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ECSE-6230 Semiconductor Devices and Models I Lecture 10 Prof. Shayla Sawyer Bldg. CII, Rooms 8225 Rensselaer Polytechnic Institute Troy, NY 12180-3590 – PowerPoint PPT presentation

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Title: ECSE-6230 Semiconductor Devices and Models I Lecture 10


1
ECSE-6230Semiconductor Devices and Models
ILecture 10
  • Prof. Shayla Sawyer
  • Bldg. CII, Rooms 8225
  • Rensselaer Polytechnic Institute
  • Troy, NY 12180-3590
  • Tel. (518)276-2164
  • Fax. (518)276-2990
  • e-mail sawyes_at_rpi.edu

1
sawyes_at_rpi.edu www.rpi.edu/sawyes/courses.html

May 21, 2014
2
Lecture Outline
  • Junction Breakdown
  • Zener Breakdown
  • Avalanche Breakdown
  • PN Junction Switching Characteristics
  • Charge Control
  • Constant Current Turn Off
  • Reverse Bias Turn Off
  • Midterm notes

3
Junction Breakdown
  • With the increase in reverse voltage across a pn
    junction, when the voltage reaches the breakdown
    voltage (BV), a large reverse current starts to
    flow.
  • Junction breakdown is due to the high electric
    field at the junction.

4
Junction Breakdown
  • Basically, 2 breakdown mechanisms
  • If the BV lt 4 Eg / q ( 4V in Si ), carrier
    tunneling across the junction dominates ( Zener
    breakdown )
  • If the BV gt 6 Eg / q ( 6V in Si ), carrier
    multiplication within the depletion region due to
    impact ionization is the major process (
    Avalanche breakdown )

5
Junction Breakdown
  • Zener breakdown -
  • Usually occurs in p/n junctions
  • Electrons tunnel from the valence band through
    the bandgap to the conduction band
  • Breaking of the covalent bonds due to high
    electric field (called field ionization) is the
    basic mechanism

6
Junction Breakdown
  • Tunnel barrier is of the triangular shape
  • Use WKB (Wentzel-Kramers-Brillouin) approximation
  • Put varying conduction band in terms of electric
    field
  • Find tunneling probability
  • Tunneling current, from either band to empty
    states in the other

7
Avalanche Breakdown
  • Small initiation current leads
  • to large current due to carrier
  • multiplication resulting from impact ionization
    caused by the
  • high electric field ( gt 105 V/cm ) near the
    metallurgical
  • junction.

8
Avalanche Breakdown
  • Assume Ip0 incident from the left side of the
    depletion region with width WDm.
  • With high electric field, e-h pairs are created,
    Ip will increase with distance and reach MpIpo at
    xWDm
  • In will increase from In(WDm)0 to In(0)I-Ipo
  • The total current is constant at steady state
    (IIpIn)
  • The incremental hole current is equal to the
    number of e-h pair generated per second in the
    distance dx

9
Avalanche Breakdown
  • Boundary condition
  • When VR ? BV, Mp ? ?.
  • The breakdown condition can be specified as the
    ionization integral
  • If the avalanche process is initiated by
    electrons instead of holes

is
10
Avalanche Breakdown
  • Since avalanche breakdown does not depend on the
    carriers or primary current, either ionization
    integral can be used.
  • For semiconductors with equal ionization rates (
    ?n ?p ? ) such as GaP, the ionization
    integral reduces
  • Breakdown voltage for one sided abrupt junctions
  • Breakdown voltage for linearly graded junctions

11
Avalanche Breakdown
  • For an abrupt, one-sided pn junction,
  • ?max ( 2 q NB VR ) / ?S 1/2
  • So, BV ?S ?cr2 / ( 2 q NB )
  • ?cr is a weak function of doping because the
    depletion layer width (hence ionization path)
    decreases with increasing doping.

12
Avalanche Breakdown Voltage
  • With a universal expression, accounting for
    instances where a uniform field over a large
    distance does not exist, Sze has derived
  • BV 60 ( Eg / 1.1 )3/2 ( NB / 1016 )-3/4
  • for an abrupt junction
  • ? NB-3/4
  • and
  • BV ( Eg / 1.1 )6/5 ( a/(3 x 1020))-2/5
  • for a linearly graded junction
  • However, these expressions are NOT valid for wide
    bandgap (gt 2 eV) semiconductors, such as SiC and
    GaN. (total voltage must be larger than bandgap)

13
Avalanche Breakdown Voltage
  • Calculated breakdown voltage as a function of N
    for abrupt junctions
  • Dashed line is the upper limit of N for which the
    avalanche breakdown calculation is valid
  • Based on criterion 6Eg/q above it tunneling will
    dominate

