24 Layer '125 thick

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IS415 CAF IST Build

• 24 Layer .125 thick
• Core thickness .003, .004, .005, .006
• Prepreg
• 1ply 1080 .002
• 2ply 106 .0035
• 106/1080 .004
• 2ply 1080 .005
• Copper ½ ounce, 1 ounce, 2 ounce
• .008, .010, .0135 vias
• .008 blind vias

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Interconnect Stress Testing (IST)

• IST is an accelerated stress test method
• Creates uniform strain from within substrate
• DC current is used to heat the PTH barrels and
  forced convection cooling to cycle PTH
• Technique identifies and assesses the severity of
  post separation and barrel cracks

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IS415 IST Data


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CAF CHARTS
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IS415 CAF

• Wire, Clean and Bake Coupons
• Condition Coupons at C-24/23/50
• Test Insulation Resistance (IR) at 10, 48,100 V
  DC
• C-96/65/85 Without Bias Voltage
• Test Insulation Resistance (Stabilized IR)
• Go to 600 Hours with Bias Voltage
• at 85 C and 85 RH Bias 10 or 100 V DC
• Test Final Insulation Resistance

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IS415 CAF

• Failure Defined as One Decade Drop in IR
• From Stabilized IR to IR After 500 Hours
• Report Failure Rate Out of 25 Coupons ()
• Report by Hole to Hole Spacing and Bias Voltage

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IS415 CAF Pathways
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IS415 CAF 85DegC/85RH
Spacing between lines in-plane
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IS415 CAF 85DegC/85RH
Distance from PTH to surface trace
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IS415 CAF 85DegC/85RH
Space between hole walls
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IS415 CAF 85DegC/85RH
Spacing between lines in-plane
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IS415 CAF 85DegC/85RH
Distance from PTH to surface trace
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IS415 CAF 85DegC/85RH
Space between hole walls
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IS415 CAF 85DegC/85RH
Spacing between lines in-plane
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IS415 CAF 85DegC/85RH
Distance from PTH to surface trace
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IS415 CAF 85DegC/85RH
Space between hole walls
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IS415 CAF Summary

• 10VDC, 48VDC, 100VDC testing
• 600 hours testing
• NO REPORTED FAILURES

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