PRODUCTS GUIDE General Plating

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PRODUCTS GUIDEGeneral Plating
Ver 8.01
Address 173-90, GAJWA-DONG, SEO-GU, INCHEON,
KOREA ????? ?? ??? 173-90 TEL [phone] /
FAX [phone]
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1. Inorganic Compound
?????Incheon Chemical Co.,Ltd
Product Name Conc. Formula Packing
Nickel Sulfate Ni 22 min NiSO46H2O 20Kg
Nickel Chloride Ni 24 min NiCl26H2O 20Kg
Nickel Sulfamate (65) Ni 11.8 min Ni(SO3NH2)2 sol 65 20Kg
Nickel Sulfamate (60) Ni 11 min Ni(SO3NH2)2 sol 60 20Kg
Nickel Carbonate Ni 35 min NiCO3 20Kg
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1. Inorganic Compound
?????Incheon Chemical Co.,Ltd
Copper Zinc Compounds
Product Name Conc. Formula Packing
Copper Cyanide Cu 70.6 min CuCN 15Kg, 25Kg, 50Kg
Zinc Cyanide Zn 55 min Zn(CN)2 15Kg, 25Kg
Sodium Copper Cyanide Cu 24.5 min Na2Cu(CN)3 25Kg
Potassium Copper Cyanide Cu 27.5 min K2Cu(CN)3 15Kg, 30Kg
Copper Fluoborate Cu 12.5 Cu(BF4)2 25Kg
MS - Cu Cu 9.5 min Cu(CH3SO3)2 25Kg
Brass Salt - - 15Kg
Imitation Gold - - 15Kg
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1. Inorganic Compound
?????Incheon Chemical Co.,Ltd
Tin Lead Compounds
Product Name Conc. Formula Packing
MS - TIN Sn 300g/L min Sn(CH3SO3)2 30Kg
MS - Lead Pb 500g/L min Pb(CH3SO3)2 30Kg
Stannous Fluoborate Sn(BF4)2 45 Sn(BF4)2 25Kg
Lead Fluoborate Pb(BF4)2 50 Pb(BF4)2 25Kg
Stannous Chloride Sn 52 min SnCl22H2O 20Kg
Stannous Sulfate Sn 54.5 SnSO4 20Kg
Sodium Stannate (42.5) Sn 42.5 Na2SnO33H2O 20Kg
Sodium Stannate (36) Sn 36 Na2SnO33H2O 20Kg
Product Name Conc. Formula Packing
Silver Nitrate Ag 63.4 min AgNO3 1Kg
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1. Inorganic Compound
?????Incheon Chemical Co.,Ltd
Product Name Conc. Formula Packing Origin
Chromic Acid CrO3 25Kg Japan (JCI, ????)
MSA 70 min CH3SO4H 25Kg GERMANY (BASF)
Copper Sulfate Cu 25.4 min CuSO45H2O 20Kg CHINA (GOOD CHEMICAL)
Fluoroboric Acid 45, 50 min HBF4 25Kg CHINA, FRANCE
Potassium Cyanide 98.5 min KCN 50Kg USA, GERMANY, JAPAN
Rochelle Salt 99.0 min KNaC4H4O64H2O 25Kg SPAIN (PAHI)
Sulfamic Acid 99.5 NH2SO3H 25Kg JAPAN, TAIWAN
Potassium Tiocyanide 97.0 min KSCN 25Kg GERMANY (RUETGERS)
Sodium Cyanide 98.0 min NaCN 50Kg KOREA (TAEKWANG)
Sulfuric Acid 95, 61.5 H2SO4 30Kg KOREA (DAESUNG SCI.)
Hydrochloric Acid 35 HCl 20Kg KOREA (DAESUNG SCI.)
Hydrogen Peroxide 35 H2O2 20Kg KOREA OCI
Sodium Hydroxide 98 NaOH 25Kg KOREA DONGHAE CHEM.
