Modelbased Engineering : Electromechanical Integration

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Model-based Engineering Electromechanical
Integration
Peter Denno National Institute of Standards and
Technology
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Overview

• Two projects in mechatronics provide pathways to
  demonstrate real-world SoS capability with AP210,
  AP233 and DoDAF
• PDES Inc Mechatronics Project
• NGMTI Mechatronics subproject

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NGMTI Project

• Next Generation Manufacturing Technology
  Initiative
• DoD and OA -sponsored
• 3 Subprojects
• Includes a mechatronics subproject in which we
  might focuson ECAD/MCAD integration
• Participants includes many PDES Inc participants
• Participants attending PDES Inc Off-site

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PDES Inc Mechatronics Project

• Nascent project
• Organizing meeting next week at PDES Inc off-site
• Conceived as a joint AP233 / AP210 project

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Motivation (from Mike Loefflers slides, GM)

• Real world ECS engineers are asking for
  requirements management tools.
• but when we analyze the needs we find they are
  really asking for a way to get their requirements
  to link naturally and easily to the rest of the
  design process, especially the configuration
  management of effectivity, options and variants
• No Systems Engineering tool by itself can do
  this, it must be part of enterprise product
  lifecycle management architecture

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Motivation (from Mike Loefflers slides, GM)

• After requirements are captured and controlled
  they must also be linked and related to the
  models that represent the product to be
  constructed
• The other two legs of the stool are Behavioral
  and Physical definition
• Links (decomposition and allocation) among all
  three of these are the stuff of design decision
  making

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AP210

• ISO 10303-210 Electronic Assembly Interconnect
  and Packaging Design
• Like DoDAF, AP210 is an integration schema
  designed to reveal cross-discipline
  interrelations and enable cross-discipline
  cooperation
• Scope of AP210
• Requirements
• Functions
• Assemblies
• Parts
• Interconnect
• Rules / Engineering Analysis

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AP210 multiple levels of detail - supporting
ECAD/MCAD integration
Interconnect Assembly
Printed Circuit Assemblies (PCAs/PWAs/Modules)
Product Enclosure
Die/Chip
Packaged Part
Die/Chip
Package
Interconnect Substrate (PCBs/PWBs/Cables)
External Interfaces
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The Plan

• Task Produce a tool that allows the user to
  refine requirements from AP233 SE requirements
  definitions
• User extracts electromechanical details from
  product data sheets, SPICE simulations, etc.,
  elaborating on requirement as expressed in AP233.
• User creates reusable library components
• Case Study provided by a DoD Contractor (e.g.
  Rockwell Collins)
• Goal Move to a transaction-based design process
  tool chain
• Map to CADM
• Demonstrate
• A standards-based tool chain spanning several
  engineering disciplines
• Identify gaps in CADM SoS integration ability
• Leverage A family of engineering tool chains
  based-on the 210 model

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Engineering Data Flow Between Activities During
Product Development
System
Mechanical
Electrical
Component/ Material Selection

• Board Profile
• Keepout zone
• Connector
• Shield
• Mounting.
• Max Height

LRU Architecture (Function Allocation to
location Function Allocation to Area)
Schematic (Parts Allocation)
LRU Pin Out (ICD)
Power Assignment
Power/Mass Budget
Thermal Analysis
Area Analysis
Board Design Place Route Document
LRU I/O Data Book
Dynamics Analysis Vib Shock
SI/EMI/EMC/DFx
ility Requirements/ Allocation
Functional Design Verification
DFx
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Data Flow Following Product Development
Mechanical
Manufacturing
Service
Electrical
System

• Board
• Profile
• Keepout zone
• Connector
• Shield
• Mounting.
• Max Height

Future Opportunities Exist
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DFM Data Flow
Component/ Material Information System
ECAD CM
Product ID, Approvals
CIM Global Library
CIM Application
ECAD Aux
Artwork Tooling management
Assembly Process Plan
AP210 Model
Part data
ECAD CADIF
Native CAD Basic geometry
UIUC Rule Engine
LKSoft Converter
AP210 Model
Part Product data
ECAD Requirements
Pass/FailResults
Process data
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Assembly Inputs

• Board Shape (xyz)
• Fiducials (board)
• Mounting holes (board)
• Component Orientation/location/pinout(1..n)(off
  grid location of connectors)
• Tooling holes (board)
• 3D shape/2D shape (custom views)
• Panelization (board)
• Wire/Cables3d as assembled into LRU

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Manufacturability Inputs

• Acceptable board warpage (3D model)
• Positional GDT (mounting/size/connector location
  (off grid)) (board)
• Connector (pin 1..n)
• Material Composition, identificationLead Free
• Keep-out zone (basis - e.g., design . .
  manufacturing requirement), target (e.g.,
  component, trace, holes, shield, cover), skyline
  (board/LRU)
• Max top height / Max bottom height (board)

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Engineering Analysis Inputs

• Mass Properties
• Percent Copper coverage on a layer basis
• Selected copper layer shapes(1..n) (board)
• Component thermal models
• PWB Stackup Definition
• Operational power assignments on a component
  basis
• Material properties (CTE, density)
• Shielding

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Engineering Analysis Inputs

• Underfill / backfill data for thermal
  requirements
• Underfill / backfill data for dynamics
  requirements
• Via characteristics requirements (electrical /
  thermal / filled)
• Bonding requirements (electrical, thermal) (e.g.,
  chassis ground area bare surface finish)
• Mating Conditions
• Electrical Connectivity Definition

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References

• Slides from Tom Thurman - Rockwell
  Collins Lothar Klein - LKSoft Mike Loeffler -
  General MotorsWikipedia - Mechatronics Graphic

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Back-up slides