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HighSpeed Serial Interface Test in Production

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Title: HighSpeed Serial Interface Test in Production


1
High-SpeedSerial Interface Testin Production
  • Assure Device Interoperability In Real-World
    Environments

2
About GuideTech
  • Specializing in Precision Timing for
    Semiconductor Test and Scientific Lab Communities
    since 1988
  • Core Technologies
  • Continuous Time Interval Analyzer (CTIA)
  • Fast Datacom Analysis Software (DCA)
  • High Channel Count, Parallel Architecture

Targeting production test of
high-speed serial interfaces
3
Sample Applications
  • Semiconductor Test
  • PLL Spread Spectrum Clocks
  • Source Synchronous Bus
  • Embedded-Clock Serial I/O
  • Scientific Analysis
  • Jet Engine Rotation/Vibration
  • Atomic Clock Drift Particle decay
  • GuideTech Keeps the Planets time!

4
The Need for Speed
  • PCs move to high-speed serial buses in 20051
  • 80 - 2.5Gbps PCI-Express
  • 100 - 1.5Gbps Serial-ATA
  • 20 - Gigabit Ethernet
  • But test quality is not yet assured!
  • 1 Morgan Stanley Sep 22, 2003 Semiconductor
    Capital Equipment Industry Research

2 pairs of differential channels _at_ gt800Mbps
16 channels _at_ lt 200Mbps
Controller Device
Controller Device
5
ATE Performance Gap
1.2G - 3.2G Embedded-clock Serial (e.g. XAUI,
SATA, FC PCI-Express)
Performance
GuideTech has been filling the gap since 2001
High Speed High Accuracy High Throughput Asynchron
ous test
2001 2004 Year
6
A New Test Paradigm
  • Scope
  • Slow, Statistical Averaging
  • Gross test of Total Jitter Eye
  • CTIA DCA
  • Fast, Frequency Domain Analysis
  • Per-edge timing analysis

7
Continuous TIA Technology
  • Continuous Timestamps
  • Record edge timing event count relative to
    (T0,E0)
  • Multiple measurement types derived from same data
    set
  • All measurement channels reference same (T0,E0)
  • Powerful Pulse Selection Arming
  • Walk measurements through data patterns
  • Skip pulses to measure specific pulses

E0 E1 E2 E3
T0 T1 T2 T3 T4 T5
T6
8
Non-Continuous TIA Drawbacks
  • Non-Continuous TIA based on simple Time Counter
    technology
  • Random, absolute measure of time intervals
  • No inherent reference to common (T0,E0)
  • Relies heavily on Statistical Analysis methods

Time interval 1
Time Interval 2
  • Requires physical Pattern Marker for highest
    accuracy
  • Pattern match adds test time to synchronize to
    patterns
  • Pattern match unreliable in presence of large
    jitter
  • Requires repeating SEARCH for one-shot
    measurements
  • PLL Lock Time

9
CTIA Single-Shot Capability
  • Test PLL Spread Spectrum Clocks in production
  • One-shot
  • Frequency
  • Modulation
  • Lock Time
  • Jitter
  • No arming
  • Picosecond accuracy
  • In milliseconds
  • 8 in parallel
  • Up to 64 channels

10
CTIA Frequency Domain Analysis
  • CTIA time correlation enables plot of time
    interval error (TIE)

Dt 0 Dt 1 Dt 2
Dt 3 Dt 4 Dt 5 Dt 6
Auto Correlation Plot Of Sinusoidal Jitter
TIE Dt (ps)
Time (us)
FFT of the TIE plot provides the amplitude and
frequency of sinusoidal jitter/modulation
AMPLITUDE
FREQ
11
Functional Test ofNon-deterministic Signals
ATE Digital Compare Method Requires Match Mode
to position strobes
Non-continuous TIA Requires Marker to locate
desired bit location
Continuous TIA Reconstructs repeating signals
with Virtual Marker
12
CTIA Virtual Marker
  • Edge isolation reconstruction of
    non-deterministic bit patterns
  • Known Bit Pattern UI
  • Selectable Bit Event Count
  • Correlated CTIA Timestamps (Tn,En)
  • More reliable than a physical pattern marker in
    high jitter signals
  • Reduces test times to milliseconds for
  • Per-edge jitter analysis
  • Asynchronous pattern verification

13
Serial Interface Test in Production
  • Many test options
  • High-peed ATE
  • BERT
  • Scope
  • Jitter Analyzers
  • Few cost-effective approaches
  • Loopback
  • On-chip DFT/BIST