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2. Nickel Additive
?????Incheon Chemical Co.,Ltd
Bright Barrel Nickel Process
Product Name Application Features Product Name Make Up
NICSTAR Superior leveling. Suitable for iron iron alloy. Very high leveling, high brightness, high speed. Very high White deposits. Very good throwing power. NICSTAR-CAR NICSTAR-BRI ICN-P 10ml 0.5ml 1ml
SUCCESS-20 Barrel Plating (2type) High leveling. High brightness, good throwing power. SUCCESS-CAR SUCCESS-BRI ICN-P 10ml 0.5ml 1ml
SUCCESS-X50 Barrel Plating (1ype) High leveling. High brightness Good throwing power. Easy control. SUCCESS-MU SUCCESS-X50 ICN-P 20ml 0.6ml 1ml
Semi-bright PCB Ni.
Product Name Application Features Product Name Make Up
ICN-SM50 Non-coumarin type products. Requiring corrosion resistance and clingingness. For high corrosion resistant underplating. High ductile deposits ant a very low tensile stress. ICN-SM 1ml
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2. Nickel Additive
?????Incheon Chemical Co.,Ltd
Nickel Sulfamate Process
Product Name Application Features Product Name Make Up
ICN-B1, B2 Connectors, electroforming applications and printed circuitboards Lower stress in sulfamate nickel or Watt solution. Capable of leveling to a limited degree for high corrosion resistant and high ductile. ICN-B1 ICN-B2 ICN-P 15ml 0.2ml 1ml
ICN-SM 50 Nickel Sulfatmate additive Lower stress in sulfamate nickel or Watt solution. Capable of leveling to a limited degree for high corrosion resistant and high ductile. ICN-SM 50 20m
Product Name Application Features Product Name Make Up
ICN-P Suitable for PCB, Nickel Sulfamate wetting agent. Pit preventer. Pit preventer for air agitation. Adding a small amount lowers surface tension. ICN-P 1ml
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3. Copper Additive
?????Incheon Chemical Co.,Ltd
Acid Copper Plating Process
Product Name Application Features Product Name Make Up
CUESTAR Decorative plating onto general metal product and plastic materials Excellent brightness and leveling. Mirror bright deposits after shortest plating time. Very low running cost. Cuestar-MU Cuestar-A Cuestar-B 4ml 0.7ml 0.5ml
ICU-200 Big and wide reel to reel line. Suitable for high temperature and high sulfuric acid contents. Suitable for high temperature and high sulfuric acid contents. Dye-free system. ICU-201 ICU-202 3.2ml 2.4ml
ICU-400 Big and wide reel to reel line. Suitable for high temperature and high sulfuric acid contents. Dye-free system. Wide density and good throwing power. Easy control. ICU-401 ICU-402 3.2ml 1ml
Bright Cyanide Copper Plating
Product Name Application Features Product Name Make Up
CY-1000 Iron and iron alloy, copper alloy, zinc and zinc alloy for strike and bright plating Excellent brightness and leveling. Wide density and good throwing power. Easy control. CY-1000 20ml
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4. TIN ADDITIVE
?????Incheon Chemical Co.,Ltd.
Product Name Use Special feature
MSN-3000,4000 General matt solder plating Very stable alloy over Wide range of current densities.
MSN-3000,4000 PCB board, chip Excellent Solderability Throwing power.
PC-MT Lead free matt plating Uniform deposit.
PC-MT PCB board, chip, IC Lead frame Excellent Solderability Throwing power.
MTHS Lead free High speed Plating matt Plating Very stable deposits on high current densities.
MTHS Lead frame, Component Excellent Solderability Throwing power.
Product Name Use Special feature
NBSN-5000 Lead free General bright plating Very stable deposits over , Wide range of current densities.
NBSN-5000 Flexible P.C.B Excellent Solderability Throwing power.
HBSN-5000 Solder, General bright plating Very stable alloy over Wide range of current densities.
HBSN-5000 Flexible P.C.B Excellent Solderability Throwing power.
