By: Josh R. Fairley

1
PERIPHERALS AND MOTHERBOARD FOR THE BASIC STAMP

• By Josh R. Fairley
• Advisor Dr. Raymond S. Winton

2
PURPOSE

• The purpose of this project is to design a set of
  motherboard core and peripheral modules for
  high-throughput applications to be implemented in
  grades 7 12 and in senior electrical
  engineering laboratories.

3
OBJECTIVE

• 1. ELECTRICALCOMPONENTBEHAVIOR
• 2. ELECTRICAL ENGINEERING DESIGN
• STRATEGIES
• 3. TECHNICAL SKILLS

4
GOALS

• TO DEVELOP AN EFFICIENT ENVIRONMENT THAT WILL
  PRODUCE
• UNDERSTANDING OF ELECTRICAL CIRCUIT
  BEHAVIOR
• WORKING PROTOTYPES FOR A LARGE VARIETY OF
  PROJECTS

5
Requirements

• Modularity
• Manufacturing
• Physical Packaging
• Reliability

6
Design Strategy

• Use Stamp as Foundation Controller for multiple
  peripheral modules
• Use communication between Stamps to increase
  complexity of a project
• Create condensed packaged Motherboard/Module
  demos

7
Foundation Controller

• Output Current for I/O pins for Stamp I/II
• DOS based application to interface BSI
• Programming Languages
• Memory Size
• I/O pins
• Port interface between PC/Basic Stamp

8
Foundation Controller
9
Motherboard
10
Stamp Communication

• Serin program command
• Hardware implemented for communication process

11
Test Specification

• Size Dimensions
• Component Reliability
• Code Functionality
• Overall System Test

12
Packaging

• Transport Circuit Design to PC Board
• Package multiple demos into one overall storage
  unit

13
7-Segment Module
14
LED Module
15
Dipswitch Module
16
MotherBoard/Module Demos

• FOUNDATION
• BASIC STAMP II MICROCONTROLLER
• PERIPHERALS

DISPLAYS TRANSDUCERS STEPPER
MOTORS SERVOMOTORS THERMISTORS
LEDS
17
Stamp/Module Costs

• Source Hosfelt Electronics, Inc
  888-264-6464
• or
  800-524-6464
• Catalog 99R customer 397M12
• page stock item ea
  quan tot
• 47 51-393 DIP switch w/rocker actuator
  .85 20 17.00
• 82 42-104 Solderless breadboard
  10.95 10 109.50
• 105 13-398 Minature speaker
  .99 20 19.80
• 117 25-350 3mm Red LED
  .12 200 24.00
• Tot
  170.30

18
Continued Cost Analysis

• HOSFELT ELECTRONICS, INC Catalog 99B
  Cust 397M12 (MSU-ECE)
• Page Part no quan item
  ea tot
• 28 80-243 2 pkt 65 carbide drills
  3.25 6.50
• 28 80-247 2 pkt 53 carbide drills
  3.25 6.50
• 47 51-334 20 mercury tilt
  switch .75 15.00
• 67 7406 50 Hex inverter
  .39 19.50
• 72 42-194 8 4"X6" PC board
  5.99 47.92
• 86 21-267 100 16-pin DIP socket
  .08 8.00
• Total
  103.42

19
Continued Cost Analysis

• page stock item
  ea quan
• 62 AO2047-ND 9-pin D-sub connector,
  female 2.15 25 53.75
• 62 AO245-ND 25-pin D-sub connector,
  male 3.02 25 75.50
• 224 ZHB6718CT-ND H-bridge
  3.76 20 75.16
• 384 KC003T-ND Minature thermistor
  2.43 20 48.64
• Tot
  253.05

20
Continued Cost Analysis

• page cat item
  size ea quan tot
• /cclad-s.htm S1-36G 1/16" FR4 glass epoxy
• with 1 oz copper foil
  3x6 12.20 10pkg 122.00
• /chemphot.htm
• KD-1G type-S Develop soln
  1Gal 32.90 1 32.90
• PRSK-1G type-S Stripper
  1Gal 92.45 1 92.45
• /chemetch.htmFerric Chloride
• E-1G Ferric Chloride
  1Gal 20.80 1 20.80
• FSB-500 Scotchbrite pad
  12x24 21.00 1 21.00
• /chemplat.htm
• ITP-1QT Immersion Tin plate
  1qt 23.80 2 47.60
• tot
  336.75

21
Continued Cost Analysis

• BS1-IC BASIC stamp 1 _at_30.60 ea quan 15
• tot 459, SH not included.

22
Test Certification

• Manufacturing of Printed Circuit Boards
• Component Choice
• Code Functionality
• System Test

23
Conclusions

• Success was achieved for project implementation
  for grades 7 12
• Shortcoming Did not construct projects of
  appropriate complexity for senior design
  electrical engineering laboratories

24
Future Progress

• Continued design and manufacturing of
  motherboard/peripheral module demos to be
  implemented in senior level electrical
  engineering laboratories