Gene A Frantz

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Personal and Portable The technology that is
making it happen
Gene A Frantz Principal Fellow Texas Instruments
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Decades of Digital Signal Processing
Decade
Characteristic
/MIPS
60s 70s 80s 90s Beyond
University Curiosity Military Advantage Commercial
Success Consumer Enabler
100 - 1,000 10 - 100 1- 10 10 - 1 1 - 10
Expected Part of Daily Life
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Generations of DSP
Processing
Processors
1980
1990
Technology
Product
Technology
What is DSP?
How do I create a product?
How do I solve problems?
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Early DSPing Milestones

• Before 1965 First tentative steps
• 1965 Rediscovery of the FFT
• 1965 to 1970 The potential becomes clear
• 1970 to 1980 Tools are developed
• 1980 VLSI makes it practical
• Now Incredible computational power opens up
  many new applications

Courtesy of Ron Schafer
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Some Early Contributors
Bishnu Atal
John Markel, Steen Gray
John Makhoul
Manfred Schroeder
Courtesy of Ron Schafer
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The TX-2 Computer, Circa 1967
Courtesy of Ron Schafer
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Another Contributor
Jack Kilby
1st Integrated Circuit
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One View of DSP, Circa 1976
That discipline which has allowed us to replace
a circuit previously composed of a capacitor and
a resistor with two anti-aliasing filters, an
A-to-D and a D-to-A converter, and a general
purpose computer (or array processor) so long as
the signal we are interested in does not vary too
quickly. Thomas P. Barnwell, III

Filter
Filter
D/A
A/D
IN
OUT
50
50
500
50
50
Courtesy of Ron Schafer
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Early DSPor Milestones
1978 TI Speak and Spell DSP synthesizer 1979
Intel 2920 Analog Signal Processor 1979
American Microsystems International S28211 1980
NEC µPD7720 1980 ATT Bell Labs DSP-1
(captive) 1982 TI TMS32010
Courtesy of Will Strauss
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The Key Drivers
Smaller Features è Lower Cost/Functionè Larger
Market
Plotted Annually
History
Forecast
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Lithography AdvancementsFuel Growth
Nano-meter
250nm 6" 19.2 1435
400nm 6" 80.7 310
350nm 6" 46.6 558
180nm 8" 10.7 2626
130nm 12" 6.7 12,186
90nm 12" 4.2 18,667
Die size (mm2)
Dies per wafer
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Shrinking Process The Benefits
Device Year Transistors Process 32010 1983 50,000
3.0um NMOS 32020 1984 100,000 2.4um
NMOS 320C30 1988 500,000 1.0um CMOS 320C50 1990 1,
200,000 0.8um 320C5510 2000 22,000,000 0.18um 320C
556x 2002 180,000,000 0.13um
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Wafer Fabs
Wafer size 300mm Final capacity 35K
wafers/ month Technology 130nm copper 90nm
copper Tools on floor 320 1st full flow
silicon 2-15-01 130nm qualification 2Q02
90nm customerprototypes
2H02
90nm qualification
2H03
Fab Space
Waffle table
118K sq. ft.
Total mfg
150K sq. ft.
Greater than 10K wafers per month
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130 nm Copper Technology Today
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90 nm
Transistor

• Over 400 million transistors on a single chip
• Functional integration to create entire system on
  one chip
• Delivery
• Initial test chips in 90 nm process 1H02
• First device 2H02
• Fully qualified production 2H03
• Result
• Cost-effective, system-on-a-chip
• Unprecedented performance levels
• Significant power savings

37 nm
6"
12"
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What will it cost?
EUV
450 ?
157-nm
300-mm
193-nm
248-nm
200-mm
i-line
150-mm
100-mm
g-line
1x scan
?
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The Future of Integration
DEVICE CAPABILITIES
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Trends In Technology

• Transistors moving from microns to nanometers
• Gates per square millimeter going from tens of
  thousands to hundreds of thousands
• Die sizes shrinking from tens of square
  millimetersto units of square millimeters
• Wafer size moving to 300 millimeter
• Dies per wafer increasing from thousands per
  wafer to tens of thousands per wafer
• Tooling costs going from hundreds of thousands
  ofdollars to millions of dollars
• Fab cycles increasing from weeks to months

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The Age of Computing
TAM
Internet DSP Analog
500B
100B
10B
1B
1960s
1970s
1980s
1990s
2000s
2010s
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The Perfect Roadmap
One Device
Even Fewer Devices
Fewer Devices
Lots of Devices
Time
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Quiz
Who is the only DSP Guru with their picture on a
Nations Currency?
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Quiz
Who is the only DSP Guru with their picture on a
Nations Currency?
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