Xray summary of 1 module and 6 SC:

1
X-ray summary of 1 module and 6 SC Assy are
identified by their sensor PDB number,
electronics all coming from wafer SXB0LT. Assy
always observed through the FEI (i.e. FEI on top
of the assy) 20210120310702 (module, see
drawing for FEI numbers) 20210110142304 0608B
(9 columns) 20210110142305 0712B (9 columns)
20210110142306 0711B (9 columns)
20210110142307 0708B (9 columns)
20210110142308 0707B (9 columns)
20210110142309 0706B (9 columns) Summary
bumping/flipping good and uniform, minor defects
spotted. Chip cutting still quite bad.
P. Netchaeva, L.Rossi, F. Vernocchi 8/5/02
2
If not specified 9 good columns
0606A
0506A
0106A
0105A
0712A
0711A
0911A
0708A
HV pad
0707A
0706A
1104A
1003A
0902A
0612B 8 columns
0411B 8 columns
0702B 8 columns
We look through the backside of the FEI
3
Some shorts possible
5 missing Bumps (FEI Chipped)
X-ray view
Maybe few shorts
4
Microscope view of FEI cutting edges, quite some
chipping and unequal cutting sizes.
In on sensor?
5
20210110142304 0608B
6
20210110142305 0712B
7
20210110142306 0711B
8
20210110142307 0708B
9
20210110142308 0707B
10
20210110142309 0706B