Materials

About This Presentation

Title:

Materials

Description:

Title: No Slide Title Author: CHANCHR Last modified by: Yim, Myungjin Created Date: 5/24/2001 7:44:40 PM Document presentation format: On-screen Show (4:3) – PowerPoint PPT presentation

Number of Views:36

Avg rating:3.0/5.0

Slides: 5

Provided by: CHANCHR

Learn more at: https://site.ieee.org

Category:

more less

Transcript and Presenter's Notes

Title: Materials

1
Materials Processes Technical Committee Meeting
May 28, 2014, Wednesday 700 - 800 AM Europe 3,
Swan Dolphin Resort, Walt Disney World
Attendees (in random order) Eric Perfecto,
Diptarka Majumdar, Dong W. Kim, Bing Dang,
Kwang-Lung Lin, M. J. Yim, Daniel Lu, Jim Morris,
Bill Chen, Ning-Cheng Lee, Chin C. Lee (Chair),
C. P. Wong, Yu-Hua Chen. Agenda Introduction
each member introduced him/herself. Report on
Webniar in Oct. 2013 Daniel Lu Report on
Newsletters M J Yim Report of ECTC MP
Subcommittee Diptarka Majumdar IEEE CPMT
Advanced Packaging Materials (APM) Symp., 2015
It was planed to be held in Shenzhen in Oct-Nov.
2015. At present, steering committee includes Tim
Chen and Daniel Lu. Anything else ITRS Assembly
and Materials workgroups to organize a workshop
as a part of APM 2015.
2
CPMT-MP News Letter Status

MJ Yim
CPMT-MP TC Web Administrator

3
Uploaded Newsletter and Contributors

2014
May 2014 News Letter- NEW!
CPMT MP TC Newsletter May 2014 DW KIM Final (DW
Kim _at_ Qualcomm)
2013
December 2013 News Letter
Silver flip-chip technology poster (CC Lee _at_UC
Irvine)
November 2013 News Letter
2013_Saint-Venant_CPMT_Materials_TC_120613 (E.
Suhr _at_Portland State Univ.)
October 2013 News Letter
IEEE CPMT-TC5 Materials and Process-MJ
Yim-Oct-Newsletter-2013 (MJ Yim _at_Intel)
August 2013 News Letter
CMPT MP TC Newsletter Aug 2013 (Paik) (KW
Paik_at_KAIST)