But no test is not an option anymore
14
Serial I/O Loopback Test
  • Benefits
  • Low-cost vs expensive ATE pin electronics
  • Addresses asynchronous issue with ATE

TXdiff RXdiff
  • Drawbacks
  • Gross Functional Test only
  • Does not insure device interoperability in
    real-world system environments

15
Assure Real-World Performance
  • BER helps insure real-world performance but is
    too slow for production
  • High-throughput jitter analysis can estimate BER
    in production
  • TX Jitter Analysis
  • Predicts far-end jitter degradation after TX
    signal is subjected to system connectors,
    switches and PCB traces

16
Random Jitter
  • Causes of Random Jitter
  • Thermal noise
  • Transistor current fluctuation shot noise
  • Flicker noise (1/f noise)
  • Random Jitter is a contributing factor to Bit
    Error Rate

BER 10-6 10-8 10-10 10-12
SJ
DJ
Eye Width _at_ BER 10-12
QxRJ
Q 14.069 _at_ BER 10-12
17
RJ is important for fast BER estimation
  • Measuring Bit Error Rate on a BERT can take hours
    or days
  • Quickly determine Total Jitter for a BER of 10-12
  • Jitterp-p ( Q x RJRMS ) DJ
  • Q 14.069 _at_ BER 10-12
  • Due to the large Q multiplication factor, RJ
    measurements must not be contaminated by PJ and
    DDJ components

Probability Density Functions (PDF) of jittering
edge timing
Gaussian RJ RJ contaminated by PJ
RJ contaminated by DDJ
18
Data-Dependent Jitter is Important
  • Most PHY-layer I/O failures are DDJ-related
  • Causes of DDJ
  • Bandwidth limitations in signal path
  • Frequency dependent
  • Pattern dependent
  • Output driver faults
  • Duty cycle distortion
  • Rise/fall times
  • Packaging

19
CTIA DataCom Jitter Analysis
  • GuideTech DCA Provides
  • Data Pattern Verification
  • Random Jitter (RJ)
  • Data-Dependent Jitter (DDJ)
  • Periodic Jitter (PJ)
  • Total Jitter (TJ)
  • Bit Error Rate (BER)
  • Eye Width

Continuous TIA technology enables fast and
accurate quality assurance
20
CTIA RJ Immune to PJ
  • CTIA continuous timestamping enables isolation of
    the RJ noise floor by removal of PJ frequency
    components in the FFT spectrum and DDJ using
    virtual marker
  • Statistical (Curve fit) methods are prone to
    estimation errors depending on the PDF shape

PDF showing RJ contaminated by PJ DDJ
21
RJ Immunity to DDJ
  • CTIA continuous timestamps act as a virtual
    marker
  • Isolate edges
  • Remove DDJ offset before performing FFT for RJ
    analysis

0 1 0 1 1 0 0 0 0 0 1 0 0
T0
IDEAL Edge-6 location
Count
DDJ offset
1P 1N 2P 2N
3P 3N
22
CTIA vs. double-delta method
  • CTIA measures edge shifts independently on each
    data bit
  • Produces highly repeatable DDJ results per-edge
  • Avoids inaccuracies of statistical double-delta
    methods

Continuous TIA
23
10x Throughput with PicosecondDCA Correlation to
Scope
  • DCA correlates to Agilent 86100 within
    picoseconds
  • DCA test time is less than 1 sec vs. 10 sec on
    scope (K28.5)

24
DCA Fast Jitter Separation
  • Select DCA test time
  • Pattern length
  • PJ resolution
  • PJ ON/OFF
  • RJ precision

Test Time (sec)
10s 5s 1s 250ms
Pattern Length (bits)
K28.5 PCIe PRBS15
640 bit 32,767 bits Compliance
Pattern
25
The Value of Jitter Test
  • Jitter test saves money
  • Test Escapes
  • Field Returns
  • RMA failure analysis
  • Lost Business
  • Yield Loss
  • Failing good devices
  • Time-to-Market Delays
  • Long characterization-to-production correlation
    time
  • Unprepared to debug unexpected process variation
    at final test

26
CTIA Provides the Missing Pieces
Introducing the GT4000 Continuous TIA Booth
1420
  • Test Asynchronous signals
  • High Throughput Virtual Marker
  • Repeatable Jitter Analysis
  • 64 Single-ended / 32 Differential

27
High-SpeedSerial Interface Testin Production
  • Assure Device Interoperability In Real-World
    Environments
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