14
Avalanche Breakdown Voltage
  • For diffused junctions with a linear gradient
    near the junction and a constant doping on one
    side the BV lies between two limiting cases
  • For a large a, the BV is given by the abrupt
    junction results
  • For small a, BV is given by the linearly graded
    junction and is independent of NB

15
Avalanche Breakdown Voltage
  • It is assumed that the semiconductor layer is
    thick enough to support the maximum
    depletion-layer width WDm at breakdown
  • If the semiconductor layer W is smaller than WDm
    the device will be punched through
  • Punchthrough breakdown is earlier

16
Planar Junctions
  • Actual pn junction have junction curvatures that
    are cylindrical or spherical, leading to electric
    field concentrating
  • Breakdown voltages are significantly less than
    those of the 1-dim, parallel plane junction that
    we have examined thus far

17
Avalanche Breakdown Voltage
With ? ? rj / WDm , Cylindrical
curvature And spherical curvature As the
radius of curvature becomes smaller, so does the
breakdown voltage
18
Avalanche Breakdown Voltage
19
Transient behavior
  • For switching applications the transitions form
    forward bias to reverse bias and vice versa much
    be nearly abrupt and the transient time short
  • The response from forward to reverse is limited
    by minority carrier charge storage
  • We investigate the switching of a diode from its
    forward state to its reverse state
  • Begin with just from on to off

20
Large-Signal Charge-Control Model
  • Use the time dependent continuity equation.
    Obtain each component of the current at position
    x and time t
  • Integrate both sides for instantaneous current
    density
  • For injection into a long n region from a p
    region, take current xn0 to be all hole current
    and Jp at xn8 to be zero.

21
Large-Signal Charge-Control Model
  • Total injected current including time variations
  • Hole current injected across the p n junction(
    total diode current) is determined by two storage
    charge effects
  • (1) usual recombination term, excess carrier
    distribution is replaced every tp seconds
  • (2) charge buildup (or depletion term) carriers
    can be increasing or decreasing in a time
    dependent problem

22
Charge Control Equation
  • Solve for stored charge as a function of time for
    a given current transient
  • Turn off transient, current is suddenly removed
    at t0, leaves the diode with stored charge

23
Charge Control Equation
  • To solve for v(t) an approximate solution can be
    obtained by assuming an exponential distribution
    for dp at every instant during the decay
  • Quasi-steady state approximation neglects
    distortion due to the slope requirement at xn0

Non exponential
24
Charge Control Equation
  • Not accurate in its details but indicates that
    the voltage across a pn junction cannot be
    changed instantaneously
  • Stored charge can present a problem in a diode in
    switching applications
  • Problems of stored charge can be reduced by
  • Narrow n region (if shorter than hole diffusion
    length, very little charge is stored
  • Adding recombination centers such as Au to Si

25
Constant Current Turn-Off
  • Constant Current Turn-Off Case for a Long-Base
    Diode
  • The Charge Control Equation becomes
  • dQp / dt Qp(t) / ?p 0
  • B.C.s (a) i(t lt 0) I, (b) i(t gt
    0) 0
  • Solving using Laplace Transform with Qp(0) I
    ?p
  • Qp(s) / ?p s Qp(s) - I ?p 0
  • Qp(s) I ?p / ( s 1 / ?p )
  • Performing reverse Laplace transform
  • Qp(t) I ?p exp ( - t / ?p )
  • ?pn(t) pn0 ( exp ( q v(t) / kT ) - 1 )
  • What is v(t) ?

26
Constant Current Turn-Off
  • Assume the quasi-steady state approximation.
  • ?pn( x, t ) ?pn( t ) exp ( - ( x xn ) /
    Lp )
  • Qp(t) q A ?WN ?pn( x, t ) dx
  • ?xn
  • q A ?WN ?pn( t ) exp ( - ( x xn ) /
    Lp ) dx
  • ?xn
  • q A Lp ?pn( t )
  • ?pn( t ) pn0 ( exp ( q v(t) / kT ) 1 )
    Qp(t) / ( q A Lp )
  • v(t) ( kT/q ) ln ( I ?p ) / ( q A Lp pn0 )
    exp ( - t / ?p ) 1

27
Reverse-Biased Turn-Off of pn Junctions
  • The switch is flipped from VF at tlt0 to VR tgt0
  • Large reverse current occurs first. Why?