NBT Lead free high speed bright plating Uniform alloy and stable on high current densities.
NBT Connector, Pin, Component Excellent Solderability Throwing power.
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4. TIN ADDITIVE
?????Incheon Chemical Co.,Ltd
Product Name Use Special feature
LF-500 Chip plating Very stable all over Wide range of current densities.
LF-500 Various Chip plating Excellent Solderability Throwing power.
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5. BROWN OXIDE
?????Incheon Chemical Co.,
Process Product Name Property Standard Working Condition
Cleaner CP-10000 Weak alkali cleaner 10 Temp. 50? Time 1-3min
Per-Dip BRO 750AD Non-H2O2 product 2 V Temp. R.T. Time 3060sec
Oxide BRO-750 Superior adhesive strength 0.8-1.3kg/cm2 The tone of color is equal and possible to apply to High Tg product BRO 750 100V Temp. 35-40? Time 45-60sec
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6. Soft etching Products
?????Incheon Chemical Co.,
Product Name Application Property M/U Working Condition Amount of Etching
EP-250 Dry film, S/M, Suitable for former conditioner of electroless copper. Etching agent for lactic acid and hydrogen peroxide. Formulated suitable intensity of illumination on the surface of copper. EP-250 2-3 V H2SO4(95)5-10 V H2O2(35) 3-8 V Temp. R.T. Time 10-30S 0.7-1.5 um/min
IST-2B Dry film, S/M, Suitable for former conditioner of electroless copper. Etching agent for lactic acid and hydrogen peroxide. Formulated suitable intensity of illumination on the surface of copper. IST-2B 2-5 V H2SO4(95)8 V H2O2(35) 5 V Temp. R.T. Time 10-30S 0.7-1.5 um/min
High-speed Etching agent HEP-250 High speed etching agent to equalize copper foils thickness of CCL. High speed etching. High stability. HEP-250 7-10 V H2SO4 (95) 10 V H2O2 (35) 11 V Temp. 30 ? Time 30-60S 2.0-4.0 um/min
Flash Etching FEP-260 Suitable thin and narrow circuit as a flipchip board High stability. Small amount of etching. FEP-260 5 V H2SO4 (95) 25 V H2O2 (35) 3 V Temp. R.T. Time 20-60S 0.2-0.6 um/min
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?????Incheon Chemical Co.,
7. PTH Chemical
Process Product Name Function Property M/U Working Condition
Alkaline Cleaning Improved Agent of Surface AP 1100 Remove oxidized substances and pollutants. Improve quality of poly imides surface. Strong ability to control surface of poly imide and BT resins board AP 1100 250ml/L Temp. 4050? Time 1-3min
Cleaning/ Conditioning Cleaner/ Conditioner PC 480 C Remove oxidized substances and pollutants on the board. Improve wetting-property of a board and inside wall. Control electric potential to improve adhesive strength of palladium. Uniformity of palladium adhesion. Improve reliability of inside wall of the hole. PC 480C 50ml/L Temp. 50-60? Time 3-7min
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7. PTH Chemical
?????Incheon Chemical Co.,
Process Product Name Application Property M/U Working Condition Life of solution
Swelling IPM-100S Swelling of epoxy resin Softening state of epoxy resin by organic solvent is excellent. IPM-100S 45V IPM-101B 2.5V Temp. 60? Time 6min 30M²B/L
Smear Etching IPM-101A IPM-101B Resin etching Regular amount of etching and the maximum adhesive strength with copper. IPM-101A 60 g/L IPM-101B 7V Temp. 70? Time 10min Insoluble ingredients 30 and below
Neutralization IPM-103 Removing insoluble MnO2 Excellent effect of removing impurities without copper foils damage of inside layer. IPM-103 10 V H2SO4 6V Temp. 45? Time 5min Cu 20g/L Area 15 M² B/L
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?????Incheon Chemical Co.,
7. PTH Chemical
Process Product Name Application Property M/U Working Condition Life of solution
Swelling IPM-100S Swelling of epoxy resin Softening state of epoxy resin by organic solvent is excellent. IPM-100S 45V IPM-101B 0.6V Temp. 40? Time 10min 30M²B/L
Smear Etching IPM-101A IPM-101B Resin etching Regular amount of etching and the maximum adhesive strength with copper. IPM-101A 60 g/L IPM-101B 1.6V Temp. 40? Time 10min Insoluble ingredients 30 and below
Neutralization IPM-103 Removing insoluble MnO2 Excellent effect of removing impurities without copper foils damage of inside layer. IPM-103 10 V H2SO4 6V Temp. 403? Time 5min Cu 20g/L Area 15 M² B/L
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7. PTH Chemical
?????Incheon Chemical Co.,
Process Product Name M/U Working Condition Working Condition Working Condition
Process Product Name M/U Time M/U Temperature
Cleaner- conditioner CP-9000N CP-9000N NaOH 5min 8.5 2.6 60?
