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LECTURE EIGHT DIGITAL ELECTRONICS

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Title: LECTURE EIGHT DIGITAL ELECTRONICS


1
LECTURE EIGHT DIGITAL ELECTRONICS
Dr Richard ReillyDept. of Electronic
Electrical EngineeringRoom 153, Engineering
Building
2
NMOS Logic Elements
  • MOS technology is the basis for most LSI and all
    VLSI and ULSI digital memory and microprocessor
    circuits
  •  
  • The most important advantage of MOS circuits
    over bipolar circuits for LSI is that more
    transistors and more circuit functions may be
    successfully fabricated on a single chip with MOS
    technology.

3
NMOS Logic Elements
  • There are 3 reasons for this
  •  
  • 1.   An individual MOS transistor occupies less
    chip area
  •  
  • 2.   MOS fabrication process involves fewer
    steps and as a result achieves fewer critical
    defects per unit chip area than in bipolar
    circuit fabrication Þ make feasible somewhat
    larger chips in MOS technology
  •  
  • 3.   Dynamic circuit techniques that require
    fewer transistors to realise a given circuit
    function are practical in MOS technology.
  •  
  • Þ LSI (and thus VLSI) circuits significantly
    cheaper to manufacture than bipolar circuits of
    equivalent function.

4
NMOS Logic Elements
  • What are important issues of MOS Devices for
    Digital Electronics ?
  •  
  •      DC and Transient characteristics are
    important and critical to LSI digital circuit
    design.

5
Alternative MOS processes
  • 1st MOS circuit, made in Metal-Gate p-channel
    (PMOS) technology
  •        Required special supply voltage (-9V, -12
    V)
  •        Functional only at very low digital data
    rates 200k? 1Mb/sec
  •  
  • 2nd MOS circuit, made in Silicon-Gate n-channel
    (NMOS) technology
  •        Required only a single supply voltage
    (5V)
  •        Operates at data rates ? 40Mb/sec

6
Alternative MOS processes
  • A significant reduction in the internal
    dimensions of individual devices results in a
    very sharp improvement in circuit speed.
  •  
  • Bipolar circuit speed improves only gradually as
    internal dimensions are similarly reduced.
  •  
  • An important limitation of MOS circuit is in
    driving high currents and high voltages
  • Standard LSI processes limited to 5 10 V max
    operating voltage
  • Are inefficient when driving more than 20mA into
    a load.

7
Alternative MOS processes
  •  
  • This is the main speed-limiting factor in digital
    systems employing data busses that exhibit high
    capacitance
  • As bipolar digital circuits, particularly ECL,
    can drive highly capacitive loads and terminated
    transmission lines at high speeds
  • ECL normally used when off-chip data rates of
    20Mb/sec and higher
  • E.g. Opto-electronic and High Speed Signal
    Processors

8
Alternative MOS processes
  • Metal-Gate PMOS and NMOS are the original
    versions of the MOS process that are not much
    used in modern designs.
  • The prevalent version of MOS technology is
  • Self-Aligned Silicon Gate NMOS
  • Modern version employ a technique known as local
    oxidation to increase circuit density and
    performance

9
Alternative MOS processes
  • Complementary MOS (CMOS) technologies provide
    both n-channel and p-channel devices in one chip,
    at the expense of some increased fabrication
    complexity and chip area compared to NMOS.
  • The great advantage of CMOS is that they can be
    designed for essentially zero power consumption
    in steady-state condition for both logic states
  • Power is consumed only when circuit switches
    between logic states

10
Two types of CMOS exist
  • 1.   Metal-Gate CMOS
  •        Widely used
  •  
  • 2.   Silicon-Gate CMOS
  •        More complex to manufacture
  •        Offers significantly higher circuit
    density
  •        Better high-speed performance when used
    in VLSI
  • e.g, CMOS memories and microprocessors

11
MOS Modes of Operation
  • The circuit symbol for the n-channel MOS is shown
  •  
  • The threshold voltage in an n-channel MOS device,
    for Drain-Source current to flow
  •              
  • and

12
What is the Threshold voltage and what is it
dependent on ?
  • Dependent on the physical dimensions and
    parameters of the MOS device
  •  
  • ? For the enhancement only NMOS transistor VT is
    positive
  • ? For the enhancement-depletion NMOS
    transistor VT is negative
  •  
  • For PMOS devices, the Threshold Voltage is
    opposite in sign to the corresponding NMOS

13
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14
Cut-off
  • If for an NMOS device
  • Þ device is in cut-off
  • Þ
  • Linear
  • If for an NMOS device
  • Þ for
  •  
  • For Þ NMOS in linear mode
  • Þ
  • where ? is the gain factor or transconductance
    parameter
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