28
Reverse-Biased Turn-Off
  • Transient time current drops to 10 of initial
    reverse current sum t1 and t2
  • t1 is the constant current phase, t2 is the decay
    phase
  • During the decay phase, excess charge is being
    removed primarily by recombination
  • The device approaches steady state dc in the
    reverse bias condition

29
Large-Signal Charge-Control Model
  • Assume p/n junction with analysis on the n-type
    side
  • Continuity equation
  • Boundary conditions initial distribution of
    holes is a steady state solution to the diffusion
    equation and under forward bias the voltage
    across the junction is

30
Reverse-Biased Turn-Off

31
Reverse-Biased Turn-Off
  • Reverse-Biased Turn-Off Case
  • When 0 lt t lt tS (or t1 ), Cj can be neglected.
  • Charge control equation
  • Consider stored charge between 0lttltts or
    t1
  • With the initial conditions i( 0 lt t lt tS ) -
    IR, Qp(0) IF?F
  • so that
  • By setting Qstored0, t1 can be obtained

32
Reverse-Biased Turn-Off
  • Assume a triangular shape for
  • excess hole concentration with
  • slopes
  • tan(-?1) ? -??pn/?xt0 IF/qADp
  • and
  • tan(?2) ? -??pn/?xttS -IR/qADp
  • giving tan(?1)/tan(?2) IF / IR
  • ?pn(tS)/?pn(0)(1 tan(?1)/tan(?2))-1
  • 1 / ( 1 (IF / IR))
  • Qp(tS)/Qp(0) 1 / ( 1 (IF / IR))

33
Reverse-Biased Turn-Off
  • Reverse-Biased Turn-Off Case
  • After t1 , the hole density starts to decrease
    below its equilibrium value pno. The junction
    voltage tends to reach VR and a new boundary
    condition now holds. This is the decay phase
    with the initial boundary condition
  • The solution for t2 is

34
Reverse-Biased Turn-Off
  • Reverse-Biased Turn-Off Case
  • For a plane junction with the length of the
    n-type material W much greater than the diffusion
    length WgtgtLp, for a large IR/IF ratio, the
    transient time can be approximated as
  • For a a narrow base junction with WltltLp

35
Reverse-Biased Turn-Off
  • For IF IR,
  • tS() 0.7?p but tS() 0.25?p and
    tS() 0.29?p.
  • For t gt tS, the diode gets reverse biased and
    the current flowing through Cj can no longer be
    ignored.
  • Define ?R from i(t) - Qp(t) / ?R for
    t gt tS
  • Assuming ln ( 1 ( IF / (IF IR )) ? ln ( 1
    ( ?R / ?F )),
  • (where ?F / ?R is called the excess charge
    ratio and 4 for a
  • short-base diode)
  • ?R ?F ( IF / (IF IR ))
  • If we assume a resistive load, dv(t) - R
    di(t)
  • di(t)/dt ( ?R R Cj ) i(t) ( 1 ( ?R /
    ?F )) 0

36
Reverse-Biased Turn-Off
  • with B.C. i( t tS ) - IR
  • Solution i(t) - IR exp - ( t tS ) / ? ,
    t gt tS
  • ? ( ?R R Ct ) / ( 1 ( ?R / ?F ))
  • Fall time, tf (or t2 ), is the time taken for the
    reverse current to fall from IR to 0.1IR
  • tf ? 2.3 ( ?R RCj ) / (1 ( ?R / ?F ))
  • If ?R ltlt RCj, tf ? 2.3 RCj
  • Cj can be approximated to the average of the
    capacitances at zero and full reverse bias.

37
Reverse-Biased Turn-Off
  • Ex. A long pn junction diode is forward biased
    to IF 10mA.
  • Let a reverse bias of 10V be applied through a
    5k? at t 0.
  • Let Cj (V0) 18pF and Cj(V-10V) 6pF, so
    that Cj ? 12pF.
  • Assume ?F 0.2?s. Calculate tS and tf.
  • Neglecting the voltage drop across the diode,
  • IR 10V / 5k? 2mA
  • tS (2x10-7s) ln ( 1 (1.5/2) ) - ln ( 1
    (1.5/3.5) ) 4x10-8s
  • ?R ?F (1.5/3.5) (3/7) ?F
  • tf 2.3 ((3/7)(2x10-7) (5x103)(12x10-12))
    / ( 1 (3/7))
  • ? 2.35x10-7s
  • tr tS tf ? 2.75x10-7s

38
Midterm Short Paper
  • 2-3 pages
  • Introduction
  • Background
  • Basics of material (if needed)
  • Basics of operation
  • How it relates to SDM1
  • Technical Relevance, Overall Impact, Applications
  • Future Work
  • Experimental plan, Milestones
  • Equipment and/or simulation program
  • Expected Outcomes (optional)
  • References (IEEE Style)

39
Midterm Short Presentation
  • 10 minutes total including questions
  • 5-7 slides
  • All figures must be referenced in the caption if
    from article or book
  • Feedback evaluations from Prof. to provide input
    on speaking and content
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