Micro etching EP-230 PLUS EP-230 PLUS H2SO4 H2O2 2min 5 ml/L 70 ml/L 40 ml/L R/T
Pre-dip PCT-SALT PCT-SALT HCl 2min 225 g/L 10 ml/L 20?
Catalyst PCT-740 PCT-740 PCT-SALT HCl 8min 3 225 g/L 10 ml/L 30?
Accelerator PCT-747 PCT-747 2min 5 R/T
Electroless copper ICP-360A ICP-360B ICP-360C Stabilizer Formalin E/L Copper (Medium Copper) 30-40min 6 5 6 25-30?
Electroless copper ICP-245A ICP-245B ICP-245C Formalin E/L Copper (Thin Copper) 15-20min 8 10 Rep. 0.67 23-27?
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?????Incheon Chemical Co.,
7. PTH Chemical
Process Product Name M/U Working Condition Working Condition Working Condition
Process Product Name M/U Time M/U Temperature
Cleaner- Conditioner CP-9000N CP-9000N NaOH 5min 9.5 V 0.8 V 403?
Micro etching EP-230 PLUS EP-230 PLUS H2SO4 H2O2 2min 3 ml/L 70 ml/L 64 ml/L 203?
Pre-dip PCT-645 PCT-645 H2SO4 pH 1-2min 1.0 V 3 ml/L 1.0-1.5 R/T
Catalyst PCT-640 PCT-640 pH 3-5min 80120 ppm lt100 ppm 9.510.5 403?
Reductant PCT-646 PCT-646 H3BO3 pH 3-5min 5 ml/L 5 g/L 7.58.5 203?
Electroless copper ICP-460M ICP-460A ICP-460B E/L Copper (Thin Copper) 15-20min 12V 5.2V 2V 253?
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?????Incheon Chemical Co.,
7. PTH Chemical
Product Name Property
HTP-CARRIER HTP-ADDITIVE Superior solderability and throwing power. Superior throwing power performance over the all CD range on high aspect ratio boards.
ATP-200 (new version) A new and modern acid copper system, especially designed to have high T/P in the high aspect ratio and produce uniform and bright copper deposit with superior throwing power and distribution performances roe printed circuit apllications.
BVF-940 Microvia filling system especially designed for printed circuit applications.
MVP-5000 Design for plating printed circuit boards in which smooth satin copper deposits are required. The deposit structure is fine grained so have advantages of increasing ductility and strength.
PP-2000 Increases significantly productivity due to the use of high current density plating. Reduce consumption of copper metal.
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?????Incheon Chemical Co.,
8. ENIG Process
Product Name Application Property M/U Working Condition
Acid Cleaning CA-7000D Removing pollutants of coppers surface and activation Small quantity of bubbles CA-7000 10.0 V Time 1-3 min Temp. 40-50?
