitsubishi M16C62
    and Find 1 or SPC 4-2
  • Protocol stack for PROFIBUS PA and FOUNDATIONTM
    Fieldbus
  • Identical Function Block interface
  • Almost 50 of all FF-registered field devices
    are equipped with Softing BFD protocol stack
  • ABB, S, USA, I, D, UK
  • Bürkert, D
  • Endress Hauser-Group
  • Invensys/Foxboro, D, Nl, USA
  • Anderson Instrument, USA
  • Flowserve/Limitorque, USA
  • Honeywell, USA
  • Krohne, D
  • Pepperl Fuchs, D
  • Samson, D
  • Toshiba, Japan
  • Yokogawa, Japan

6
Basic Requirements (1)
We can help solve this!
  • A Dilemma
  • Softing can help solve the Dilemma
  • Small hardware platform
  • Protocols designed for this kind of application
  • Modular firmware available
  • Proven technology

Armin Tesch, Softing North America, Inc.
7
Basic Requirements (2)
  • Small form factor (shall fit into 1.5 tube)
  • Cost-effective
  • Intrinsically safe
  • Flexible and user-independent design concept
  • Easy-to-build application software
  • Bus-powered

8
PROFIBUS PA vs. FOUNDATION Fieldbus
  • PROFIBUS
  • Simple Master-Slave communication
  • Idea DP for intrinsically safe applications
  • Easy to configure
  • Worldwide acceptance
  • FOUNDATIONTM Fieldbus
  • Distributed Control System
  • Does not need a Master
  • Highly complex configuration
  • Sophisticated Device Description Language
  • Time consuming Device registration process

9
Proof of Concept
  • Demo Application here at CPAC
  • Existing HW module fits in 1.5 tube
  • Sample application built in less than three days
  • Via segment coupler to RS485 (regular DP)
  • PROFIBUS Master (PC-card)
  • OPC server to feed data into Visual Basic
    application

10
The Idea OEM package
  • Processor moduleincluding PA stack and FBs
  • Signal converter (if at all)off-the-shelf or
    custom built
  • Transducer Blocks (SW)ready-to-use, based on
    templates or custom built
  • Support packageTraining, etc.
  • GSD file
  • Device certification

11
The Idea Benefits
Significant savings in time and money
  • Significant quantities keep production costs low
  • HW design doesnt require any changes
  • Easy-to-build transducer blocks
  • Limited NRE costs
  • One-stop-shop approach (HW, SW, training,
    engineering)
  • Technology originally designed for this kind of
    communication (proven!)
  • No major technical challenges

12
The Idea Steps to do
  • Flexible specification
  • As much input as possible
  • Mechanical dimensions
  • IS issues
  • Re-design of existing module to meet NeSSI
    requirements
  • Number of I/O channels
  • Onboard A/D converter
  • Form factor/Connectors
  • Generic signal converter
  • To cover our NREs initial PO (DOE project?)
  • Time frame

13
Thank you for your attention
www.softing.com
www.softing.us
armin.tesch_at_softing.com
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