REBALLING BGA

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REBALLING BGA
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REBALLING BGA

• Desoldering
• ReBalling
• Soldering on PCB

Our Services
The task is to replace spheres on BGA package
devices
Necessary when the existing spheres become
deformed,damaged or lost Placing BGA can cause
soldering problems
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ReBalling Process
Baking
Preventing damage caused by pop corning
Clean off
Spheres remaining solder
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Pre-formed solder spheres are placedA short
laser pulseNo flux is required (inert gas)
ReBalling Process
Reballing

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ReBalling Process
1-Vision Inspection
2-Baking
24 hours at 125C
4-Vacuum Packing
3-Tape Reel