Palladium Catalyst PCT-840 Pd adhesion with coppers surface for simple Nickel plating Using lactic acid palladium H2SO4(98) 4.5 V PCT-840 50 ml/L Time 1 2min Temp. R.T.
Non electrolytic Nickel Ni-6000 Ductility of microcircuit and general PCB plating Semi-gloss plating layer of low stress. Ni-P alloy (P 68). High solution stability. Ni-6000M 150 ml/L Ni-6000A 45 ml/L Ni-6000B Ni-6000C Ni-6000S 4 ml/L Time 1525min Temp. 82? Plating Velocity 12?/hr
Non electrolytic Nickel Ni-7000 Ductility of microcircuit and general PCB plating and general components Semi-gloss plating layer of low stress. Ni-P alloy (P 68). High solution stability. Ni-7000M 100 ml/L Ni-7000A 55 ml/L Ni-7000B Ni-7000C Time 1525min Temp. 82? Plating Velocity 12?/hr
Deposited gold plating HMG-24 PCB SMT Restraint of Nickel corrosion. Increment of soldering reliability HMG-2450(4555) ml/L Au 1(0.81.2) g/L PH 5.5 (5.06.0) Temp. 85(8089)? Plating Velocity 14u
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9. D/F S/M Adhesive strength builder
?????Incheon Chemical Co.,
Product name Application property m/u Working condition Etching amount
Adhesion Promoter AEP 270 (non-etching) Copper surface pretreatment (OSP, chemical stannous, chemical Ag plating etc.) Without etching of copper D/F adhesive strength is increasing by organic matter coating 10 V spray pressure 0.82.0 Kg/? Temp. normal Temp. Time 3060S -
Adhesion Promoter AEP 275 Dry film, S/M, Fitness for Immersion copper pretreatment Etching and organic matter coating are the same time progress by H2SO4/H2O2. Non-luster copper surface formation adhesive strength is excellent by equable organic matter coating AEP-275 5 V H2SO4 48 V H2O2 34 V Temp. 25 30? Time 3060S (spray) 0.51.0 ?/min (spray)
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10. D/F developer, remover
?????Incheon Chemical Co.,
Product name application property m/u Process condition
DEP-10 (developing solution) Additive for Na2CO3 developing solution the achievement of excellent resolution superior to side wall quality. developing equipment is supported clean. DEP-10 2 V Na2CO3 1.0wt Temp. 2831? Time 4555 sec
DEP-20 (developing solution) High Concentration K2CO3 solution the achievement of excellent resolution superior to side wall quality. developing equipment is supported clean.. the life of solution is extended. DEP-20 1.5 V Temp. 2831? Time 4560 sec
DSP-30 (exfoliation solution) Exclusive use of D/F remover that can peel off small particles in high density patterns High exfoliation speed Excellent oxidation preventer effect the life of solution is extended. DSP-30 3 V NaOH 3 wt Temp. 5060? Time 3060sec
DSP-40 (exfoliation solution) Exclusive D/F stripper. NaOH / KOH Base High exfoliation speed Excellent oxidation preventer effect. the life of solution is extended. Application of D/F and LPR at the same time is possible. DSP-40 7 V Temp. 5060? Time 3060sec
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10. D/F developer, remover
?????Incheon Chemical Co.,
Product name application property m/u Process condition
DSP-50 (exfoliation solution) exclusive use of D/F remover of Amine base Amine base High exfoliation speed Excellent oxidation preventer effect. the life of solution is extended. DSP-50 7 V Temp. 5060? Time 3060sec
DSP-60 (exfoliation solution) Exclusive use of remover that apply to partial Au-plating product Amine base High exfoliation speed Excellent oxidation preventer effect. the life of solution is extended. DSP-60 1525V Temp. 5060? Time 302min
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11. Chemical Ag Plating process
?????Incheon Chemical Co.,
Product name application property m/u Working condition Reference
removal of acid CA-7000S Pollutant removal and activation of copper surface low bubble CA-7000S 10.0 V Temp. 40-50? Time 1-3 min Spray Cleaner
