Gantry meeting

1
FNAL Bonding

• Statistics are shown for the last 17 modules
  (mini-production).
• Wire bonding has been done on a dedicated KS
  8090 machine using a 2025 tool.
• We expect that the change from RMT to Planar
  pitch adapters will greatly reduce the number of
  PA repairs.
• RMT bond pad cleanliness has been an on-going
  issue.
• Bonding time does not include inspecting and
  cleaning bond pads, test pulling every 50th
  sensor-to-PA bond, and post inspection of the
  wire bonds.
• The total process time should come down to about
  30 minutes per module assuming better PA bond
  pads and much reduced destructive testing.
• Long times in mini-production summary reflect
  some problems with the bonding machine.
• Wire bond skipping is done by modifying KS files
  through a PERL script.

2
FNAL Bonding
Bonds are skipped for pinholes (Idiel) and
selected cases of Cac. ARCS testing following
bonding revealed no new pinholes (17K bonds).
3
FNAL Bonding
RMT PAs
US power adjusted based on results.
Sen-to-PA pull test data for odd-numbered
modules Units are in grams.