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EE4OI4 Engineering Design Programmable Logic Technology – PowerPoint PPT presentation

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Title: EE4OI4 Engineering Design


1
EE4OI4Engineering Design
Programmable Logic Technology
2
Evolution of Silicon Chip
  • We often measure the size of an IC by the number
    of logic gates or the number of transistors that
    the IC contains.
  • Example 100k-gate IC contains equivalent of
    100,000 two-input NAND gates.
  • Small-scale integration (SSI) ICs contains a few
    (1 to 10) logic gates (often simple gates NANA,
    NOT, AND)
  • Medium-scale integration (MSI) increased the
    range to counters and similar larger scale logic
    functions
  • Large-scale integration (LSI) packed even larger
    logic functions such as the first microprocessor
    into a single chip
  • Very large scale integration (VLSI) 64 bit
    microprocessors with cache memory and floating
    point arithmetic units (over a million transistor
    on a single silicon)

3
Evolution of Silicon Chip
  • Some digital logic ICs are standard parts.
  • These ICs can be selected from catalog and data
    books and bought and used in different systems
  • With the advent of VLSI in the 1980s engineers
    began to realize the advantages of designing an
    IC that was customized or tailored to a
    particular system or application rather than
    using standard ICs.

4
Digital logic technology
  • ICs are made on a thin silicon wafer
  • The transistors and wiring are made from many
    layers (between 10 to 15) built on top of one
    another
  • The first half-dozen or so layers define the
    logic cells (AND , OR, Flip-flop). The last
    half-dozen or so define the wires between the
    logic cells (mask layer or interconnect)

5
Digital logic technologies
Digital logic technologies.
6
Digital logic technology
  • In a full-custom IC some (or all) logic cells are
    customized and all the mask layers are also
    customized
  • Example a microprocessor is a full custom
  • The designer does not use pre-tested,
    pre-characterized cells
  • Why?
  • No suitable entity cell library available (not
    fast enough, not small enough, consumes too much
    power) or no cell library is available (new
    application)
  • Full custom ICs are the most expensive to design
    and manufacture
  • Design time is long
  • Fewer and fewer full-custom ICs are being
    designed because of the above problems

7
Digital logic technology
  • Traditional integrated circuits chips perform a
    fixed operation defined by device manufacturer
  • Internal functional operation is defined by user
  • Application Specific Integrated Circuits (ASIC)
  • Field Programmable Programmable Logic Devices
    (FPLD)

8
Digital logic technology
  • ASIC
  • Gate arrays
  • Standard cells
  • Gate array an array of pre-manufactured logic
    cells
  • A final manufacturing step is required to
    interconnect the logic cells in a pattern created
    by the designer to implement a particular design
  • Standard cell no fixed internal structure
  • The manufacturer builds the chip based on the
    users selection of devices from the
    manufacturers standard cell library

9
Digital logic technology
  • Programmable logic devices (PLDs) are standard
    ICs that may be configured or programmed to
    create a part customized to a specific
    application
  • Features
  • No customized layers or cells
  • Fast design time

10
Digital logic technology
Full custom
Semi-custom
Programmable
Logic cell
Customized
Pre-designed
Pre-designed Programmed by the user
Mask Layers
Customized
Customized
Pre-designed Programmed by the user
11
Digital logic technology tradeoffs.
12
Programmable Logic Technology
  • Simple programmable logic devices (PLDs) such as
    programmable logic array (PLA) and programmable
    array logic (PAL) have been in use for over 20
    years.
  • PLA the idea is that logic functions can be
    realized in sum-of products form