Soft Etching EP-240S Formation of bright copper surface Increase of cling between Ag and copper surface stable etching speed uniform and bright copper surface EP-240S 5 V H2SO4 4 V H2O2 4 V Temp. R.T. Time 10-30S Micro-etching depth 1.0µm
Pre-dip IAG-902 Preparatory deposition for preventing from polluting of Ag-plating solution maintain acidity of plating solution pollution preventation of plating solution cling increment between metals IAG-902 10 V HNO3 1.0 V Temp. 3050? Time 2060 S 60 HNO3
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11. Chemical Ag Plating process
?????Incheon Chemical Co.,
Product name application property m/u Working condition Reference
Immersion Silver IAG-903 Excellent solderability Ag-plating layer is formed bright silver plating layer Under cut attack is extremely low. uniform plating layer IAG-902 10 V HNO3 2.0 V IAG-903 5 V Temp. 45 55? Time 3060 S Plating thickness 0.20.4µm
Discoloration preventer IAG-904 Preventation from discoloring of Ag-plating layer excellent discoloring preventation effect Blocking effect of moisture is excellent no effect to solderability IAG-904 15V Temp. 5055 ? Time 10 60 S
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12. Chemical Sn Plating Process
?????Incheon Chemical Co.,
Product name Product name application property m/u Working condition
removal of acid CA-7000D removal of acid CA-7000D Pollutant removal and activation of copper surface low bubble CA-7000 D 10.0 V Temp. 40-50? Time 1-3 min
Acid pre-dip ITP-500AD Acid pre-dip ITP-500AD Maintain activity degree of copper surface Maintain acidity of Sn-plating solution possible to plate to uniform color. ITP-500AD 25.0V Temp. R.T. Time 1-2min
ITP-500 Pre-Sn plating (1st) Uniform pre-plating (0.02-0.05um) plating solutions balance maintenance ITP-500 100 V Temp. R.T. Time 1min
ITP-500 Sn plating (2nd) Immersion tin (0.6-1.5um) Sn-plating layers of bright white low aggression about SM. Excellent solderability. plating structure is close and no discoloration. ITP-500 100 V Temp. 55-65? Time 5-15min Plating speed 0.1um/min
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13. OSP Process
?????Incheon Chemical Co.,
Product Name Application Property M/U Working Condition
removal of acid CA-7000S Pollutant removal and activation of copper surface low bubble CA-7000 S 10.0 V Temp. 40-50? Time 1-3 min
Soft Etching EP-240S Formation of bright copper surface Increase of cling between coating layer and copper surface stable etching speed uniform and bright copper surface EP-240S 5 V H2SO4 8 V H2O2 4 V Temp. R.T. Time 10-30S
OPF-100 Pre-Flux Coating (0.2-0.5um) Suitability to smokeless condition Application to PCB that has only copper circuit Excellent oxidation preventer effect and Excellent solderability. Excellent heat-resisting property. long period of preservation. OPF-100 100 V Temp. 40 ? Time 1min
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13. OSP Process
?????Incheon Chemical Co.,
Product Name Application Property M/U Working Condition
OPF-200 Pre-Flux Coating (0.2-0.5um) Suitability to smokeless condition application to board that has copper and gold at the same time Excellent oxidation preventer effect and Excellent solderability. Excellent heat-resisting property. long period of preservation. OPF-200 10 V Temp. 40 ? Time 1min
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14. METAL, S/M Remover
?????Incheon Chemical Co.,
Product Name Application Property M/U Working Condition
Sn/Pb remover SNS-60 S (Spray) SNS-60(deposition) Sn or Sn/Pb remover remover including nitric acid no erode copper surface high metal meltage 100V Temp. R.T.
Rack remover SUS-ST Copper and Sn or Sn/Pb on the plating of SUS are exfoliated at the same time on the plating of SUS use to add nitric acid solution nitric acid gas emission is minimum 10 V Temp. R.T.
