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Architecture

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Smart Dust and TinyOS: Hardware and Software for Network Sensors - the software part Author: David E. Culler Last modified by: David E. Culler Created Date: – PowerPoint PPT presentation

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Title: Architecture


1
Architecture
  • David Culler
  • University of California, Berkeley
  • Intel Research Berkeley

http//webs.cs.berkeley.edu
2
Design Lineage
  • COTS dust prototypes (Kris Pister et al.)
  • weC Mote (30 produced)
  • Rene Mote (850 produced)
  • Dot (1000 produce)
  • Mica node (current, 1800 produced)
  • Time warp accelerator for MICA
  • Silicon prototype

?
3
Node Communication Architecture
Classic Protocol Processor
Direct Device Control
Hybrid Accelerator
4
Novel Protocol Examples
  • Low-power Listening
  • Really Tight Application-level Time
    Synchronization
  • Localization
  • Wake-up
  • MACs
  • Self-organization

5
Low-Power Listening
  • Costs about as much to listen as to xmit, even
    when nothing is received
  • Must turn radio off when there is nothing to
    hear.
  • Time-slotting and rendezvous cost BW and Latency
  • Can turn radio on/of in lt1 bit
  • Small sub-msg recv sampling
  • Trade small, infrequent tx cost for freq. Rx
    savings

6
Exposing Time Synchronization Up
  • Many applications require correlated data
    sampling
  • Distributed time sync accuracy bounded by ½ the
    variance in RTT.
  • Successful radio transmission requires sub-bit
    synchronization
  • Provide accurate timestamping with msg delivery
  • Jitter lt 0.1us (propagation) 0.25 us (edge
    capture accuracy) 0.625 us (clock synch)

7
Localization
  • Many applications need to derive physical
    placement from observations
  • Spatial sampling, proximity, context-awareness
  • Radio is another sensor
  • Sample baseband to estimate distance
  • Need a lot of statistical data
  • Calibration and multiple-observations are key
  • Acoustic time-of-flight alternative
  • Requires good time synchronization

8
New Architectures?
Embedded Network Arch.
Typical Wireless Arch. (cellphone)
audio
kbd / display
Sensor / Actuators
Codec
Application Controller
CoProc
Multi-Purpose Controller
DSP
protocol accelerators
Protocol Processor
RF Transceiver
RF Transceiver
  • Traditional approach is to partition design into
    specialized subsystems with rigid interfaces.
  • TinyOS allows low and high-level processing to be
    interleaved.
  • rich physical information can be exposed
  • specialized hardware to accelerate primitives
  • Enables cross-layer optimizations

9
First Silicon Goals
  • Continue trend of building and evaluating
  • Goal is to build something to get momentum
  • Learn economics of silicon
  • RF Accelerator designed as mica add-on
  • Increase RF transmission speed and reliability
    while decreasing CPU involvement

10
Capabilities
  • RF Communication Support
  • Start Symbol Detection
  • Signal clock extraction and continual
    resynchronization
  • Transmission and reception buffering to relax CPU
    real-time constraints
  • Energy Consumption
  • 1 Mbps (gt 100 uA)
  • Mote Requires approximately 3mA of CPU.

11
Mote Chip Goals
  • Replicate and extend the functionality of the
    MICA
  • Decrease size of node to cubic millimeters
  • Reduce cost to lt1
  • Include AVR-like Core, ADC, RF Communication
    Support, UART, SPI, RAM, Radio, Timing modules
  • Target shortcoming of COTS capabilities

12
Silicon TinyOS Support
13
Communication Interface
  • Hardware provides AM interface
  • Same functionality originally implemented in
    hardware
  • Hardware handles
  • Message send command with TOSMsgPtr
  • Hardware signals
  • Message arrival event with TOSMsgPtr
  • CPU communication overhead dropped from approx.
    2MIPS down to 0.

14
Mode Chip experimental setup
  • Xilinx XCV2000E
  • 2.5 million gates 10x the size of an AVR core
  • Also has
  • Ethernet
  • A/V Encoder
  • Compact Flash
  • Internal and External RAM

15
First Prototype
2mm
  • IO Pads
  • RAM blocks
  • MMU logic
  • Debug logic
  • ADC
  • CPU Core
  • RF Place Holder

Core Area only 50 full
16
Chip Area Breakdown
  • 3K RAM 1.5 mm2
  • CPU Core 1mm2
  • RF COMM stack .5mm2
  • RADIO .25 mm2
  • ADC 1/64 mm2
  • I/O PADS

17
Core Area Breakdown
18
External Components Required
  • Current Prototype
  • 2 External clock generators
  • 1 External radio
  • Power source
  • End Goal
  • 1 External Inductor (RF oscillation)
  • 1 External Crystal (time keeping)
  • Power source

19
Example monitoring and alarm
  • Monitoring
  • sample every 4 seconds, aggregate over 5 minutes,
    transmit statistical summary
  • 20,000 samples, 300 reports per day per node
  • aggregate statistics up the routing tree
  • schedule rendezvous, so radio mostly off
  • Alarm
  • upon detection of dramatic environmental change
  • routes alarm through parent at any time
  • Where the energy goes
  • sleeping
  • sensing processing
  • communication
  • listening for communication to start
  • listening for an alarm message

20
Cross-Layer optimization
  • Sensing Processing
  • 15 mw 17 mJ per day
  • Sleeping
  • 45 uw 5038 mJ per day
  • Communination
  • hardware accelerators for edge capture and
    serialization
  • 10 kbps gt 50 kbps 2262 gt 452 mJ/day 5x
  • Rendezvous 2x time-synchronization
  • time-stamp packets - 100 ms
  • radio bit edge detection - 2 us
  • radio-level timesynch 669 gt 33 mj/day 20x
  • Wake-up
  • packet listen 108 ms (21 ms) 54,000 gt 25
    mj/day 2000x
  • sample radio channel for energy 50 us
  • Combined 2AA lifetime grows from 1 year to 9
    years
  • dominated by sleep energy

receiver-based alternative (Elison)
21
What integration buys...
  • 3K RAM 1.5 mm2
  • CPU Core 1mm2
  • RF COMM stack .5mm2
  • RADIO .25 mm2
  • ADC 1/64 mm2
  • I/O PADS
  • Expected sleep 1 uW
  • 400 years on AA
  • 4 Mhz lt 1 mW
  • Radio
  • .5mm2, -90dBm receive sensitivity
  • 1 mW power at 100Kbps
  • ADC
  • 20 pJ/sample
  • 10 Ksamps/second .2 uW.

RAM
mmu
ADC
Proc
Radio (tbd)
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