Title: Workpackage 3: Thermal System
1Workpackage 3 Thermal System
Project Meeting, May 11, 2006
NMW
P. Müller, A. Bolleter, M. Roos, A. Bernard
2Outline
? Overview Work Package and Concept ? Thermal
Demonstrator and measured Temperature
Distribution ? Comparison with Simulation ?
Modified Concept ? New Power Ranges ? Next
Steps and Summary
3Overview Workpackage 3
Thermal System
concept, fabrication measurement
concept, simulation
Air
Heat exchanger
Fuel
Post combustion
Reformer
Cathode Electrolyte Anode
design, simulation, measurement
design, fabrication
design, fabrication
4WP 3 Year 1 Milestones
- performance 200 mW/cm2 _at_ 550C
- external electrical connections
Fuel Cell
- butane conversion rate gt 90
- post-combustor with gas oxidation gt 98
Gas Processing
- thermal insulation concept with
- Tinside 550C, Toutside 50C, lt10 cm3
- structures for validation critical points
- thermal system demonstrator with
- simulated 2 W heat source
Thermal System
Project Management
- battery expert
- industrial partner
5Main Achievements
Simulation validated with Thermal Demonstrator.
6Overview Concept and Simulation
Stack Radius mm
Stack temperature C
Thickness of Stack mm
Thickness heat exchanger (Mica) mm
Distribution
Heat Flow
7Demonstrator with Resistance Heat Source
8Measured Temperature distribution
Insulation thickness Microtherm 6 mm Constant
Heating Power 2 W
350C
40C
? 7 min for constant temperature ? Stack
temperature 350 C and 40C in surrounding area
9Temperatures with different Insulations
Constant Heating Power 2 W
C
- Thicker insulation does not change the stack
temperature - With transparent Aerogel lower stack temperature
10 Simulation of Demonstrator Temperature
Distribution 1
Microtherm thickness 6 mm with radiation and
MICA 0.5 W/mK
Microtherm thickness 6 mm no radiation and MICA
0.5 W/mK
750 C
395 C
40C
40C
11 Simulation of Demonstrator Temperature
Distribution 2
Microtherm thickness 6 mm with radiation and
MICA 0.5 W/mK
Microtherm thickness 6 mm with radiation and
MICA 4 W/mK
395 C
364 C
40C
40C
12Comparing Demonstrator with Concept
Thermal Concept µSOFC
Demonstrator
- Difference of demonstrator to thermal concept
- - Channel height
- - Radiation in concept along channel not
considered - - Gas flow in the channels (Manufacturing)
- Conclusion
- Measurement correlates with simulation
(demonstrator) - Thermal conductivity of mica has influence on
stack temperature - Radiation along channel has strong influence on
stack temperature - ? Modification of concept needed
13Modification of Concept
MICA
Heat Exchanger Air
- Advantages
- Fabrication, mica no bonding needed
- Reduced thermal strain
- Reduced thermal radiation
- Disadvantages
- Heat exchanger performance lower
- Pressure drop higher
Stack
Fuel Supply
Temperature Distribution
550C
220C
40C
? First result, research going on
14New Power-Range
- Basic Scaling Properties (first design approach)
- Stack structure is modular
- Stacking of units is Milli-scopic
(conventional technology) - Thermal System not scalable Adaptation of
concept necessary - Thermal Management comparably simpler (surface to
power ratio) - Main Issues to be solved
- Adapted concepts of insulation for each power
range - Fabrication concept of modular system (planar
technology) - Layout and Manufacturing of gas and air
channels, electric connection
15Validation of Milestones and Deliverables
- WP 3.1 Thermal System Design
- Month 3 thermal insulation concept (Tinside
550C, Toutside 50C) (ZHW) - Month 12 system integration concept incl.
thermal management concept heat exchanger design
compatible with GPU designs and micro-fabrication
(ZHW)
?
? Specification to be revised
Deliverables Month 3 design from ZHW ?
NTB for fabrication
?
- WP 3.2 Fabrication Concept of Thermal System
- Month 6 test structures for validation of
critical points of the concept (T diff. 500C)
(NTB) - Month 12 thermal system design demonstrator with
simulated heat sources (dummy stack, reformer,
post-combustor) (NTB)
?
