Microelectronics Packaging mEP

1

• Microelectronics Packaging (mEP)
• ASU/Intel Alliance
• mEP Its Interdisciplinary Nature
• Master of Engineering Program
• mEP Coursework
• Prof. Amaneh Tasooji
• Chemical Materials Engineering
• Ira A. Fulton School of Engineering
• Arizona State University

2
The Package is essential

• Bridge Between the Components and the External
  World
• Physical Scale Translator Between the Component
  Features and the Surrounding Environment
• Product Differentiator to Keep Pace with Device
  Requirement in Increased Performance
  (Functionality/Complexity) and Reduced Cost

3
The Package Serves Multiple Functions

• Protection (Environmental Management of Device)
• Connectivity Routing (Electrical, Optical,
  Material)
• Including Power Management Signal Integrity
• Mechanical Stress Control
• Thermal Management
• Testability And Burn-in

4
mEP is Multidisciplinary

• Materials Engineering
• Materials Used (Innovation, Development
  Production Support)
• Materials Interactions (Dissimilar Materials
  Issue)
• Microstructural Evolution Synergistic Property
  Impact
• Environmental Management Issue
• Deformation Failure Mechanisms Modeling
• Electrical Engineering
• Electrical Component
• Power Management/Distribution
• Signal Integrity
• Electrical/Optical/Magnetic Fields Interactions
• Impact on Material Characteristics
• Numerical Analysis

5
mEP is Multidisciplinary

• Mechanical Engineering
• Stress Management
• Thermal Management
• Impact on Electrical And Material Characteristics
• Thermo-mechanical Performance Methodologies
• Numerical Analysis
• Industrial Engineering
• Assembly Process management Automation
• Reliability Issues Accelerated Testing
• Assembly Process Effect on Materials, Mechanical
  Electrical Characteristics

6
Development of ASU/Intel Alliance

• 300 Accredited Engineering Programs in USA,
  Offering Coursework Programs in
  Microelectronics
• Electronic Materials
• Semiconductor Devices
• Integrated Circuit Design
• Processing, Fabrication
• However, Only a Handful Offer Coursework
  Programs in Microelectronics Packaging!

. To Address Educational Gap in Developing
Engineering Resources for Industry
7
Development of ASU/Intel Alliance, cont.

• ASU has Extensive Microelectronics Program
• Courses in Semiconductor Materials, Devices,
  Transport, Design, Characterization, Processing,
  Fabrication, Manufacturing, etc. From Various
  Engineering Disciplines (also with Participation
  from Chemistry, Physics, Mathematics Departments)
  
• Laboratories for Semiconductor Growth,
  Processing, Fabrication, Physical and Chemical
  Characterization, Including a 5000 sq.ft.
  Cleanroom and High Resolution Electron Microscopy
  Center
• ASU Intel Collaborated on Defining and
  Developing a Microelectronics Package Technology
  Curriculum
• Benchmark Against other Universities
• Core Classes Developed and Being Offered in
  Collaboration with Intel Experts in the Field
• Master-of-Engineering Program Established
• Degree can be discipline specific (e.g., CME, EE,
  IE, ME) or interdisciplinary

8
The ASU/Intel Alliance

• An Engineering Center of Excellence with a Focus
  on Microelectronics Packaging Technology
• Education
• Research
• Outreach

9
The ASU/Intel Alliance Education

• Goal Develop a collaborative, multidisciplinary
  program in microelectronics packaging that builds
  upon existing engineering programs at ASU
• Vision Develop ASU/Intel partnership to design
  and deliver a new curriculum which prepares
  students to enter positions in microelectronics
  packaging in addition to further educating
  current engineers.
• Key Participants
• ASU engineering faculty
• Intel Assembly Technology Development (ATD)
  engineers
• ASU Administration and Intel Management
• ASU engineering students and Intel (and other)
  engineers

10
Benefits/Opportunities Driving mEP Program

• For students career opportunities in the form
  of
• internships during training
• research opportunities
• jobs after graduation
• For ASU a unique curriculum to attract students
  worldwide, higher enrollment, recognition
• For Industry Intel a pipeline of students
  prepared for jobs in project management,
  product-to-technology management,
  microelectronics package design, equipment
  engineering