Ag remover AG-ST Remover for Ag-plating re-operations weak-acid matters fast exfoliation speed and no copper erosion 100V Temp. R.T.
S/M remover SMS-100 hardened SM layers os are exfoliated KOH/NaOH mixing solution no erode and discolor about copper. minimize erosion about board resin 100V Temp. 6090? Time 520min
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15. The others product
?????Incheon Chemical Co.,
Product Name Application Property M/U Working Condition Reference
antifoamer AF-100 D/F developing and other process Excellent antifoam effect include a very small amounts silicon. Excellent washing 1-2 ml/L
antifoamer AF-200 D/F exfoliation and other process Excellent antifoam effect Excellent washing 1-2 ml/L
Discoloration preventer of copper AT-100 for a while corrosion control of copper surface Excellent oxidation preventer effect. Easy elimination by acid pre-dip 5.0 V Temp. R.T. Time 3060S
Screen cleaner AT-1000 Special for screen cleaning use odorless organic solvent wahing effect and fast drying 100 V R.T. Mesh washing
EQC-1000 Equipment washing system use odorless organic solvent strong melting, penetration 100V 40-50
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16. Zn plating and trivalence cromate
?????Incheon Chemical Co.,
Product Name Use Special feature MU ratio (ml/L) Extent
ICZ-720 Zinc cyanide brightener Plating layer of gloss property Stable plating solution chemically 4ml/L
ICZ-740 Acidity potassium chloride brightener Excellent gloss and ductility Good throwing power ICZ-740A 40 ICZ-740B 2 ICZ-Boster
ICZ-505TDS White trivalence cromate Excellent gloss Excellent ductility and covering 8-10 barrel 6-8 rack
ICZ-520 High temperature and natural color trivalence cromate Form natural color cromate 12-14 barrel 10-12 rack
ICZ-530 Normal temperature and One-solution form nature color trivalence cromate Form cromate layer of gloss Long life of solution Trivalence cromate of normal temperature type 8-10
ICZ-540R, S Normal temperature and two- solution form nature color trivalence cromate Form natural color cromate Long life of solution Excellent corrosion Trivalence cromate of normal temperature type ICZ-540R 8-10 ICZ-540S 1-2
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17. Protective coating product
?????Incheon Chemical Co.,
Product Name Application Property M/U Working Condition Reference
S-510 M protective coating of trivalence and hexavalent cromate layer form translucent coating layer S-510M 50 V (Rack) S-510M 70 V (Barrel) 1540 ? 1030 sec
S-100B protective coating of trivalence and hexavalent cromate layer strong elasticity and form transparent coating layer S-100B 70 V (Rack) S-100B 100 V (Barrel) 1540 ? 1030 sec
WS-510 protective coating of trivalence and hexavalent cromate layer. strong elasticity and form transparent coating layer WS-510 50V (Rack) WS-510 70100 V (Barrel) 1540 ? 1030 sec
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18. Electrolysis plating process
?????Incheon Chemical Co.,
Product Name Application Property M/U M/U M/U M/U Process Condition Process Condition Process Condition
