News about epitaxial silicon sensor

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Attivita sul microvertice a Torino
Daniela Calvo
Commissione scientifica 3, Genova 21 settembre
2009
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Micro-Vertex-Detector requirements

• Good spatial resolution in r-phi
• Momentum measurement of
• pions from D decays
• Good spatial resolution specially in z
• Vertexing, D-tagging
• Good time resolution
• rms 6 ns (at 50 MHz clock)
• with 2107 ann/s
• Triggerless readout
• Energy loss measurement
• dE/dx for PID
• Low material budget
• low momentum of particles
• (from some hundreds of MeV/c)

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MVD layout
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Status of the activities for the pixel detector
in Torino Assembly layout Electronics and
cables Mechanics and cooling
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Standard hybrid technology
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Assembly layout
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2-chip module
Assembly scheme
Controller chip
Power cable
Data cable
0805 bias filter capacitor
0603 supply filter capacitors
Sensor
ToPiX readout chips
Multilayer bus structure
By R. wheadon
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Layout of forward disks
By R. wheadon
Possibility of daisy-chaining controllers to save
on cables (where data rates allow)
Controller chips serve two or three ToPiX readout
chips
For outer layer of barrel would need to
daisy-chain two 6-chip modules (power and
controller chips) to keep cables out of active
region
Keeping cables out of active region means that
some modules may require two designs according to
which end the cables have to be connected
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Electronics and cables
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Upgrade of ToPix

• Technology LM -gt DM (the HEP mainstream)
• LM 6 (thin) 2 (thick) metal layers
• DM 3 (thin) 2 (thick) 3 (RF) metal layer
• RF layer shows lower resistivity and helps power
  routing
• RF layer gives more precise capacitance
• shared bus among adjacent columns

100 mm
25 mm
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Upgrade of ToPix

• Clock from 50 MHz to 160 MHz
• time stamp bin 6ns
• new columns and receivers to be redesigned
• new simulations
• SEU protection DICE cells -gt triple redundance?
• twice size increase in the digital part of the
  chip -gt rescaling of the analog part

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Upgrade of the analog part of ToPix - I
Adaptation for the clock _at_ 160MHz
In order to keep the same clock_cylces to
injected_charge ratio as ToPix2 (clock_at_50MHz),
the discharging current value has to be
proportionally increased from 5 nA to 16 nA.
Simulation result of analog output signal with
the 2 different clock values
Qin Clock frequency ToT Clock cycles Clk_cy/Qin
30 fC 50 MHz 6.094 ns 304 10.1
30 fC 160 MHz 2.000 ns 320 10.7
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Upgrade of the analog part of ToPix - II
Compact leakage compensation stage Layout
compatible with the DM process
Baseline variation of 0.6mV when the leakage
current increases from 10nA to 100nA. (2mV)
ToT variation due to the leakage
current Simulation Qin 80fC dToT/dIleak-1.53ns
/nA
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Results from radiation damage test of epi-diodes
the radiation damage constant

Equivalent fluence values on the diodes
5.13x1013, 1.54x1014, 5.13x1014n(1MeVeq)/cm2
corresponding to 1, 3 and 10 years of PANDA
lifetime
The radiation damage constant is a DJ/F
7.6(?0.3)x10-17 A/cm for all diodes.
Lekage current lt 50 nA/pixel (100 mmx100mm size,
100 mm thick)
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RD electronics and connections
Development in progress with prototypes
Study of the architecture in progress ( test of
high frequency cable)
Readout chip Detector
Module controller
to counting room/daq
cable
Optical transceiver
PCB -BUS
Development in progress in other collaboration
First prototypes
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Preliminary bus scheme
By R. Wheadon
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Cable prototype testing board layout
1 m differential cable
Al
Al
Kapton (SU8)
pads
connectors
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Cable prototype preliminary simulation
By Paolo De Remigis
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Updates from pixel cooling
Responsible S. Coli INFN - Torino
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Results from test

• New prototype done
• 12 resistors on 4 rows, 2 rows x side
• disk body by POCO-HTC foam
• 2 tubes embedded (øe2mm, øi1.84mm)

COOLING TEST RESULTS IR IMAGES
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Results from simulations
FEM RESULTS
INPUT DATA
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Cooling system for disks
Disk split in two halves along the
mid-plane Material for heat dissipation foam
POCO-HTC Embedded cooling capillary between the
two halves All elements grued with thermal
glue Problem large glueing area -gt test have to
be performed
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Results with different material for cooling
POCO FOAM Density 0.55 g/cm3
POCO HTC Density 09 g/cm3
Pyrolytic Graphite Density 2.2 g/cm3
Max. Reached Temperature Poco Foam 23C POCO
HTC 21.7C PG 23.3 C
Total power 90 W Coolant Temperature 20C
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Cooling pipe scheme
1 tube Ø6 2tubes Ø8
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Updates from MVD Mechanics
Responsible G. Giraudo INFN - Torino
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MVD layout
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Fittings for cooling pipes
Ancillary parts as special fittings and curves
can be common parts made from Ryton R-7-220 by
injection mould
7 mm diameter 16 mm length 3 bar maximum pressure
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Mechanics details
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Primary target
Responsible F. Iazzi Politecnico and INFN -
Torino
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Primary target