11
Implementation Plan, cont.

• Timeline
• AY 2004-2005
• Development and delivery of Semiconductor
  Packaging and Technology course
• Development of Leveling courses
• Admission of students to M.Eng. program
• AY 2005-2006
• Delivery of Leveling courses
• Development of Advanced courses
• AY 2006-2007
• Delivery of Advanced courses
• Admission of students to Ph.D. program

12

• Microelectronics Packaging
• Mater of Engineering
• Who Can Apply/Attend?
• What Are The Requirements?
• What Are The mEP-Specific Courses?
• How Can a Student Obtain Degree In 2 Years?

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Candidates for Microelectronics Packaging

• B.S. Degree in any of the following
• Electrical Engineering
• Mechanical Engineering
• Materials Science and Chemical Engineering
• Industrial/Operations Engineering
• Physics
• Chemistry
• Expectation is that students have mastered the
  fundamentals of undergraduate physics and
  mathematics.
• Advanced undergraduates could also participate.

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• Question How can a person trained in one
  engineering field take an advanced packaging
  course in another engineering field?
• Answer First, they will have to take a
  598-series leveling course
• EEE 598 Fundamentals of Electrical Eng. for
  non-EEs
• MAE 598 Fund. of Mechanical Eng. for non-MEs
• MAE 589 Fundamentals of Heat Transfer
• MSE 598 Fundamentals of Materials Eng. for
  non-MSEs
• IEE 598 Fundamentals of Industrial Eng. for
  non-IEs
• Expectation is that student is then able to take
  5xx courses in field after taking leveling
  course.

15

• Master of Engineering In Microelectronics
  Packaging
• (Requirements)

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M.Eng. Program in Microelectronics Packaging

• The Master of Engineering (M.Eng.) requirement at
  ASU
• Thirty credit hours
• 3 CH in Advanced Engineering Mathematics
• 3 CH in Engineering Management/Business
• 18-24 CH in Requirements and Electives
• 6-0 CH in Practice-oriented project
• Discipline specific (EE, BME, etc.) or
  multidisciplinary
• Practice orientation - Project optional (up to 6
  hours)
• One half of all coursework, excluding the
  practice-oriented project, must be in
  engineering. A culminating capstone event is
  required and will be identified by the students
  advisory committee. It could be a final
  examination or the final report for a
  practice-oriented project

CH Credit Hours Can replace up to 6 units
of electives with applied project
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M.Eng. In Microelectronics Packaging

• Program Requirements
• Students must complete a total of 30 credit hours
  to earn the Master of Engineering Degree.
• Students are required to complete MSE 598
  Introduction to Microelectronics Packaging
  (3-credits)
• Students must complete a minimum of three
  advanced packaging courses (9-credits)
• Students can select electives across the
  disciplines. At least one course in two of the
  four disciplines. At least two courses in one of
  the four disciplines (12-6 credits)
• Students can elect to complete an applied project
  and receive up to six credit hours. The applied
  project can substitute for 3 to 6 credit hours
  upon approval by the advisor (0-6 credits)
• The Master of Engineering program requires a math
  and a business course (6-credits)
• Students can pursue coursework from University of
  Arizona or Northern Arizona University through
  the Master of Engineering Partnership (upon
  advisor approval)

Can replace up to 6 units of electives with
applied project
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Coursework

• Introductory course
• MSE 598 - Introduction to Microelectronics
  Packaging
• Required for all
• Leveling courses
• EEE 598, IEE598, MAE598, MAE589, MSE598
• Students enrolling in advanced courses outside of
  their bachelor's major might be required to
  complete a prerequisite leveling course. The
  leveling courses can be used as an elective
  within the final program of study if approved by
  the program advisor
• Advanced Courses
• EEE698, IEE698, MAE602, MAE698, MSE698
• 3 Advanced courses required for all

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Review of Courses for the M.Eng. Program

Introductory Course
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MSE598 MSE494Introduction to Microelectronics
Packaging