13
x
x
x
1
2
n
Input buffers
and
inverters
x
x
x
x
1
1
n
n
P
1
OR plane
AND plane
P
k
General structure of a PLA
f
f
1
m
14
x
x
x
1
2
3
Programmable
connections
OR plane
P
1
P
2
P
3
P
4
AND plane
Gate-level diagram of a PLA
f
f
1
2
15
x
x
x
1
2
3
OR plane
P
1
P
2
P
3
P
4
AND plane
Customary schematic of a PLA
f
f
1
2
16
x
x
x
1
2
3
P
1
f
1
P
2
P
3
f
2
P
4
An example of a PLA
AND plane
17
Programmable Logic Technology
  • Programmable connections (switches) are difficult
    to fabricate and reduce the speed of circuit
  • In PALs the AND plane is programmable but the OR
    plane is fixed.
  • To compensate for reduced flexibility, PALs are
    manufactured in a range

18
Programmable Logic Technology
  • On many PLAs and PALs the output of the OR gate
    is connected to a flip flop whose output can then
    be feedback as an input into the AND gate array.
  • This way simple state machines are implemented

19
Select
Enable
f
1
Flip-flop
D
Q
Clock
To AND plane
Output circuitry
20
FPLD
  • CPLDs and FPGAs are the highest density and most
    advanced programmable logic devices.
  • These devices are collectively called field
    programmable logic devices (FPLD).
  • Characteristics
  • None of the mask layers are customized
  • The core is a regular array of programmable logic
    cells that can implement combinational as well as
    sequential logic
  • A matrix of programmable interconnect surrounds
    the basic logic cells
  • Programmable I/O cells
  • For all but the most time critical design
    applications, CPLDs and FPGAs have adequate speed
    (clock range 50-400 MHz)

21
FPLD
  • CPLDs and FPGAs typically contain multiple copies
    of a basic programmable logic element (LE) or
    logic cell (LC).
  • Logic element can implement a network of several
    logic gates that feed into 1 or 2 flip-flops
  • Logic elements are arranged in a column or matrix
    on the chip

22
FPLD
  • To perform complex operations, logic elements are
    connected using a programmable interconnection
    network
  • Interconnection network contains row and/or
    column chip-wide interconnections.
  • Interconnection network often contains shorter
    and faster programmable interconnects limited
    only to neighboring logic elements

23
FPLD
  • FPLDs contain
  • Programmable logic cells
  • Programmable interconnection
  • Programmable I/O cells

24
I/O block
Cell
Cell
I/O block
Interconnection wires
I/O block
Cell
Cell
I/O block
Structure of a CPLD
25
A section of a CPLD
26
Logic block
Interconnection switches
I/O block



I/O block
I/O block




I/O block
Structure of an FPGA
27
FPLD
  • In large FPLDs the clock arrives at different
    times at different flip flops if it is routed
    through the chip like a normal signal
  • The situation in which the clock signal arrives
    at different times at different flip flops is
    known as clock skew.
  • Clock signals in large FPLDs are normally
    distributed using an internal high speed bus
    (global clock line)
  • Using global clock line, clock is distributed to
    all flip-flops in the device at the same time.

28
ff
ff
ff
ff
ff
ff
ff
ff
Clock
ff
ff
ff
ff
ff
ff
ff
ff
Figure 10.44 An H tree clock distribution
network
29
UP2
30
UP3
31
Altera MAX7000
  • MAX7000 is a CPLD family with 600 to 20000 gates.
  • Configured by an internal electrically erasable
    programmable read only memory (EEPROM)
  • Configuration is retained when power is removed
  • The 7000 family contains from 32 to 256
    macrocells.
  • An individual macrocell contains five
    programmable AND gates.
  • The AND/OR network is designed to implement
    Boolean equations expressed in sum-of-product
    form.

32
MAX 7000 macrocell.
33
Altera MAX7000
  • Macrocells are combined into groups of 16 called
    logic array block (LAB)
  • Input to the AND gates include product terms from
    other macrocells in the same block or signals
    from the chip-wide programmable interconnect
    array (PIA)

34
Altera MAX7000
  • Each I/O pins contains a programmable tri-state
    output buffer.
  • An I/O pin can be programmed as input, output,
    output with a tri-state driver and tri-state
    bi-directional.