electrolysis Ni-plating ENP 2000 Gloss Ni-plating for PCB Low stress and good elongation. Half bright to full bright. Excellent adhesion. Nickel Sulfamate 300 - 375 g/L Nickel Chloride (6 H2O) 7.5 - 15 g/L Boric Acid 45 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Nickel Sulfamate 300 - 375 g/L Nickel Chloride (6 H2O) 7.5 - 15 g/L Boric Acid 45 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Nickel Sulfamate 300 - 375 g/L Nickel Chloride (6 H2O) 7.5 - 15 g/L Boric Acid 45 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Nickel Sulfamate 300 - 375 g/L Nickel Chloride (6 H2O) 7.5 - 15 g/L Boric Acid 45 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Temp. 52(5060) ? The cathode CD 15 ASD PH 4.0 (3.84.5) Temp. 52(5060) ? The cathode CD 15 ASD PH 4.0 (3.84.5) Temp. 52(5060) ? The cathode CD 15 ASD PH 4.0 (3.84.5)
high speed Ni-plating ENP 2000 High CD PCB Ni-plating High purity, low stress, excellent elongation, form high degree of purity Ni layer Possible for wide CD and high speed plating Excellent durability about impurities Easy to work and control. Excellent stability and long life of solution. Nickel Metal as Sulfamate 120 - 135 g/L Nickel Chloride (6 H2O) 0 - 15 g/L Boric Acid 37 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Nickel Metal as Sulfamate 120 - 135 g/L Nickel Chloride (6 H2O) 0 - 15 g/L Boric Acid 37 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Nickel Metal as Sulfamate 120 - 135 g/L Nickel Chloride (6 H2O) 0 - 15 g/L Boric Acid 37 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Nickel Metal as Sulfamate 120 - 135 g/L Nickel Chloride (6 H2O) 0 - 15 g/L Boric Acid 37 - 53 g/L ENP-2000 Additive 20 ml/L ENP-2000 Wetter Up to 10 ml/L Temp. 55(5065) ? CD 550 ASD PH 4.0 (3.54.5) Temp. 55(5065) ? CD 550 ASD PH 4.0 (3.54.5) Temp. 55(5065) ? CD 550 ASD PH 4.0 (3.54.5)
Acid hard gold Co alloy CA 500 Hard gold barrel, rack and high speed. Easy high speed plating by Barrel, rack Alloy 0.15 0.30 Co Hardness 130-200 Knoop Density 17.5 g/cm3 CA 500 M CA 500 C Gold concentration Barrel Rack High speed Temp. CD Barrel rack High speed
Acid hard gold Co alloy CA 500 Hard gold barrel, rack and high speed. Easy high speed plating by Barrel, rack Alloy 0.15 0.30 Co Hardness 130-200 Knoop Density 17.5 g/cm3 CA 500 M CA 500 C Gold concentration 500 25 4 500 30 8 500 ml/L 45 ml/L 12 g/L Temp. CD 30-50? R 0.1-3ASD B 0.1-1.5 ASD 40-60? 1-15ASD
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18. Electrolysis plating process
?????Incheon Chemical Co.,
Product Name Application Property M/U M/U M/U M/U Process Condition Process Condition Process Condition
Overall acid hard gold Ni-alloy plating NA 500 Hard gold barrel, rack and high speed. Use in barrel, rack, high speed Purity 0.15 0.30 Ni Hardness 130-200 Knoop Density 17.5 g/cm3 NA 500 M NA 500 N Gold concentration Barrel Rack High speed Temp. CD Barrel rack High speed
Overall acid hard gold Ni-alloy plating NA 500 Hard gold barrel, rack and high speed. Use in barrel, rack, high speed Purity 0.15 0.30 Ni Hardness 130-200 Knoop Density 17.5 g/cm3 NA 500 M NA 500 N Gold concentration 500 25 4 500 30 8 500 ml/L 45 ml/L 12 g/L Temp. CD 30-50? R 0.1-3ASD B 0.1-1.5 ASD 40-60? 1-15ASD
Soft gold plating GP 500 PCB pad and all pattern Au plating Excellent bonding intensity Excellent solderability Application to Rack, barrel Purity 99.9 Hardness 5090 Knoop Density 19.3 g/cm3 GP 500 M GP 500 A Gold concentration Barrel Rack High speed Temp. CD Barrel rack High speed
Soft gold plating GP 500 PCB pad and all pattern Au plating Excellent bonding intensity Excellent solderability Application to Rack, barrel Purity 99.9 Hardness 5090 Knoop Density 19.3 g/cm3 GP 500 M GP 500 A Gold concentration 500 5 6 500 5 8 500 ml/L 5 ml/L 12 g/L Temp. CD 50? R 0.1-0.5ASD B 0.1-1 ASD 60? 1-10ASD