• Dr. Amaneh Tasooji
• Arizona State University
• In Collaboration with
• Intel Assembly Technology Development

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Status of MSE 598 (Intro. To mEP)

• Course was developed and Offered in collaboration
  with Industry (Intel) Experts
• Course has been offered twice
• Fall 2004 semester 33 on-campus, 7 off-campus
  (40 Students Total)
• Fall 2005 semester 19 on-campus, 10 off-campus
  (29 Students Total)
• Course will be offered every Fall semester, or
  more frequently with sufficient demand

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Introductory Course Syllabus
Introduction to Micro-electronic Packaging
MSE598C MSE494 (Fall 2005, MW 440-555pm,
Room BA359) This course is prepared in
collaboration with industry and with generous
technical and financial support from Intel
Corporation. A team of Intel and Arizona State
University (ASU) scientists/engineers deliver
this course.
ASU Instructor/Integrator Amaneh Tasooji
(amaneh.tasooji_at_asu.edu) Co-instructors from
Intel Radhakrishnan, Prasher, Subramanian,
Arana, Matayabas, Tandon, Lucero, Sahasrabudhe,
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Introductory Course, Goals Objectives
Introduction to micro-electronic packaging will
be presented in a 3 unit course. This course
(MSE598C) is instructed by a joint team of ASU
and Intel scientists/engineers. This
Fundamentals course is a foundation class for
more advanced semiconductor packaging courses to
be offered by other engineering departments
(Electrical, Chemical Materials, and
Mechanical) in the future The objective of this
course is (i) to gain knowledge in electronic
packaging and interconnections, with an emphasis
on highly integrated MOS logic chips (ii) to
share basics of the fast-pacing integrated
circuit (IC) devices and (iii) to apply the
integrated/multidisciplinary knowledge and
problem-solving methods in addressing electrical,
thermal, materials, chemical, manufacturing, and
reliability problems in packaging - in our quest
to develop integrated solutions to real-life
opportunities challenges.
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Subjects/Modules Covered in MSE598/MSE494

• Current Status and Future Trends in Packaging and
  Interconnect Technology
• Electrical Effects In Electronic Packaging
• Thermal Design Analysis
• Mechanical Design Analysis
• Materials In Electronic Packaging
• Reliability Testing
• Manufacturing Automation

25
Intro. Course Agenda Course Topics

• Evolution and Challenges in Electronic/Semiconduct
  or Industry
• History of Electronic Devices Enclosure
• Semiconductor Devices
• IC Trends and the Updates in Packaging and
  Interconnect Technology
• Considerations in Package Selection (Area Array,
  CSP, SCP, MCM, etc.)
• Electrical Effects in Electronic Packaging
• Electrical functions of the Package
• Signal Power Distributions
• Signal Integrity
• Modeling Simulation methodology
• System Considerations/Bus Design
• Industry Trends

26
Intro. Course Agenda Course Topics

• Thermal Design Analysis
• Introduction to Thermal Management (What, Why,
  techniques, Roadmap)
• Fundamental of Thermal Management
• Modeling Heat Diffusion
• Thermal Analysis, Transient and Steady-state
  Modeling, Design
• Non-Uniform Device Heating (FEA Modeling)
• Electronic Cooling Methods (Active vs. Passive)
• Characterization Measurements (Thermal
  metrology techniques)
• Mechanical Design Analysis
• Thermal Stress in Electronic Packages
• Fundamentals of Mechanics Materials Behavior in
  Packaging
• Thermo-Mechanical Modeling
• Examples of Finite Element Method (FEM) Analysis
  of Package

27
Intro. Course Agenda Course Topics

• Overview of Packaging Materials
• Polymer Materials (and Processing) used in
  Packaging
• Packaging Materials Characterization
• Thermal Interface Materials
• Substrate Design, Materials, and Processing
• Solder Materials, Processing, and Reliability
• Advanced technology (MEMS, Optical Materials,
  Nano-materials)
• Testing, Characterization, and Failure Analysis

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Intro. Course Agenda Course Topics

