Purchase of Wafer Aligner/Bonder

1
Purchase of Wafer Aligner/Bonder

• Andrew Loomis
• April 7, 2000

2
Outline

• System objectives
• Alignment options
• Principles of alignment
• Bonder functions
• Available systems
• Summary

3
System Objectives

• Face to face wafer alignment
• ? 0.25mm alignment accuracy
• Hold alignment and bond
• Robust and void free bond
• Various bonding options
• Anodic
• Silicon Fusion
• Eutectic
• Adhesive

4
Alignment Options

• Bottom Side Alignment (BSA)
• Inter Substrate Alignment (ISA)
• Top Side Alignment (TSA)
• Infrared Alignment (IR)

5
Principles of Alignment
6
Bonder Functions

• Max. bond temperature- 550ºC
• Max. pressure- 1000 lbs
• Anodic bonding- 1200V/ 50ma
• Vacuum- 5 E-3 mbar

7
Available Systems

• Only two companies make wafer align and bond
  equipment
• Karl Suss
• Electronic Visions Systems
• Both claim /- 1mm accuracy
• Both companies have similar platforms
• Barely satisfactory for existing program
• New system development will be necessary

8
Summary

• Current status
• Visited with both companies
• RFQ being placed
• Lack of market needs for high precision
  aligner/bonder
• Present systems available will work with relaxed
  design tolerances
• 3D program will demonstrate the need for advanced
  systems
• Technology already exists for high precision
  systems
• Stepper alignment technology
• Interferometric alignment stages and precision
  air bearing tables