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Solution to HW1

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Title: Interconnect Layout Optimization Under Higher-Order RLC Model Author: MD6 Engineering Computing Last modified by: EDA Group Created Date: 9/16/1997 11:03:30 PM – PowerPoint PPT presentation

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Title: Solution to HW1


1
Solution to HW1
  • Name differences for local wires between NTRS97
    (below) and ITRS01 (table 62a), and explain
    reasons for such changes
  • A/R ratio becomes smaller
  • Copper reduces the need of a high A/R ratio in
    order to achieve a low resistance
  • Reduced A/R ratio gt reduced coupling cap between
    adjacent wires
  • Effective K becomes smaller
  • Too optimistic in NTRS97
  • Fat and tall intermediate and global wires
    specified in ITRS01 (but not NTRS97)
  • Reversed scaling for interconnects

2
Homework 2
  • Submit to Marilyn Saunders
  • Engineering IV, 66-127CC
  • Email marilyn_at_ea.ucla.edu
  • Tel 5-2214
  • Or email at lhe_at_ee.ucla.edu
  • Due 3pm, Oct. 18th, Friday

3
Reading Assignment
  • Elmore delay model (Elmore, Journal of Applied
    Physics, 1948, handout)
  • Elmore delay for RC tree (Rubinsteun-Penfield-Horo
    witz,TCAD'83, handout),

4
Written Assignment
  • Find the inductance matrix for the normalized RLC
    circuit model
  • Assume that the inductance matrix for the full
    RLC circuit model is

A
B
C
D
E
F
3-bit bus with 2 segments per bit
La Lab Lac Lad Lae Laf
Lb Lbc Lbd Lbe Lbf
Lc Lcd Lce Lcf
Ld Lde Ldf
Le Lef
Lf
5
Written Assignment
  • Assume that a long interconnect line can be
    modeled by a distributed L-type circuit model
  • Prove that the number of segments does not affect
    the Elmore delay of this line
  • Is the above conclusion still true if the ?type
    circuit model is used?

6
Written Assignment
  • Survey of two BEM papers
  • Summary for each method
  • Comparison between them
  • Roughly 2 pages
  • References
  • K. Nabors and J. White, TCAD, Nov., 1991
  • FastCap A multipole accelerated 3-D capacitance
    extraction program
  • W. Shi, J. Liu, N. Kakani, and T. Yu, DAC98
    (best paper award)
  • A Fast Hierarchical Algorithm for 3D Capacitance
    Extraction

7
Written Assignment
  • Survey of inductance sparsefication papers
  • Summary for each method
  • Comparison between them
  • Roughly 34 pages
  • References
  • L. He, N. Chang, S. Lin, and O. S. Nakagawa, "An
    Efficient Inductance Modeling for On-chip
    Interconnects,"IEEE Custom Integrated Circuits
    Conference, May 1999.
  • N. Chang, S. Lin, L. He, O. S. Nakagawa, and W.
    Xie, "Clocktree RLC extraction with Efficient
    Inductance Modeling", Design Automation and Test
    in Europe, March 2000.
  • Shepard, Tian, TCAD00, return-limited
    inductances a practical approach to on-chip
    inductance extraction
  • Krauter, Pileggi, ICCAD95, Generating Sparse
    Partial Inductance Matrices with Guaranteed
    Stability
  • Devgan, Ji and Dai, ICCAD00, how to efficiently
    capture on-chip inductance effects Introducing a
    new circuit element K
  • Link provided at http//eda.ee.ucla.edu/ee298.html
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