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RF in

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DC applied between actuation pad and the beam (acting as DC ground) DC voltage is isolated from the RF path by ... Also prevent stiction and metal-metal contact ... – PowerPoint PPT presentation

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Title: RF in


1
DC GND
RF GND
DC V
RF in
RF GND
DC GND
DC GND
RF GND
RF out
DC V
RF GND
DC GND
2
DC applied between actuation pad and the beam
(acting as DC ground)
DC voltage is isolated from the RF path by using
separate DC actuation pads
Top beam is pulled down by applied DC voltage
3
2
RF in
1
2
RF out
When DC voltage is present at the actuation pads
the beam is pulled down and short the RF path to
grounds (Switch is off)
When no DC applied RF signal passes through RF
path (Switch is on)
1
2
4
Part of the beam for DC actuation
Part to short or open the RF signal by forming a
small or high capacitance
Holes used to decrease the damping ratio,
decrease residual stress of the top beam and to
ease sacrificial release
Dielectric layer to form capacitance. Also
prevent stiction and metal-metal contact
5
Metal 2 layer used for RF and DC actuation paths
Dielectric layer used for MIM capacitor is used
for isolation of the signal paths
Metal 3 layer used for top beam
Metal 2 3 vias used to form anchors
6
60µm
  • Mask1
  • Metal 2 layer
  • RF path and DC actuation electrodes

60µm
40µm
20µm
150µm
105µm
20µm
25µm
100µm
500µm
25µm
20µm
7
  • Mask1
  • Metal 2 layer
  • RF path and DC actuation electrodes
  • Mask2
  • MIM capacitor dielectric layer
  • Insulation of bottom electrodes from top layer

8
  • Mask1
  • Metal 2 layer
  • RF path and DC actuation electrodes

65 µm
65 µm
  • Mask2
  • MIM capacitor dielectric layer
  • Insulation of bottom electrodes from top layer

65 µm
65 µm
  • Mask3
  • Metal 2 Metal 3 via layer
  • Form anchors that carry the top beam

65 µm
65 µm
65 µm
65 µm
9
  • Mask1
  • Metal 2 layer
  • RF path and DC actuation electrodes

6 µm
150 µm
65 µm
  • Mask2
  • MIM capacitor dielectric layer
  • Insulation of bottom electrodes from top layer

6 µm
5 µm
15 µm
65 µm
105 µm
5 µm
50 µm
57 µm
  • Mask3
  • Metal 2 Metal 3 via layer
  • Form anchors that carry the top beam

25 µm
150 µm
105 µm
  • Mask4
  • Metal 3 layer
  • Form top beam
  • Holes to decrease damping and residual stress
  • Hole sizes 5x5µm
  • Separations between holes 6 µm

150 µm
15 µm
15 µm
105 µm
50 µm
50 µm
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