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Programmable ASICs

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Title: Programmable ASICs


1
Chapter 4
  • Programmable ASICs

Application-Specific Integrated CircuitsMichael
John Sebastian Smith Addison Wesley, 1997
2
Programmable ASICs
  • Two basic types of programmable ASICs
  • Programmable Logic Device (PLD) - first developed
    as small programmable devices that can replace a
    handful of TTL parts
  • least complex ones are a simple AND/OR PLA with
    latches on the outputs and feedback paths to the
    inputs of the array
  • Field Programmable Gate Array (FPGA) - more
    complex devices that can hold up to 100K gate
    equivalents or more
  • some implemented as symmetrical arrays of simple
    logic devices
  • others include more complex and specialized logic
    blocks
  • An FPGA (or PLD) is an IC that is fabricated with
    some connections missing
  • The user (designer) creates a design to be placed
    on the FPGA using design entry and simulation
  • Automatic tools create a string of bits (a
    configuration file) describing the extra
    connections necessary to program the FPGA to
    perform the required function
  • A device programmer is then (usually) used to
    load the configuration file into the FPGA

3
FPGA Components
  • FPGAs have several basic components
  • Regular array of basic (programmable) logic cells
  • Level of complexity and number of different types
    of logic cells differs across manufactures and
    even across families from the same manufacturer
  • Programmable interconnect for connecting the
    basic cells into different configurations
  • Programming technology for configuring the cells
    and programmable interconnect
  • One-time-programmable (OTP)
  • Erasable
  • Programmed on power-up
  • Custom software used by the designer to create
    the configuration file

4
Programming Technology - the Antifuse
  • An antifuse is normally open
  • A high programming voltage is placed across it
  • This forces a programming current (about 5 mA)
    through it which melts the thin insulating
    dielectric forming a permanent, resistive silicon
    link

Figure 4.1 An Actel antifuse. (a) A cross
section. (b) A simplified drawing. (c) From
above, an antifuse is approximately the same size
as a contact.
5
Actel Antifuses
  • Actel antifuse technology uses three additional
    masks over a traditional CMOS process
  • Programming an ACTEL device requires about 5 to
    10 minutes per device
  • Production programming of more than 1000 or 2000
    devices per week requires a gang (multiple
    device) programmer

Table 4.1 Number of antifuses on Actel FPGAs
Figure 4.2 Distribution of resistances for blown
Actel antifuses.
6
Quicklogic Metal-Metal Antifuse
  • Metal-metal antifuses directly connect metal
    wiring layers - thus eliminating the parasitics
    of a polysilicon layer in between
  • Direct connections to the metal layers make it
    easier to use larger programming currents
    producing a lower antifuse resistance

Figure 4.3 Metal-metal antifuse. (a) An idealized
cross section. (b) A metal-metal antifuse in a
three-level metal process.
7
Quicklogic Metal-Metal Antifuse Resistance
Figure 4.4 Distribution of resistance values for
the QuickLogic metal-metal antifuse.
8
Configuration via Static RAM
  • Configuration data is loaded into static RAM on
    chip
  • Static RAM cells control pass transistors which
    configure the logic cells and interconnect
  • FPGA can easily be reconfigured, even on the fly
  • Power must be maintained to the chip to retain
    the configuration or the configuration can be
    loaded from a PROM on power-up (usually serially)

Figure 4.5 The Xilinx SRAM configuration cell.
9
EPROM Cell
  • Used in EPLD devices and configuration EPROMS

Figure 4.6 An EPROM transistor. (a) With a high
programming voltage (gt 12V) applied to the drain,
electrons gain enough energy to jump onto the
floating gate. (b) Electrons stuck on gate 1
raise the threshold voltage so that the
transistor is always off for normal operating
conditions. (c) UV light provides enough energy
to the stuck electrons on gate 1 for them to
jump back to the bulk.
10
Using FPGAs
  • Changing demands from large FPGA users can often
    result in supply problems
  • This is less of a problem in MGA or CBIC ASICs as
    this is arranged directly between the customer
    and foundry - although a shortage in ASIC foundry
    capacity is predicted in the future
  • Most FPGAs are intended for direct placement into
    a PCB and are thus surface mount devices
  • Unlike standard PLD devices (e.g. 22V10), FPGA
    signal and power pinouts vary widely among
    vendors
  • Replacing an FPGA with an MGA or CBIC can be
    difficult because of this and may require pin or
    I/O locking

11
Using FPGAs (cont.)
  • Equivalent FPGAs available from different vendors
    or even from a single vendor may run faster than
    expected which can cause a problem for
    asynchronous designs
  • For a given design, there can be a large
    performance difference between different FPGA
    architectures resulting from differences in the
    type and mix of logic
  • Designers should be careful in choosing a given
    FPGA to implement their design
  • Each type of FPGA (e.g. Actel 1020A) is available
    in a variety of configurations for packaging,
    grade (commercial or military), speed, and
    quantity
  • Pricing is calculated using a base device price
    and a series of adjustment factors

12
Actel FPGA Pricing Example
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