Optical interconnection and technologies

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Optical interconnection and technologies

• Jean-Jacques AUBERT
• CEA/LETI

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SIA ROAD MAP
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ELECTRONS and PHOTONS
Electrons
Photons
Losses
Optical link
Laser threshold
Electrical link
0
Data rate Distance
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VCSELs



2008
Laser diodes
InP

INTRACHIP
INTERCHIP

1,3 - 1.55 µm

2000
MCM- Pistes -
Flip
Chip

Fiber optics
TELECOM
ELECTRONS
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DATA COMMUNICATIONS
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OPTICAL INTERCONNECT

• Inter computer and inter board
• Optical link
• Llt1km
• Low cost
• Interchip
• Optical mother board
• Intrachip
• Front end
• Back end

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OPTICAL LINKS

• Spécifications
• High data rate board interconnect
• Maximum 200 m
• Parallel (10 fibres )
• 8 channels
• 2 clocks
• Data rate
• 2,5 Gbit/s per fibre
• to 10 Gbit/s
• Low cost

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Optical mother board
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INTRACHIP INTERCONNECTS

• On SOI front-end level, Si waveguide

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INTRACHIP INTERCONNECTS

• On Silicon, back-end level

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Technologies and components

• New laser sources
• VCSELs
• Micro disk lasers
• New detectors
• SiGe SiGeC
• Integrated optics
• Photonic bandgap materials
• Splitters
• WDM

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VCSELs
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VCSELs
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Interconnect scheeme
detector
coupler
Laser
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Photonic micro structures
1D PBM holes 100nm
period 300nm
filter
Ring filter Diametre 4µm Lines 280nm
PBM 2D F 480nm Pitch 100nm
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Integrated optics on silicon
"Phasar" WDM
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1 x 8 SPLITTER
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CONCLUSION

• Optical links between computers are a reality
• Intra chip optical interconnections are for
  tomorrow
• Todays microelectronics challenge is to shift
  from aluminium to copper
• Next challenge is to shift from copper to photons