35
Altera MAX7000
  • If more than five product terms are required,
    additional product terms are generated using the
    following methods
  • Parallel expander product terms can be shared
    between macrocells. A macrocell can borrow up to
    15 product terms from its neighbors
  • Shared expander one of the product terms in a
    macrocell is inverted and fed back to the shared
    pool of product term.
  • The inputs to this product term are used in
    complement form and using DeMorgans theorem a
    sum term is produced.
  • Since there are 16 macrocells in an LAB, shared
    logic expander pool has up to 16 terms

36
MAX 7000 CPLD architecture.
37
FLEX 10K
  • Flex 10K an FPGA family with 10,000 to 250,000
    gates.
  • Configured by loading internal static random
    access memory (SRAM).
  • The configuration is lost whenever power is
    removed
  • Gate logic is implemented using a look-up table
    (LUT)

38
FLEX 10K
  • LUT is a high-speed 16 by 1 SRAM.
  • Four inputs are used to address the LUTs memory
  • The truth table for the desired gate network is
    loaded into the LUTs SRAM.
  • A single LUT can model any network of gates with
    4 inputs and one output.

39
Using a lookup table (LUT) to model a gate
network.
40
FLEX 10K Logic Element (LE).
41
FLEX 10K
  • Two dedicated high speed paths are provided in
    FLEX 10K carry chain and cascade chain
  • They both connect adjacent LEs without using
    general purpose interconnect path
  • Carry chain supports high speed adders and
    counters (carry forward function between LEs)
  • Cascade chain can implement functions with a more
    than 4 inputs.
  • Adjacent LUTs compute portions of the function in
    parallel and the cascade chain serially connects
    the intermediate values
  • Cascade chain uses logic AND or OR to connect the
    outputs of adjacent LEs.

42
Carry chain
43
Cascade chain
44
FLEX 10K Logic Array Block (LAB).
45
FLEX 10K CPLD architecture.
46
FLEX 10K
  • The chip also contains embedded array blocks
    (EAB).
  • EABs are SRAM blocks that can be configured to
    provide memory blocks of various aspect ratios.
  • An EAB contains 2048 SRAM cells which can be used
    to provide memory blocks with a range of aspect
    ratios 256x8, 512x4, 1024x2, 2048x1.

47
FLEX 10K
48
Cyclone
  • Cyclone Configured by loading internal static
    random access memory (SRAM).
  • The configuration is lost whenever power is
    removed
  • Cyclones logic array consists of LABs, with 10
    Logic Elements (LEs) in each LAB.
  • An LE is a small unit of logic providing
    efficient implementation of user logic functions
  • Cyclone had between 2,910 to 20,060 LEs

49
Cyclone
  • RAM blocks are embedded in Cyclone devices
  • These blocks are dual-port memory blocks with 4K
    bits of memory plus parity (4,608)
  • These blocks provide dual-port or single port
    memory from 1 to 36 bits wide at up to 200 MHz.
  • These blocks are grouped into columns across the
    device in between certain LABs
  • The Cyclone EP1C6 and EP1C12 contain 92 and 239K
    bits of embedded RAM

50
Cyclone
51
Cyclone
52
Cyclone
53
Cyclone
  • Gate logic is implemented using a look-up table
    (LUT)
  • The LUT is a high-speed 16 by 1 SRAM
  • Four inputs are used to address the LUTs memory
  • The truth table for the desired gate network is
    loaded into the LUTs SRAM during programming

54
Cyclone
  • The output of LUT can be fed into a D flip-flop
    and then to the interconnection network.
  • More complex gate networks require
    interconnection with neighboring logic elements.
  • A logic array block (LAB) is composed of ten
    logic elements (LE)
  • Both programmable local LAB and chip-wide row and
    column interconnects are available
  • Carry chain are also provided to support faster
    addition operation

55
Cyclone
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