• Manufacturing Techniques and Testing
• Manufacturing/Assembly Processes (Cleaning, Wire
  Bonding, Passivation, Coating, Cavity Filling,
  Inspection and Testing)
• Manufacturing Process Control
• Manufacturing, Supply Chain, and Design for Cost
• Quality and Reliability
• Quality Control Design for Quality
• Reliability Statistics
• Reliability Testing

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Intro. Course Text Other Reading

• Rao R. Tummala, Fundamentals of Microsystems
  Packaging, 2001, McGraw-Hill
• Other References (Examples)
• The National Technology Roadmap for
  Semiconductors, San Jose California
  Semiconductor Industry Association, 1997
• http//www.mdronline.com/mpr/index.html
• John Lau, C.P. Wong, John L. Prince, Wataru
  Nakayama, Electronic Pachaging Design,
  Materials, Process, and Reliability, 1998.
• Ravi Mahajan, Raj Nair, Vijay Wakharkar, Johanna
  Swan, John Tang, Gilroy Vandentop, Intel
  Technology Journal, Vol. 6, Issue 2 (2002), pp.
  62-75.
• Chee Choong Kooi, et al., Electronics Packaging
  Technology, 2003 5th Conference (EPTC 2003) 10-12
  Dec. 2003, Pages324330.
• Chia-Pin Chiu, et. al., Advanced Packaging
  Materials Processes, Properties and Interfaces,
  2000. Proceedings. International Symposium on
  , 6-8 March 2000. Pages265 270.
• Ram Viswanath, Vijay Wakharkar, Abhay Watwe,
  Vassou Lebonheur, Intel Technology Journal, Q3
  2000, pp. 1-16.
• C. M. Garner, et. al, Electronics Packaging
  Technology Conference, 2000. (EPTC 2000).
  Proceedings of 3rd , 5-7 Dec 2000, Pages6 9.

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Intro. Course course Project

• Group Project Groups of 3-4 (Interdisciplinary
  Members),
• Select and submit your group Project Title by the
  3rd Wednesday of the course
• Example of projects
• Materials Challenges and/or Innovation in
  Electronic industry
• Failures Case Study e.g., Solder-joint failure
  modes
• Nano-technology needs for future semiconductor
  devices
• Packaging challenges for bio-medical applications
• Innovation in ceramics and/or Polymeric materials
  used in Electronic Industry
• MEMS device package requirements
• Technical And Business Challenges For Direct Si
  Chip Attach to PCB
• Advantages and disadvantages of system-in-Package
  technology
• etc.

31
Review of Courses for the M.Eng. Program

• Leveling Courses

32
Leveling courses Subjects for Non-major Students

• Courses developed with funding from Intel Higher
  Education (Proposed Semester for Offering)
• EEE 598 - Electrical Engineering (3 units)
• Prof. Aberle (F S)
• IEE 598 - Industrial Engineering (3 units)
• Prof. Runger (F S)
• MAE 598 - Mechanical Engineering (3 units)
• Prof. Chen (F)
• MAE 589 - Heat Transfer (3 units)
• Prof. Phelan (F)
• MSE 598 - Materials Engineering (3 units)
• Prof. Chawla (F)

33
Review of Courses for the M.Eng. Program

• Advanced Courses

34
Advanced Courses 3 Courses Required for Degree

• EEE 698 Advanced Packaging Analysis and Design
  Electrical Considerations
• Prof. Aberle (F)
• IEE 698 Advanced Analysis Methods
• Prof. Runger (F)
• MAE 602 Advanced Packaging Analysis and Design
  Mechanical Considerations
• Prof. Peralta (F)
• MAE 698 Advanced Packaging Analysis and Design
  Thermal Considerations
• Prof. Phelan (S)
• MSE 698 Advanced Packaging Analysis and Design
  Material Considerations
• Prof. Tasooji (S)