? Specification to be revised
Deliverables Month 6 first samples of
GPU from NTB ? LTNT for testing
?
16Summary
? Thermal Demonstrator shows 350 C with 2 W ?
Consistent between Simulation and Measurement ?
Modification and Adaptation of Thermal Concept ?
First Approach for New Power Ranges ? Revision of
Specification needed (Reformer) ? Initiation of
new Work Package System Development
17Next steps (Year 2)
Thermal Management
- WP 3.1
- Proof of modified Concept
- Concept adaptation to new power range
- Integration of reformer and PC into hot module
- WP 3.2
- Validation of adapted concept
System Development
- WP 4.1
- System Concept development
- WP 4.2
- Concept First order packaging
- Concept Second order packaging
18Next steps (Year 3 / 4)
Thermal Management
- WP 3.1
- Transient simulation of thermal system
- Analyze system design for thermal stress
- Increase the level of detail in the thermal mode
System Development
- WP 4.1
- System Control definition
- System Design development
- WP 4.2
- Manufacturing strategy development
- Build up a System Demonstrator
19Questions ?
Simulation validated with Thermal Demonstrator.
20Thermal Conductivity Mica
Measurement Setup
? (?Reference AReference lr (T3-T1))/(lm
ASample (T6-T4))
Measurement Result Modification of Setup needed
(Reference material)
Mica Literature Values Muskovit 0.25 0.75 W/mK
(Astrel Pfäffikon) 2.32 W/mK (Landolt-Börnstein,
Physikalische Eigenschaften der
Gesteine) Phlogopit approx. 1.7 W/mK (Astrel
Pfäffikon) Biotite 1.17 W/mK (Landolt-Börnstein,
Physikalische Eigenschaften der
Gesteine) Chlorite 5.14 W/mK (Landolt-Börnstein,
Physikalische Eigenschaften der
Gesteine) Talc 6.1 W/mK (Landolt-Börnstein,
Physikalische Eigenschaften der Gesteine)
21Next steps (Year 2)
- Thermal Management
- WP 3.1 Proof of modified Concept Analysis of
limitations, validation by measurement of test
structure, check influence of radiation - WP 3.1 Concept adaptation to new power range
Develop insulation strategies for new power
range based on the modified concept. Thermal
radiation shielding at cell level - WP 3.1 Integration of reformer and PC into hot
module Constructional constraints for
integration reformer and PC into adapted concept.
Minimal required volume of reformer (evaluated
by LTNT) - WP 3.2 Validation of adapted concept Build up
a test structure for concept validation of the
2.5 Watt system
- System Development
- WP 4.1 System Concept development Combine
reformer, pc and fuel cell to a module in the
limitation of thermal concept and regard to the
new power ranges (Specifications) - WP 4.2 First order packaging development Develop
concept of bonding-, el. contact-, gas
flow-strategies and process, modular (?) for
different power ranges based on the system
concept development (WP 4.1) - WP 4.2 Second order packaging development Merge
fuel cell module with insulation and all needed
components
22Next steps (Year 3 / Year 4)
- Thermal Management
- WP 3.1 Transient simulation of thermal system
Simulate the different system conditions, such
as startup, shutdown, standby e.g. in respect to
thermal issues - WP 3.1 Analyze system design for thermal
stress Identify thermal stresses, check the
mechanical stability of the design, explore
mechanical stability in transient phases. - WP 3.1 Increase the level of detail in the
thermal model Extend the simulated thermal
model to detail issues of the system design
- System Development
- WP 4.1 System Control definition Startup,
shutdown, standby, peak mode, normal mode - WP 4.1 System Design development Knowing
design limitation and performance of system,
components, packaging a detailed design are
developed - WP 4.3 Manufacturing strategy development
Development of process flow, decision on
technology, batch and or single processing in
respect of industrial mass production and
target costs
23Measured Temperature distribution
Aerogel 10 mm, Mica 70 µm
Microtherm 21 mm, Mica 50 µm
Microtherm 6 mm , Mica 50 µm
C
Heating Power 2 W
24Demonstrator with 2 W
23C
350C
57C
37C
38C
Microtherm 6 mm
285C
35C
36C