• The target will be built through the following
  steps
• Step 1
• The target production starts from a disk shaped
  basis of Cu, (sizes14mm diameter and 0.5 mm
  thickness), on which a carbon layer 20 mm thick
  will be deposited
• Remarks
• the density of the layer is not the graphite
  density, but close to that it will be measured
  (we will use the back-scattering technique)
• the thickness of the layer can be chosen without
  major constraints in the range 10-40 mm and will
  be measured by optical techniques with good
  precision (better than 5), after the deposition
• Step 2
• After the deposition the carbon layer will be
  masked along the wires and the rest of the carbon
  will be wet-etched and taken away. The result
  will be a Cu disk having 3 wires of about 14 mm x
  20 x 20 mm2 glued on.
• The distances between the 3 wires could be 3.5 mm
  in order to avoid the beam spot overlapping on 2
  wires
• Step 3 (see fig. 2, where the ring is in
  violet, wires in black/white)
• The Cu disk will be wet etched and taken away
  unless a ring (external diameter 14 mm, internal
  12 mm), which will be previously masked. The
  result will be a ring with 3 C wires like a
  guitar.
• Step 4
• The Cu ring with wires will be inserted inside a
  Al local frame, whose aim will be to manage the
  plugging of the target into the beam pipe

side view
frontal view
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Next step and conclusions
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Richieste capitolo Missioni Interne
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Richieste capitolo Missioni Estere

• MISSIONI ESTERE
• Partecipazione ai 4 meetings di collaborazione
  con cariche ufficiali 4 pp al Coordination
  Board (Calvo, Filippi, Marcello, Iazzi) e 1 pp
  al Technical Board (Calvo) (i meeting generali
  sono programmati a 5 gg). 5ggviaggio x 4
  meetings x 5pp 25 keuro
• Partecipazione ai meetings del microvertice e
  della meccanica dellesperimento con presenza
  del coordinatore meccanica mvd (G. Giraudo) e
  responsabile cooling ( S. Coli) e partecipanti al
  FEE tag (D. Calvo e A. Rivetti). 3gg viaggio x 7
  meeting x 3 pp 13 keuro
• settimana di lavoro a Julich per microelettronico
  con sviluppo logica di controllo in
  collaborazione. 5ggviaggio x 1 p 1.5 Keuro
• lavoro di integrazione della meccanica e del
  cooling dei pixel e delle strips intorno alla
  beam pipe e targhetta, con il routing (1 sett. a
  Julich, 1 sett.a Bonn, 1 sett.al GSI).
  5ggviaggio x 2 pp x 3 incontri 5 Keuro
• contatti scientifici del responsabile locale mvd
  con il responsabile mvd a Bonn, per scrittura
  TDR. 4 ggviaggio x5 contatti x 1p 3 Keuro
• 2 Physics meetings ( Iazzi e partecipante).
  2ggviaggio x 2 contatti x 1 p1.5 keuromeetings
  di aggiornamento software di una settimana per 2
  persone presso GSI. 5
• ggviaggio x 1 corso x 2 pp 3 keuro
• dottorando al GSI per lavoro sulle simulazioni,
  circa 10 giorni 1.5 keuro
• contatto con Fraunofher Institute per bump
  bonding dei sensori. 2ggviaggio x 1p 1.5 keuro
• contatti scientifici con gruppi europei (fisica e
  tecnologia). 3 ggviaggio x 3 contatti x 2 pp 3
  keuro
• 1 settimana di progettazione meccanica della
  regione ipernucleare- beam pipe a Julich. 5
  ggviaggio x1 pp 1 Keuro
• Meeting per sviluppo targhetta e beam pipe per
  la parte ipenucleare. 2ggviaggio x 2 contatti x
  1 p1.5 keuro
• partecipazione a due congressi internazionali per
  presentare i risultati del mvd 5 ggviaggio x 1p
  x 2 congressi 3.5 keuro
• test TID con X al CERN per ToPix3 ( sj alla disp.
  sorgente e chip). 7ggviaggio x 1 misura x 2 pp
  2 keuro
• test con protoni (circa 23 GeV) per studiare i
  sensori epi (sj allass.fascio) con spessore fino
  a 100 micron. 7ggviaggio x 1 misura x 4pp,
  compresa installazione 4 keuro
• test a Bonn (elsa) di radiation lenght di carbon
  foam ( sj. ass fascio) 5ggviaggio x 1 misura x
  2 pp 2.5 keuro
• Totale M.E. 62.5 kEuro 8.5 kEuro
  sj

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Richieste capitolo CONSUMO
sj
sj
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Richieste capitolo INVENTARIO
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f.t.e. nel 2010 a Torino

• Calvo Daniela 80
• Busso Luigi 30
• De Mori Francesca 20
• Filippi Alessandra 30
• Marcello Simonetta70
• Kugathasan Thanushan 100
• Szymanska Katarzyna 100
• Iazzi Felice 100
• De Remigis Paolo (elettronica) 60
• Mazza Giovanni (microelettronica)30
• Rivetti Angelo (microelettronica)20
• Wheadon Richard (sensori/elettronica)20
• Coli Silvia (meccanica/tecnologia)70
• Giraudo Giuseppe (meccanica/tecnologia)70
• 8fte
• E personale tecnico INFN-Torino
• Laboratorio di Elettronica e Laboratorio
  tecnologico/Officina meccanica