35
M.Eng. In mEP Elective Courses

• Students can select electives across the
  disciplines. At least one course in two of the
  four disciplines and at least two courses in one
  of the four disciplines (9-12 units)
• Electrical Engineering (Example)
• EEE440 Electromagnetic Engineering II
• EEE436 Fundamentals of Solid State Devices
• EEE530 Advanced Silicon Processing
• EEE531 Semiconductor Device Theory I
• EEE532 Semiconductor Device Theory II
• EEE541 Electromagnetic Fields and Guided Wave
• EEE598 Microelectromechanical Systems (MEMS)
• EEE641 Advanced Electromagnetic Field Theory
• EEE643 Advanced Topics in Electromagnetic
  Radiation

36
M.Eng. In mEP Examples of Elective Courses

• Mechanical Engineering
• MAE520 Solid Mechanics
• MAE527 Finite Element Methods in Engineering
  Science
• MAE544 Mechanical Design and Failure Prevention
• MAE557 Mechanics of Composite Materials
• Industrial Engineering
• IEE500 Research Methods Engineering Statistics
• IEE569 Advanced Statistics Methods
• IEE572 Design of Engineering Experiments
• IEE573 Reliability Engineering
• IEE582 Response Surfaces and Process
  Optimization

37
M.Eng. In mEP Examples of Elective Courses

• Materials Engineering
• MSE512 Analysis of Material Failures (S-E)
• MSE513 Polymers and Composites (F)
• MSE517 Introduction to Ceramics (F)
• MSE540 Fracture, Fatigue, and Creep (S-O)
• MSE516 Mechanical Properties of Solids (F)
• MSE550 Advanced Materials Characterization (F)
• MSE570 Polymer Structure and Properties (S-E)
• MSE571 Ceramics (S-S)
• MSE598 Electronic Thin Films (O-Y)
• Chemical Engineering
• CHE 458 Semiconductor Material Processing
• CHE 558 Electronic Materials (S-S)
• Other
• CSE598 Modeling and Simulation

S-E Spring-Even , S-O Spring-Odd , S-S
Selected Semester , O-Y Once a Year
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Example Program of Study (EE student)

• Student Intent Obtain a M. Eng. In mEP from
  Materials Engineering
• Core Course
• MSE 598 Introduction to Microelectronics
  Packaging (Tasooji)
• Leveling Courses
• MSE 598 - Overview of Materials Engineering
  (Chawla)
• MSE 598 - Designed Experiments, Statistical
  Process Control, and Statistical Reasoning
  (Runger)
• Packaging Courses
• EEE 691 - Advanced Packaging Analysis Design
  Electrical Considerations (Aberle)
• MSE 691 - Advanced Packaging Analysis Design
  Materials Engineering Considerations (Tasooji)
• IEE 691 - Advanced Analysis (Runger)
• Elective Courses
• EEE 541 - Electromagnetic Fields and Guided Waves
• EEE 598 - Project in Electrical and Materials
  Engineering
• MSE 517 - Introduction to Ceramics
• MSE 570 - Polymer Structure and Properties

39
Example MSE Student Pursuing M.Eng. In mEP
40
Example MSE Student Pursuing M.Eng. In mEP
F Fall, S Spring, FS Fall Spring, FE
Fall-Even, SE Spring-Even, SO Spring-Odd,
SS Selected Semester, OY Once a Year
41
Example 2-Year Program (Coursework Timeline)

• MSE Student Interested in Obtaining a Degree from
  ME with an emphasis in mEP Mechanical Analysis
  and Design
• First Year Fall
• MSE589 (Intro. To mEP)
• MAE598 (Mechanical Engineering Leveling Course)
• MAT423 (Numerical Analysis)
• MAE527 (Finite Element Methods in Engineering )
• First year Spring
• IEE598 (Industrial Engineering Leveling Course)
• MSE698 (Advance Materials for mEP)
• Second Year Fall
• MAE602 (Advance Mechanical Analysis Design for
  mEP)
• IEE698 (Advanced IE Analysis Methods for mEP)
• MAE544 (Mechanical Design and Failure Prevention)
• Second Year Spring
• MAE598 Project
• MSE540 (Fracture, Fatigue, and Creep )
• SCM463 (Supply Chain Management)

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Thank You !
For Attending This session